JP2015516667A - セラミックヒータ用熱線配置構造 - Google Patents
セラミックヒータ用熱線配置構造 Download PDFInfo
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- JP2015516667A JP2015516667A JP2015512570A JP2015512570A JP2015516667A JP 2015516667 A JP2015516667 A JP 2015516667A JP 2015512570 A JP2015512570 A JP 2015512570A JP 2015512570 A JP2015512570 A JP 2015512570A JP 2015516667 A JP2015516667 A JP 2015516667A
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- Prior art keywords
- arrangement structure
- hot wire
- ceramic substrate
- wire
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000919 ceramic Substances 0.000 title claims abstract description 103
- 239000000758 substrate Substances 0.000 claims abstract description 63
- 239000007769 metal material Substances 0.000 claims abstract description 5
- 238000005452 bending Methods 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 8
- 239000002184 metal Substances 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 5
- 230000020169 heat generation Effects 0.000 abstract description 10
- 230000005611 electricity Effects 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 7
- 230000003068 static effect Effects 0.000 description 6
- 239000002994 raw material Substances 0.000 description 5
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 4
- 229910052750 molybdenum Inorganic materials 0.000 description 4
- 239000011733 molybdenum Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
- H05B3/22—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible
- H05B3/28—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material
- H05B3/283—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater non-flexible heating conductor embedded in insulating material the insulating material being an inorganic material, e.g. ceramic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
- H05B3/54—Heating elements having the shape of rods or tubes flexible
- H05B3/56—Heating cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/12—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material
- H05B3/14—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor characterised by the composition or nature of the conductive material the material being non-metallic
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/16—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being mounted on an insulating base
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B2203/00—Aspects relating to Ohmic resistive heating covered by group H05B3/00
- H05B2203/014—Heaters using resistive wires or cables not provided for in H05B3/54
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor
- H05B3/18—Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor the conductor being embedded in an insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/68—Heating arrangements specially adapted for cooking plates or analogous hot-plates
- H05B3/74—Non-metallic plates, e.g. vitroceramic, ceramic or glassceramic hobs, also including power or control circuits
- H05B3/748—Resistive heating elements, i.e. heating elements exposed to the air, e.g. coil wire heater
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Resistance Heating (AREA)
- Surface Heating Bodies (AREA)
Abstract
Description
Claims (9)
- セラミックヒータのセラミック基板内部に配線されて熱を発散させる熱線の配置構造であり、
長手方向に長く延長された金属材質のワイヤ部材であり、前記セラミック基板の上面と実質的に平行な仮想の二次元平面上に、二次元的に配線されている熱線を含むことを特徴とするセラミックヒータ用熱線配置構造。 - 前記熱線は、
互いに対向した状態で互い違いに2列に配置された複数個の湾曲部と、
前記湾曲部を連結する複数個の連結部と、を含み、
前記湾曲部及び前記連結部によって、ジグザグ状に蛇行するように形成されていることを特徴とする請求項1に記載のセラミックヒータ用熱線配置構造。 - 前記熱線のピッチは、配線位置によって異なる値を有することを特徴とする請求項2に記載のセラミックヒータ用熱線配置構造。
- 前記熱線の振幅は、配線された位置によって異なる値を有することを特徴とする請求項2に記載のセラミックヒータ用熱線配置構造。
- 前記セラミック基板は、円形平板であり、
前記熱線は、前記セラミック基板の中心を円の中心とする複数個の同心円上に配置されていることを特徴とする請求項1に記載のセラミックヒータ用熱線配置構造。 - 前記熱線の振幅及びピッチは、前記セラミック基板の中心から半径方向に離隔された位置によって、異なる値を有することを特徴とする請求項5に記載のセラミックヒータ用熱線配置構造。
- 前記熱線の両端は、前記セラミック基板の下面に付着される中空型シャフトの中空と連通する位置に配線されていることを特徴とする請求項1に記載のセラミックヒータ用熱線配置構造。
- 前記熱線は、互いに平行な二次元平面上に複層構造に配線されていることを特徴とする請求項1に記載のセラミックヒータ用熱線配置構造。
- 前記熱線は、前記セラミック基板の熱膨張係数から、±3.0×10−6[K−1]の誤差範囲内にある熱膨張係数を有した金属部材であることを特徴とする請求項1に記載のセラミックヒータ用熱線配置構造。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2012-0053160 | 2012-05-18 | ||
KR1020120053160A KR101343556B1 (ko) | 2012-05-18 | 2012-05-18 | 2차원적으로 배선된 열선을 포함하는 세라믹 히터 |
PCT/KR2013/004120 WO2013172596A1 (ko) | 2012-05-18 | 2013-05-10 | 세라믹 히터용 열선 배치 구조 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015516667A true JP2015516667A (ja) | 2015-06-11 |
