JP2015511063A5 - - Google Patents

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Publication number
JP2015511063A5
JP2015511063A5 JP2014559984A JP2014559984A JP2015511063A5 JP 2015511063 A5 JP2015511063 A5 JP 2015511063A5 JP 2014559984 A JP2014559984 A JP 2014559984A JP 2014559984 A JP2014559984 A JP 2014559984A JP 2015511063 A5 JP2015511063 A5 JP 2015511063A5
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JP
Japan
Prior art keywords
material layer
glass material
glass
bonding
cells
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014559984A
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English (en)
Japanese (ja)
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JP2015511063A (ja
JP6128566B2 (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/US2013/027977 external-priority patent/WO2013130572A1/en
Publication of JP2015511063A publication Critical patent/JP2015511063A/ja
Publication of JP2015511063A5 publication Critical patent/JP2015511063A5/ja
Application granted granted Critical
Publication of JP6128566B2 publication Critical patent/JP6128566B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014559984A 2012-02-29 2013-02-27 材料層を互いに接合する方法および生じるデバイス Expired - Fee Related JP6128566B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261604747P 2012-02-29 2012-02-29
US61/604,747 2012-02-29
PCT/US2013/027977 WO2013130572A1 (en) 2012-02-29 2013-02-27 Methods for bonding material layers to one another and resulting device

Publications (3)

Publication Number Publication Date
JP2015511063A JP2015511063A (ja) 2015-04-13
JP2015511063A5 true JP2015511063A5 (https=) 2016-06-09
JP6128566B2 JP6128566B2 (ja) 2017-05-17

Family

ID=47884547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014559984A Expired - Fee Related JP6128566B2 (ja) 2012-02-29 2013-02-27 材料層を互いに接合する方法および生じるデバイス

Country Status (5)

Country Link
US (1) US8895362B2 (https=)
JP (1) JP6128566B2 (https=)
KR (1) KR102229605B1 (https=)
CN (1) CN105452154B (https=)
WO (1) WO2013130572A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE537869C2 (sv) * 2012-11-01 2015-11-03 Silex Microsystems Ab Substratgenomgående vior
CN105161515B (zh) * 2015-08-11 2018-03-23 京东方科技集团股份有限公司 有机发光二极管显示面板及其封装方法、显示装置
JP7538108B2 (ja) * 2018-08-07 2024-08-21 コーニング インコーポレイテッド 気密封止パッケージ
KR20230058680A (ko) * 2020-09-02 2023-05-03 코닝 인코포레이티드 유리 패키지 및 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
AUPQ090299A0 (en) 1999-06-10 1999-07-01 University Of Sydney, The Glass panel
US6537892B2 (en) 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7387838B2 (en) * 2004-05-27 2008-06-17 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US7569926B2 (en) 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
FR2905690B1 (fr) 2006-09-12 2008-10-17 Saint Gobain Procede de fabrication d'un dispositif microfluidique.
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP4938478B2 (ja) * 2007-01-31 2012-05-23 京セラキンセキ株式会社 圧電振動子
US7927906B2 (en) 2008-02-04 2011-04-19 Honeywell International Inc. Method for MEMS threshold sensor packaging
JP2009267049A (ja) * 2008-04-24 2009-11-12 Olympus Corp 光学装置および光学装置の製造方法
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
KR20120048528A (ko) 2009-07-23 2012-05-15 아사히 가라스 가부시키가이샤 봉착 재료층이 부착된 유리 부재의 제조 방법 및 제조 장치, 그리고 전자 디바이스의 제조 방법
CN102130026B (zh) 2010-12-23 2012-06-27 中国科学院半导体研究所 基于金锡合金键合的圆片级低温封装方法

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