KR102229605B1 - 어느 하나의 재료 층을 또 다른 층에 본딩하기 위한 방법 및 그 결과의 장치 - Google Patents

어느 하나의 재료 층을 또 다른 층에 본딩하기 위한 방법 및 그 결과의 장치 Download PDF

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KR102229605B1
KR102229605B1 KR1020147026621A KR20147026621A KR102229605B1 KR 102229605 B1 KR102229605 B1 KR 102229605B1 KR 1020147026621 A KR1020147026621 A KR 1020147026621A KR 20147026621 A KR20147026621 A KR 20147026621A KR 102229605 B1 KR102229605 B1 KR 102229605B1
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South Korea
Prior art keywords
layer
glass material
glass
bonding
bonding material
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KR1020147026621A
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English (en)
Korean (ko)
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KR20140141599A (ko
Inventor
제임스 그레고리 쿠일라드
크리스토퍼 폴 다이글러
지앙웨이 펭
야웨이 선
릴리 티안
이안 데이비드 트레이시
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코닝 인코포레이티드
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/01—Manufacture or treatment
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
    • G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
    • G02B26/0816—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements
    • G02B26/0833—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light by means of one or more reflecting elements the reflecting element being a micromechanical device, e.g. a MEMS mirror, DMD
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/692—Ceramics or glasses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
    • B81C2201/019—Bonding or gluing multiple substrate layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/032—Gluing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2203/00—Forming microstructural systems
    • B81C2203/03—Bonding two components
    • B81C2203/033—Thermal bonding
    • B81C2203/035—Soldering

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Micromachines (AREA)
  • Joining Of Glass To Other Materials (AREA)
  • Dicing (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
KR1020147026621A 2012-02-29 2013-02-27 어느 하나의 재료 층을 또 다른 층에 본딩하기 위한 방법 및 그 결과의 장치 Expired - Fee Related KR102229605B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261604747P 2012-02-29 2012-02-29
US61/604,747 2012-02-29
PCT/US2013/027977 WO2013130572A1 (en) 2012-02-29 2013-02-27 Methods for bonding material layers to one another and resulting device

Publications (2)

Publication Number Publication Date
KR20140141599A KR20140141599A (ko) 2014-12-10
KR102229605B1 true KR102229605B1 (ko) 2021-03-19

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020147026621A Expired - Fee Related KR102229605B1 (ko) 2012-02-29 2013-02-27 어느 하나의 재료 층을 또 다른 층에 본딩하기 위한 방법 및 그 결과의 장치

Country Status (5)

Country Link
US (1) US8895362B2 (https=)
JP (1) JP6128566B2 (https=)
KR (1) KR102229605B1 (https=)
CN (1) CN105452154B (https=)
WO (1) WO2013130572A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SE537869C2 (sv) * 2012-11-01 2015-11-03 Silex Microsystems Ab Substratgenomgående vior
CN105161515B (zh) * 2015-08-11 2018-03-23 京东方科技集团股份有限公司 有机发光二极管显示面板及其封装方法、显示装置
JP7538108B2 (ja) * 2018-08-07 2024-08-21 コーニング インコーポレイテッド 気密封止パッケージ
KR20230058680A (ko) * 2020-09-02 2023-05-03 코닝 인코포레이티드 유리 패키지 및 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040207314A1 (en) * 2003-04-16 2004-10-21 Aitken Bruce G. Glass package that is hermetically sealed with a frit and method of fabrication
WO2007078472A1 (en) 2005-12-16 2007-07-12 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
CN102130026A (zh) 2010-12-23 2011-07-20 中国科学院半导体研究所 基于金锡合金键合的圆片级低温封装方法

Family Cites Families (13)

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Publication number Priority date Publication date Assignee Title
GB1138401A (en) 1965-05-06 1969-01-01 Mallory & Co Inc P R Bonding
AUPQ090299A0 (en) 1999-06-10 1999-07-01 University Of Sydney, The Glass panel
US6537892B2 (en) 2001-02-02 2003-03-25 Delphi Technologies, Inc. Glass frit wafer bonding process and packages formed thereby
US6893574B2 (en) 2001-10-23 2005-05-17 Analog Devices Inc MEMS capping method and apparatus
US7387838B2 (en) * 2004-05-27 2008-06-17 Delaware Capital Formation, Inc. Low loss glass-ceramic materials, method of making same and electronic packages including same
US8637980B1 (en) 2007-12-18 2014-01-28 Rockwell Collins, Inc. Adhesive applications using alkali silicate glass for electronics
FR2905690B1 (fr) 2006-09-12 2008-10-17 Saint Gobain Procede de fabrication d'un dispositif microfluidique.
KR100787463B1 (ko) * 2007-01-05 2007-12-26 삼성에스디아이 주식회사 글래스 프릿, 실링재 형성용 조성물, 발광 장치 및 발광 장치의 제조방법
JP4938478B2 (ja) * 2007-01-31 2012-05-23 京セラキンセキ株式会社 圧電振動子
US7927906B2 (en) 2008-02-04 2011-04-19 Honeywell International Inc. Method for MEMS threshold sensor packaging
JP2009267049A (ja) * 2008-04-24 2009-11-12 Olympus Corp 光学装置および光学装置の製造方法
US8860305B2 (en) 2009-07-09 2014-10-14 Corning Incorporated Methods for forming fritted cover sheets with masks and glass packages comprising the same
KR20120048528A (ko) 2009-07-23 2012-05-15 아사히 가라스 가부시키가이샤 봉착 재료층이 부착된 유리 부재의 제조 방법 및 제조 장치, 그리고 전자 디바이스의 제조 방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040207314A1 (en) * 2003-04-16 2004-10-21 Aitken Bruce G. Glass package that is hermetically sealed with a frit and method of fabrication
WO2007078472A1 (en) 2005-12-16 2007-07-12 Innovative Micro Technology Wafer level hermetic bond using metal alloy with raised feature
CN102130026A (zh) 2010-12-23 2011-07-20 中国科学院半导体研究所 基于金锡合金键合的圆片级低温封装方法

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
F. Ribeiro et al., Laser assisted glass frit sealing of dye-sensitized solar cells, Solar Energy Materials & Solar Cells, 2012.01., Vol. 96, pp. 43-49 1부.*

Also Published As

Publication number Publication date
CN105452154A (zh) 2016-03-30
US20130221510A1 (en) 2013-08-29
WO2013130572A1 (en) 2013-09-06
JP2015511063A (ja) 2015-04-13
JP6128566B2 (ja) 2017-05-17
US8895362B2 (en) 2014-11-25
CN105452154B (zh) 2017-07-18
KR20140141599A (ko) 2014-12-10

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