JP2015524358A5 - - Google Patents

Download PDF

Info

Publication number
JP2015524358A5
JP2015524358A5 JP2015525533A JP2015525533A JP2015524358A5 JP 2015524358 A5 JP2015524358 A5 JP 2015524358A5 JP 2015525533 A JP2015525533 A JP 2015525533A JP 2015525533 A JP2015525533 A JP 2015525533A JP 2015524358 A5 JP2015524358 A5 JP 2015524358A5
Authority
JP
Japan
Prior art keywords
polishing
main surface
diamond
abrasive
major surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015525533A
Other languages
English (en)
Japanese (ja)
Other versions
JP6715006B2 (ja
JP2015524358A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/052834 external-priority patent/WO2014022465A1/en
Publication of JP2015524358A publication Critical patent/JP2015524358A/ja
Publication of JP2015524358A5 publication Critical patent/JP2015524358A5/ja
Application granted granted Critical
Publication of JP6715006B2 publication Critical patent/JP6715006B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015525533A 2012-08-02 2013-07-31 精密に成形された構造部を有する研磨物品及びその作製方法 Active JP6715006B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261678666P 2012-08-02 2012-08-02
US61/678,666 2012-08-02
PCT/US2013/052834 WO2014022465A1 (en) 2012-08-02 2013-07-31 Abrasive articles with precisely shaped features and method of making thereof

Publications (3)

Publication Number Publication Date
JP2015524358A JP2015524358A (ja) 2015-08-24
JP2015524358A5 true JP2015524358A5 (cg-RX-API-DMAC7.html) 2016-09-23
JP6715006B2 JP6715006B2 (ja) 2020-07-01

Family

ID=50028491

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015525533A Active JP6715006B2 (ja) 2012-08-02 2013-07-31 精密に成形された構造部を有する研磨物品及びその作製方法

Country Status (8)

Country Link
US (2) US10710211B2 (cg-RX-API-DMAC7.html)
EP (1) EP2879838B1 (cg-RX-API-DMAC7.html)
JP (1) JP6715006B2 (cg-RX-API-DMAC7.html)
KR (1) KR102089383B1 (cg-RX-API-DMAC7.html)
CN (1) CN104736299A (cg-RX-API-DMAC7.html)
SG (1) SG11201500802TA (cg-RX-API-DMAC7.html)
TW (1) TWI695756B (cg-RX-API-DMAC7.html)
WO (1) WO2014022465A1 (cg-RX-API-DMAC7.html)

