JP6128566B2 - 材料層を互いに接合する方法および生じるデバイス - Google Patents

材料層を互いに接合する方法および生じるデバイス Download PDF

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Publication number
JP6128566B2
JP6128566B2 JP2014559984A JP2014559984A JP6128566B2 JP 6128566 B2 JP6128566 B2 JP 6128566B2 JP 2014559984 A JP2014559984 A JP 2014559984A JP 2014559984 A JP2014559984 A JP 2014559984A JP 6128566 B2 JP6128566 B2 JP 6128566B2
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JP
Japan
Prior art keywords
material layer
glass material
glass
bonding
layer
Prior art date
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Expired - Fee Related
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JP2014559984A
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English (en)
Japanese (ja)
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JP2015511063A (ja
JP2015511063A5 (https=
Inventor
グレゴリー クイラード，ジェームズ
グレゴリー クイラード，ジェームズ
ポール ダイグラー，クリストファー
ポール ダイグラー，クリストファー
フォン，ジアンウェイ
スゥン，ヤーウェイ
ティエン，リーリー
デイヴィッド トレイシー，イアン
デイヴィッド トレイシー，イアン
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Corning Inc
Original Assignee
Corning Inc
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Publication date
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Publication of JP2015511063A publication Critical patent/JP2015511063A/ja
Publication of JP2015511063A5 publication Critical patent/JP2015511063A5/ja
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Publication of JP6128566B2 publication Critical patent/JP6128566B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
JP2014559984A 2012-02-29 2013-02-27 材料層を互いに接合する方法および生じるデバイス Expired - Fee Related JP6128566B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261604747P 2012-02-29 2012-02-29
US61/604,747 2012-02-29
PCT/US2013/027977 WO2013130572A1 (en) 2012-02-29 2013-02-27 Methods for bonding material layers to one another and resulting device

Publications (3)

Publication Number Publication Date
JP2015511063A JP2015511063A (ja) 2015-04-13
JP2015511063A5 JP2015511063A5 (https=) 2016-06-09
JP6128566B2 true JP6128566B2 (ja) 2017-05-17

Family

ID=47884547

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014559984A Expired - Fee Related JP6128566B2 (ja) 2012-02-29 2013-02-27 材料層を互いに接合する方法および生じるデバイス

Country Status (5)

Country Link
US (1) US8895362B2 (https=)
JP (1) JP6128566B2 (https=)
KR (1) KR102229605B1 (https=)
CN (1) CN105452154B (https=)
WO (1) WO2013130572A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE537869C2 (sv) * 2012-11-01 2015-11-03 Silex Microsystems Ab Substratgenomgående vior
CN105161515B (zh) * 2015-08-11 2018-03-23 京东方科技集团股份有限公司 有机发光二极管显示面板及其封装方法、显示装置
JP7538108B2 (ja) * 2018-08-07 2024-08-21 コーニング インコーポレイテッド 気密封止パッケージ
KR20230058680A (ko) * 2020-09-02 2023-05-03 코닝 인코포레이티드 유리 패키지 및 제조 방법

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
AUPQ090299A0 (en) 1999-06-10 1999-07-01 University Of Sydney, The Glass panel
US6537892B2 (en) 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US6998776B2 (en) * 2003-04-16 2006-02-14 Corning Incorporated Glass package that is hermetically sealed with a frit and method of fabrication
US7387838B2 (en) * 2004-05-27 2008-06-17 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US7569926B2 (en) 2005-08-26 2009-08-04 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
FR2905690B1 (fr) 2006-09-12 2008-10-17 Saint Gobain Procede de fabrication d'un dispositif microfluidique.
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP4938478B2 (ja) * 2007-01-31 2012-05-23 京セラキンセキ株式会社 圧電振動子
US7927906B2 (en) 2008-02-04 2011-04-19 Honeywell International Inc. Method for MEMS threshold sensor packaging
JP2009267049A (ja) * 2008-04-24 2009-11-12 Olympus Corp 光学装置および光学装置の製造方法
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
KR20120048528A (ko) 2009-07-23 2012-05-15 아사히 가라스 가부시키가이샤 봉착 재료층이 부착된 유리 부재의 제조 방법 및 제조 장치, 그리고 전자 디바이스의 제조 방법
CN102130026B (zh) 2010-12-23 2012-06-27 中国科学院半导体研究所 基于金锡合金键合的圆片级低温封装方法

Also Published As

Publication number Publication date
CN105452154A (zh) 2016-03-30
US20130221510A1 (en) 2013-08-29
KR102229605B1 (ko) 2021-03-19
WO2013130572A1 (en) 2013-09-06
JP2015511063A (ja) 2015-04-13
US8895362B2 (en) 2014-11-25
CN105452154B (zh) 2017-07-18
KR20140141599A (ko) 2014-12-10

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