JP6018296B2 JP6018296B2 (ja) | 2016-11-02 |
Family
ID=49583958
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015512570A Active JP6018296B2 (ja) | 2012-05-18 | 2013-05-10 | セラミックヒータ用熱線配置構造 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10004113B2 (ja) |
EP (1) | EP2852247B1 (ja) |
JP (1) | JP6018296B2 (ja) |
KR (1) | KR101343556B1 (ja) |
CN (1) | CN104472010B (ja) |
WO (1) | WO2013172596A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018005999A (ja) * | 2016-06-27 | 2018-01-11 | 日本特殊陶業株式会社 | セラミックスヒータ |
JP2019192593A (ja) * | 2018-04-27 | 2019-10-31 | 京セラ株式会社 | ヒータ及びその製造方法 |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101581920B1 (ko) | 2014-09-03 | 2015-12-31 | 주식회사 케이에스엠컴포넌트 | 세라믹 히터 및 세라믹 히터 제조 방법 |
US9888528B2 (en) * | 2014-12-31 | 2018-02-06 | Applied Materials, Inc. | Substrate support with multiple heating zones |
CN107708234B (zh) * | 2017-10-25 | 2020-07-03 | 厦门宝益科技有限公司 | 一种柔性电热板及其制备方法 |
US11330673B2 (en) | 2017-11-20 | 2022-05-10 | Applied Materials, Inc. | Heated substrate support |
JP2022510260A (ja) * | 2018-11-30 | 2022-01-26 | ラム リサーチ コーポレーション | 強化された熱均一性のための多層ヒータを備えたセラミック台座 |
CN111698799A (zh) * | 2020-05-14 | 2020-09-22 | 佛山市也牛科技有限公司 | 烹饪用非金属发热盘及其制备方法和加热装置 |
US20220018135A1 (en) * | 2020-07-16 | 2022-01-20 | Clear Industries | Ice melting assembly |
CN116113084B (zh) * | 2023-04-07 | 2023-06-06 | 无锡卓瓷科技有限公司 | 一种陶瓷加热盘 |
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JP2002231421A (ja) * | 2000-04-07 | 2002-08-16 | Ibiden Co Ltd | セラミックヒータ |
JP2002319474A (ja) * | 2001-04-20 | 2002-10-31 | Ibiden Co Ltd | ホットプレートユニット |
JP2003007432A (ja) * | 2001-06-21 | 2003-01-10 | Nhk Spring Co Ltd | セラミックスヒータ |
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JP2006127883A (ja) * | 2004-10-28 | 2006-05-18 | Kyocera Corp | ヒータ及びウェハ加熱装置 |
US7098428B1 (en) * | 2004-02-04 | 2006-08-29 | Brent Elliot | System and method for an improved susceptor |
JP2008270198A (ja) * | 2007-03-26 | 2008-11-06 | Ngk Insulators Ltd | 加熱装置 |
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JP3381909B2 (ja) | 1999-08-10 | 2003-03-04 | イビデン株式会社 | 半導体製造・検査装置用セラミックヒータ |
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JP4761723B2 (ja) * | 2004-04-12 | 2011-08-31 | 日本碍子株式会社 | 基板加熱装置 |
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-
2012
- 2012-05-18 KR KR1020120053160A patent/KR101343556B1/ko active IP Right Grant
-
2013
- 2013-05-10 EP EP13790758.0A patent/EP2852247B1/en active Active
- 2013-05-10 US US14/401,762 patent/US10004113B2/en active Active
- 2013-05-10 JP JP2015512570A patent/JP6018296B2/ja active Active
- 2013-05-10 CN CN201380038256.5A patent/CN104472010B/zh active Active
- 2013-05-10 WO PCT/KR2013/004120 patent/WO2013172596A1/ko active Application Filing
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JP2002509989A (ja) * | 1998-03-27 | 2002-04-02 | アプライド マテリアルズ インコーポレイテッド | 高周波能力を有する高温セラミックヒータ組立体 |
JP2003234165A (ja) * | 1999-08-10 | 2003-08-22 | Ibiden Co Ltd | セラミックヒータ |
JP2002231421A (ja) * | 2000-04-07 | 2002-08-16 | Ibiden Co Ltd | セラミックヒータ |
JP2002319474A (ja) * | 2001-04-20 | 2002-10-31 | Ibiden Co Ltd | ホットプレートユニット |
JP2003007432A (ja) * | 2001-06-21 | 2003-01-10 | Nhk Spring Co Ltd | セラミックスヒータ |
US7098428B1 (en) * | 2004-02-04 | 2006-08-29 | Brent Elliot | System and method for an improved susceptor |
JP2006127883A (ja) * | 2004-10-28 | 2006-05-18 | Kyocera Corp | ヒータ及びウェハ加熱装置 |
JP2008270198A (ja) * | 2007-03-26 | 2008-11-06 | Ngk Insulators Ltd | 加熱装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2018005999A (ja) * | 2016-06-27 | 2018-01-11 | 日本特殊陶業株式会社 | セラミックスヒータ |
JP2019192593A (ja) * | 2018-04-27 | 2019-10-31 | 京セラ株式会社 | ヒータ及びその製造方法 |
JP7001535B2 (ja) | 2018-04-27 | 2022-01-19 | 京セラ株式会社 | ヒータ及びその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP2852247A1 (en) | 2015-03-25 |
CN104472010A (zh) | 2015-03-25 |
WO2013172596A1 (ko) | 2013-11-21 |
EP2852247B1 (en) | 2020-08-05 |
KR101343556B1 (ko) | 2013-12-19 |
KR20130128939A (ko) | 2013-11-27 |
US10004113B2 (en) | 2018-06-19 |
CN104472010B (zh) | 2017-05-31 |
US20150173127A1 (en) | 2015-06-18 |
EP2852247A4 (en) | 2016-01-20 |
JP6018296B2 (ja) | 2016-11-02 |
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Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
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R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |