CN105452154B - 将材料层相互粘结到一起的方法以及所得到的装置 - Google Patents

将材料层相互粘结到一起的方法以及所得到的装置 Download PDF

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Publication number
CN105452154B
CN105452154B CN201380011510.2A CN201380011510A CN105452154B CN 105452154 B CN105452154 B CN 105452154B CN 201380011510 A CN201380011510 A CN 201380011510A CN 105452154 B CN105452154 B CN 105452154B
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CN
China
Prior art keywords
bonding
glass
layer
glass material
layers
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201380011510.2A
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English (en)
Chinese (zh)
Other versions
CN105452154A (zh
Inventor
J·G·库亚德
C·P·戴格勒
冯江蔚
Y·孙
田丽莉
I·D·特雷西
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of CN105452154A publication Critical patent/CN105452154A/zh
Application granted granted Critical
Publication of CN105452154B publication Critical patent/CN105452154B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
CN201380011510.2A 2012-02-29 2013-02-27 将材料层相互粘结到一起的方法以及所得到的装置 Expired - Fee Related CN105452154B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261604747P 2012-02-29 2012-02-29
US61/604,747 2012-02-29
PCT/US2013/027977 WO2013130572A1 (en) 2012-02-29 2013-02-27 Methods for bonding material layers to one another and resulting device

Publications (2)

Publication Number Publication Date
CN105452154A CN105452154A (zh) 2016-03-30
CN105452154B true CN105452154B (zh) 2017-07-18

Family

ID=47884547

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201380011510.2A Expired - Fee Related CN105452154B (zh) 2012-02-29 2013-02-27 将材料层相互粘结到一起的方法以及所得到的装置

Country Status (5)

Country Link
US (1) US8895362B2 (https=)
JP (1) JP6128566B2 (https=)
KR (1) KR102229605B1 (https=)
CN (1) CN105452154B (https=)
WO (1) WO2013130572A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE537869C2 (sv) * 2012-11-01 2015-11-03 Silex Microsystems Ab Substratgenomgående vior
CN105161515B (zh) * 2015-08-11 2018-03-23 京东方科技集团股份有限公司 有机发光二极管显示面板及其封装方法、显示装置
JP7538108B2 (ja) * 2018-08-07 2024-08-21 コーニング インコーポレイテッド 気密封止パッケージ
KR20230058680A (ko) * 2020-09-02 2023-05-03 코닝 인코포레이티드 유리 패키지 및 제조 방법

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050266252A1 (en) * 2004-05-27 2005-12-01 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
CN101522556A (zh) * 2006-09-12 2009-09-02 法国圣-戈班玻璃公司 制造微流体器件的方法
US20110073880A1 (en) * 2007-01-05 2011-03-31 Samsung Mobile Display Co., Ltd. Glass plate with glass frit structure
CN102066280A (zh) * 2009-07-23 2011-05-18 旭硝子株式会社 带密封材料层的玻璃构件的制造方法及制造装置以及电子器件的制造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
AUPQ090299A0 (en) 1999-06-10 1999-07-01 University Of Sydney, The Glass panel
US6537892B2 (en) 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US7569926B2 (en) 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
JP4938478B2 (ja) * 2007-01-31 2012-05-23 京セラキンセキ株式会社 圧電振動子
US7927906B2 (en) 2008-02-04 2011-04-19 Honeywell International Inc. Method for MEMS threshold sensor packaging
JP2009267049A (ja) * 2008-04-24 2009-11-12 Olympus Corp 光学装置および光学装置の製造方法
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
CN102130026B (zh) 2010-12-23 2012-06-27 中国科学院半导体研究所 基于金锡合金键合的圆片级低温封装方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US20050266252A1 (en) * 2004-05-27 2005-12-01 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
CN101522556A (zh) * 2006-09-12 2009-09-02 法国圣-戈班玻璃公司 制造微流体器件的方法
US20110073880A1 (en) * 2007-01-05 2011-03-31 Samsung Mobile Display Co., Ltd. Glass plate with glass frit structure
CN102066280A (zh) * 2009-07-23 2011-05-18 旭硝子株式会社 带密封材料层的玻璃构件的制造方法及制造装置以及电子器件的制造方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
Laser assisted glass frit sealing of dye-sensitized solar cells;Fernando Ribeiro, et al.;《Solar Energy Materials & Solar Cells》;20111004;第96卷;第44-45页2. Experimental section，第44页第2段 *

Also Published As

Publication number Publication date
CN105452154A (zh) 2016-03-30
US20130221510A1 (en) 2013-08-29
KR102229605B1 (ko) 2021-03-19
WO2013130572A1 (en) 2013-09-06
JP2015511063A (ja) 2015-04-13
JP6128566B2 (ja) 2017-05-17
US8895362B2 (en) 2014-11-25
KR20140141599A (ko) 2014-12-10

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Granted publication date: 20170718