Families Citing this family (63)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2658680B1 (en) 2010-12-31 2020-12-09 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles comprising abrasive particles having particular shapes and methods of forming such articles
CN108262695A (zh) 2011-06-30 2018-07-10 圣戈本陶瓷及塑料股份有限公司 包括氮化硅磨粒的磨料制品
US8840694B2 (en) 2011-06-30 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Liquid phase sintered silicon carbide abrasive particles
US9517546B2 (en) 2011-09-26 2016-12-13 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particulate materials, coated abrasives using the abrasive particulate materials and methods of forming
CN109054745A (zh) 2011-12-30 2018-12-21 圣戈本陶瓷及塑料股份有限公司 成形磨粒及其形成方法
CN104114327B (zh) 2011-12-30 2018-06-05 圣戈本陶瓷及塑料股份有限公司 复合成型研磨颗粒及其形成方法
RU2602581C2 (ru) 2012-01-10 2016-11-20 Сэнт - Гобэйн Керамикс Энд Пластик,Инк. Абразивные частицы, имеющие сложные формы, и способы их формования
US8840696B2 (en) 2012-01-10 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
WO2013149209A1 (en) 2012-03-30 2013-10-03 Saint-Gobain Abrasives, Inc. Abrasive products having fibrillated fibers
BR112014029317B1 (pt) 2012-05-23 2022-05-31 Saint-Gobain Ceramics & Plastics, Inc Partículas abrasivas moldadas e métodos de formação das mesmas
KR20150023034A (ko) 2012-06-29 2015-03-04 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 특정 형상을 가지는 연마입자들 및 이러한 입자들 형성방법
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
CN108015685B (zh) 2012-10-15 2020-07-14 圣戈班磨料磨具有限公司 具有特定形状的磨粒
EP2938459B1 (en) 2012-12-31 2021-06-16 Saint-Gobain Ceramics & Plastics, Inc. Particulate materials and methods of forming same
WO2014161001A1 (en) 2013-03-29 2014-10-02 Saint-Gobain Abrasives, Inc. Abrasive particles having particular shapes and methods of forming such particles
TW201502263A (zh) 2013-06-28 2015-01-16 Saint Gobain Ceramics 包含成形研磨粒子之研磨物品
MX2016004000A (es) 2013-09-30 2016-06-02 Saint Gobain Ceramics Particulas abrasivas moldeadas y metodos para formación de ellas.
JP6290428B2 (ja) 2013-12-31 2018-03-07 サンーゴバン アブレイシブズ,インコーポレイティド 成形研磨粒子を含む研磨物品
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
JP6484647B2 (ja) 2014-04-14 2019-03-13 サン−ゴバン セラミックス アンド プラスティクス,インコーポレイティド 成形研磨粒子を含む研磨物品
WO2015160854A1 (en) 2014-04-14 2015-10-22 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US9902045B2 (en) 2014-05-30 2018-02-27 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
TW201600242A (zh) * 2014-06-18 2016-01-01 Kinik Co 拋光墊修整器
US20160144477A1 (en) * 2014-11-21 2016-05-26 Diane Scott Coated compressive subpad for chemical mechanical polishing
US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
US9676981B2 (en) 2014-12-24 2017-06-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle fractions and method of forming same
JP6453666B2 (ja) * 2015-02-20 2019-01-16 東芝メモリ株式会社 研磨パッドドレッサの作製方法
US10196551B2 (en) 2015-03-31 2019-02-05 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
CN115781499A (zh) 2015-06-11 2023-03-14 圣戈本陶瓷及塑料股份有限公司 包括经成形研磨颗粒的研磨制品
AT517693B1 (de) * 2015-11-11 2017-04-15 Zkw Group Gmbh Konverter für Leuchtvorrichtungen
KR102313436B1 (ko) 2016-05-10 2021-10-19 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 연마 입자들 및 그 형성 방법
PL3455321T3 (pl) 2016-05-10 2022-12-12 Saint-Gobain Ceramics&Plastics, Inc. Sposób formowania cząstek ściernych
TWI621502B (zh) * 2016-08-18 2018-04-21 中國砂輪企業股份有限公司 Double chemical mechanical polishing trimming system and method thereof
WO2018064642A1 (en) 2016-09-29 2018-04-05 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
US20190337119A1 (en) * 2016-12-21 2019-11-07 3M Innovative Properties Company Pad conditioner with spacer and wafer planarization system
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
CN106938408A (zh) * 2017-03-24 2017-07-11 苏州国量量具科技有限公司 量块的生产方法
CN106956170A (zh) * 2017-03-24 2017-07-18 苏州国量量具科技有限公司 量块的加工方法
CN110719946B (zh) 2017-06-21 2022-07-15 圣戈本陶瓷及塑料股份有限公司 颗粒材料及其形成方法
JP7198801B2 (ja) 2017-07-11 2023-01-04 スリーエム イノベイティブ プロパティズ カンパニー 適合性コーティングを含む研磨物品及びそれによる研磨システム
CN114633207A (zh) * 2017-11-03 2022-06-17 绍兴自远磨具有限公司 一种钻石减薄垫及其制造方法
US20190351527A1 (en) * 2018-05-17 2019-11-21 Entegris, Inc. Conditioner for chemical-mechanical-planarization pad and related methods
CN113439010B (zh) 2019-02-13 2024-08-27 3M创新有限公司 具有精确成形特征部的磨料元件、用其制成的磨料制品及其制造方法
KR102304965B1 (ko) * 2019-10-30 2021-09-24 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법, 및 이를 이용한 반도체 소자의 제조방법
WO2021133901A1 (en) 2019-12-27 2021-07-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
US12338384B2 (en) 2019-12-27 2025-06-24 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles and methods of forming same
EP4081609A4 (en) 2019-12-27 2024-06-05 Saint-Gobain Ceramics & Plastics Inc. Abrasive articles and methods of forming same
KR102843434B1 (ko) * 2020-01-06 2025-08-08 생-고뱅 어브레이시브즈, 인코포레이티드 연마 용품 및 사용 방법
US11759909B2 (en) * 2020-06-19 2023-09-19 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US12138738B2 (en) 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
KR102237326B1 (ko) * 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
KR102237311B1 (ko) * 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
KR102237321B1 (ko) * 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
KR102237316B1 (ko) * 2020-06-19 2021-04-07 에스케이씨솔믹스 주식회사 연마패드, 이의 제조방법 및 이를 이용한 반도체 소자의 제조방법
US20230094483A1 (en) * 2021-09-29 2023-03-30 Entegris, Inc. Pad conditioner with polymer backing plate
WO2023055649A1 (en) * 2021-09-29 2023-04-06 Entegris, Inc. Double-sided pad conditioner
US12496686B2 (en) 2021-12-30 2025-12-16 Saint-Gobain Abrasives, Inc. Abrasive articles and methods of forming same
EP4457056A1 (en) 2021-12-30 2024-11-06 Saint-gobain Abrasives, Inc Abrasive articles and methods of forming same
CN116619246B (zh) * 2023-07-24 2023-11-10 北京寰宇晶科科技有限公司 一种具有金刚石柱状晶簇的cmp抛光垫修整器及其制备方法
US20250347473A1 (en) * 2024-05-10 2025-11-13 RedoxBlox, Inc. Energy storage articles and methods for making and using the same

Family Cites Families (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2152392A (en) * 1937-01-26 1939-03-28 Carborundum Co Abrasive article and method of manufacturing the same
KR910002578B1 (ko) * 1988-01-19 1991-04-27 닙폰 가이시 카부시키카이샤 고밀도 SiC 소결체의 제조방법
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
US5197249A (en) * 1991-02-07 1993-03-30 Wiand Ronald C Diamond tool with non-abrasive segments
JP2642573B2 (ja) * 1991-12-27 1997-08-20 日本碍子株式会社 SiC質焼結体
US5435816A (en) 1993-01-14 1995-07-25 Minnesota Mining And Manufacturing Company Method of making an abrasive article
CN1067315C (zh) 1993-09-13 2001-06-20 美国3M公司 磨料制品、其制法及用法
US5453312A (en) * 1993-10-29 1995-09-26 Minnesota Mining And Manufacturing Company Abrasive article, a process for its manufacture, and a method of using it to reduce a workpiece surface
JP3261687B2 (ja) 1994-06-09 2002-03-04 日本電信電話株式会社 パッドコンディショナー及びその製造方法
JP2974047B2 (ja) * 1995-03-15 1999-11-08 三和研磨工業株式会社 円形取付部を備えた砥石チップ嵌込式研磨板
US5692950A (en) 1996-08-08 1997-12-02 Minnesota Mining And Manufacturing Company Abrasive construction for semiconductor wafer modification
US6021559A (en) 1996-11-01 2000-02-08 3M Innovative Properties Company Methods of making a cube corner article master mold
US6368198B1 (en) 1999-11-22 2002-04-09 Kinik Company Diamond grid CMP pad dresser
US6214078B1 (en) 1997-11-25 2001-04-10 Ferro Corporation High temperature ceramic filter
US6364749B1 (en) 1999-09-02 2002-04-02 Micron Technology, Inc. CMP polishing pad with hydrophilic surfaces for enhanced wetting
US6439986B1 (en) * 1999-10-12 2002-08-27 Hunatech Co., Ltd. Conditioner for polishing pad and method for manufacturing the same
KR100387954B1 (ko) * 1999-10-12 2003-06-19 (주) 휴네텍 연마패드용 컨디셔너와 이의 제조방법
US8062098B2 (en) * 2000-11-17 2011-11-22 Duescher Wayne O High speed flat lapping platen
US6632127B1 (en) 2001-03-07 2003-10-14 Jerry W. Zimmer Fixed abrasive planarization pad conditioner incorporating chemical vapor deposited polycrystalline diamond and method for making same
JP2003103464A (ja) 2001-09-28 2003-04-08 Mitsubishi Materials Corp ダイヤモンドコーティングドレッサー
US6642127B2 (en) 2001-10-19 2003-11-04 Applied Materials, Inc. Method for dicing a semiconductor wafer
US20030109204A1 (en) 2001-12-06 2003-06-12 Kinik Company Fixed abrasive CMP pad dresser and associated methods
JP2004001152A (ja) 2002-06-03 2004-01-08 Tokyo Seimitsu Co Ltd ドレッサ、ドレッシング方法、研磨装置、及び研磨方法
JP4216025B2 (ja) * 2002-09-09 2009-01-28 株式会社リード 研磨布用ドレッサー及びそれを用いた研磨布のドレッシング方法
KR20050092743A (ko) 2003-01-15 2005-09-22 미츠비시 마테리알 가부시키가이샤 연질재 가공용 절삭 공구
US7089081B2 (en) 2003-01-31 2006-08-08 3M Innovative Properties Company Modeling an abrasive process to achieve controlled material removal
US20050025973A1 (en) 2003-07-25 2005-02-03 Slutz David E. CVD diamond-coated composite substrate containing a carbide-forming material and ceramic phases and method for making same
US7066795B2 (en) * 2004-10-12 2006-06-27 Applied Materials, Inc. Polishing pad conditioner with shaped abrasive patterns and channels
US8622787B2 (en) 2006-11-16 2014-01-07 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US8393934B2 (en) 2006-11-16 2013-03-12 Chien-Min Sung CMP pad dressers with hybridized abrasive surface and related methods
US9138862B2 (en) * 2011-05-23 2015-09-22 Chien-Min Sung CMP pad dresser having leveled tips and associated methods
US8398466B2 (en) 2006-11-16 2013-03-19 Chien-Min Sung CMP pad conditioners with mosaic abrasive segments and associated methods
TWI406736B (zh) * 2005-08-25 2013-09-01 Hiroshi Ishizuka 具有燒結體研磨部位之工具及其製造方法
TW200726582A (en) 2005-10-04 2007-07-16 Mitsubishi Materials Corp Rotary tool for processing flexible materials
JP4624293B2 (ja) * 2006-03-31 2011-02-02 株式会社ノリタケスーパーアブレーシブ Cmpパッドコンディショナー
US7410413B2 (en) * 2006-04-27 2008-08-12 3M Innovative Properties Company Structured abrasive article and method of making and using the same
US20080153398A1 (en) 2006-11-16 2008-06-26 Chien-Min Sung Cmp pad conditioners and associated methods
US8083820B2 (en) * 2006-12-22 2011-12-27 3M Innovative Properties Company Structured fixed abrasive articles including surface treated nano-ceria filler, and method for making and using the same
US7993185B2 (en) * 2007-01-17 2011-08-09 Russell Gelfuso Device for smoothing the surfaces of hard or soft materials
US8323072B1 (en) * 2007-03-21 2012-12-04 3M Innovative Properties Company Method of polishing transparent armor
US20080233845A1 (en) * 2007-03-21 2008-09-25 3M Innovative Properties Company Abrasive articles, rotationally reciprocating tools, and methods
KR20090013369A (ko) 2007-08-01 2009-02-05 주식회사 세라코리 연마입자 탈락이 방지되는 연마재
CN101878094A (zh) 2007-09-28 2010-11-03 宋健民 具有镶嵌研磨块的cmp衬垫修整器和相关方法
CN101903131B (zh) 2007-11-13 2013-01-02 宋健民 Cmp垫修整器
US20090123795A1 (en) 2007-11-13 2009-05-14 Chuah P E Christopher J Condensate drainage subsystem for an electrochemical cell system
US8382557B2 (en) 2007-11-14 2013-02-26 Saint-Gobain Abrasives, Inc. Chemical mechanical planarization pad conditioner and methods of forming thereof
US8080073B2 (en) 2007-12-20 2011-12-20 3M Innovative Properties Company Abrasive article having a plurality of precisely-shaped abrasive composites
JP5597140B2 (ja) * 2007-12-31 2014-10-01 スリーエム イノベイティブ プロパティズ カンパニー プラズマ処理された研磨物品及び同物品の作製方法
JP2011514848A (ja) 2008-03-10 2011-05-12 モルガン アドバンスド セラミックス, インコーポレイテッド 非平面のcvdダイヤモンド被覆cmpパッドコンディショナーおよびその製造方法
KR100887979B1 (ko) 2008-03-28 2009-03-09 주식회사 세라코리 연마패드용 컨디셔닝 디스크
JP2010047691A (ja) * 2008-08-21 2010-03-04 Amical:Kk 着色ゴムチップ及び着色ゴムチップの製造方法
KR101020870B1 (ko) 2008-09-22 2011-03-09 프리시젼다이아몬드 주식회사 다이아몬드 막이 코팅된 cmp 컨디셔너 및 그 제조방법
PT2174751E (pt) 2008-10-10 2014-08-06 Ct For Abrasives & Refractories Res & Dev Carrd Gmbh Aglomerados de grãos abrasivos, processo para a sua preparação, bem como a sua utilização para a preparação de agentes abrasivos
JP2010125567A (ja) 2008-11-28 2010-06-10 Mitsubishi Materials Corp Cmpパッドコンディショナー
WO2010063647A1 (en) * 2008-12-03 2010-06-10 Struers A/S Abrasive disc
EP2370232B1 (en) 2008-12-17 2015-04-08 3M Innovative Properties Company Shaped abrasive particles with grooves
CN102341215B (zh) * 2009-03-24 2014-06-18 圣戈班磨料磨具有限公司 用作化学机械平坦化垫修整器的研磨工具
JP2010221386A (ja) 2009-03-25 2010-10-07 Mitsubishi Materials Corp 基材被覆膜、基材被覆膜の製造方法およびcmpパッドコンディショナー
US8801497B2 (en) * 2009-04-30 2014-08-12 Rdc Holdings, Llc Array of abrasive members with resilient support
JP5422262B2 (ja) * 2009-06-01 2014-02-19 ニッタ・ハース株式会社 研磨パッドのコンディショナー
SG176629A1 (en) 2009-06-02 2012-01-30 Saint Gobain Abrasives Inc Corrosion-resistant cmp conditioning tools and methods for making and using same
EP2474025A2 (en) 2009-09-01 2012-07-11 Saint-Gobain Abrasives, Inc. Chemical mechanical polishing conditioner
JP2011161584A (ja) 2010-02-12 2011-08-25 Shingijutsu Kaihatsu Kk 研磨工具
KR101091030B1 (ko) 2010-04-08 2011-12-09 이화다이아몬드공업 주식회사 감소된 마찰력을 갖는 패드 컨디셔너 제조방법
US20120171935A1 (en) 2010-12-20 2012-07-05 Diamond Innovations, Inc. CMP PAD Conditioning Tool
SG193340A1 (en) * 2011-03-07 2013-10-30 Entegris Inc Chemical mechanical planarization pad conditioner
US20130065490A1 (en) * 2011-09-12 2013-03-14 3M Innovative Properties Company Method of refurbishing vinyl composition tile
RU2602581C2 (ru) * 2012-01-10 2016-11-20 Сэнт - Гобэйн Керамикс Энд Пластик,Инк. Абразивные частицы, имеющие сложные формы, и способы их формования
TW201350267A (zh) * 2012-05-04 2013-12-16 Saint Gobain Abrasives Inc 用於同雙側化學機械平坦化墊修整器一起使用之工具
US20150224625A1 (en) 2012-08-02 2015-08-13 3M Innovative Properties Company Abrasive Elements with Precisely Shaped Features, Abrasive Articles Fabricated Therefrom and Methods of Making Thereof
CN108177094B (zh) 2012-08-02 2021-01-15 3M创新有限公司 具有精确成形特征部的研磨元件前体及其制造方法
TWI530361B (zh) * 2012-11-07 2016-04-21 中國砂輪企業股份有限公司 化學機械研磨修整器及其製法
TWI511841B (zh) * 2013-03-15 2015-12-11 Kinik Co 貼合式化學機械硏磨修整器及其製法
CN203390712U (zh) * 2013-04-08 2014-01-15 宋健民 化学机械研磨修整器
TWI546159B (zh) * 2014-04-11 2016-08-21 中國砂輪企業股份有限公司 可控制研磨深度之化學機械研磨修整器
TWI616278B (zh) * 2015-02-16 2018-03-01 China Grinding Wheel Corp 化學機械研磨修整器

Similar Documents

Publication Publication Date Title
JP2015524358A5 (cg-RX-API-DMAC7.html)
JP2015530265A5 (cg-RX-API-DMAC7.html)
JP2016538139A5 (cg-RX-API-DMAC7.html)
EA201890835A1 (ru) Термическое напыление керамических материалов
WO2012122186A3 (en) Chemical mechanical planarization pad conditioner
JP2014508652A5 (cg-RX-API-DMAC7.html)
PH12014000029A1 (en) Polishing apparatus, and method for polishing and manufacturing glass substrate
JP2013521144A5 (cg-RX-API-DMAC7.html)
EP3338306A4 (en) SILICON CARBIDE / GRAPHITE COMPOSITE AND ARTICLES AND ARRANGEMENTS MADE THEREFROM
IN2015DN03023A (cg-RX-API-DMAC7.html)
WO2012121946A3 (en) Methods of forming polycrystalline tables and polycrystalline elements and related structures
WO2012162430A3 (en) Cmp pad dresser having leveled tips and associated methods
EP3349237A4 (en) PROCESS FOR PREPARING AN SIC COMPOSITE SUBSTRATE AND METHOD FOR PRODUCING A SEMICONDUCTOR SUBSTRATE
PH12012000019A1 (en) Method of manufacturing a glass substrate for a magnetic disk and method of manufacturing a magnetic disk
MX2021007414A (es) Relleno para asegurar la orientacion de estructuras abrasivas.
BR112017014170A2 (pt) agregados de diamante com aglutinante vitrificado
EP2921575A4 (en) SILICON CARBIDE SINGLE CRYSTAL SUBSTRATE AND METHOD FOR THE PRODUCTION THEREOF
GB201814192D0 (en) A semiconductor on diamond substrate, percursor for use in preparing a semiconductor on diamond substrate, and methods of making the same
MY195662A (en) Method for Manufacturing Magnetic-Disk Substrate, and Polishing Pad
PH12012000070A1 (en) Method of manufacturing glass substrate for magnetic disk
TWM475334U (en) Polishing pad
CN105686596A (zh) 一种复合缓冲防滑垫
WO2015091682A3 (en) Super hard constructions & methods of making same
JP2016204187A5 (cg-RX-API-DMAC7.html)
WO2013003814A3 (en) An abrasive aggregate including silicon carbide and a method of making same