JP2015510532A5 - - Google Patents

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Publication number
JP2015510532A5
JP2015510532A5 JP2014554939A JP2014554939A JP2015510532A5 JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5 JP 2014554939 A JP2014554939 A JP 2014554939A JP 2014554939 A JP2014554939 A JP 2014554939A JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5
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JP
Japan
Prior art keywords
mixture
carbon black
silane
less
dbp
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JP2014554939A
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English (en)
Japanese (ja)
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JP2015510532A (ja
JP6294236B2 (ja
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Priority claimed from PCT/US2013/023588 external-priority patent/WO2013116196A1/en
Publication of JP2015510532A publication Critical patent/JP2015510532A/ja
Publication of JP2015510532A5 publication Critical patent/JP2015510532A5/ja
Application granted granted Critical
Publication of JP6294236B2 publication Critical patent/JP6294236B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2014554939A 2012-01-31 2013-01-29 熱可塑性の半導性組成物 Active JP6294236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
US61/592,700 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (3)

Publication Number Publication Date
JP2015510532A JP2015510532A (ja) 2015-04-09
JP2015510532A5 true JP2015510532A5 (enExample) 2016-03-03
JP6294236B2 JP6294236B2 (ja) 2018-03-14

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014554939A Active JP6294236B2 (ja) 2012-01-31 2013-01-29 熱可塑性の半導性組成物

Country Status (10)

Country Link
US (1) US9595365B2 (enExample)
EP (1) EP2809731B1 (enExample)
JP (1) JP6294236B2 (enExample)
KR (1) KR102012805B1 (enExample)
CN (1) CN104159978B (enExample)
BR (1) BR112014017195B1 (enExample)
CA (1) CA2861113C (enExample)
MX (1) MX346691B (enExample)
TW (1) TWI576382B (enExample)
WO (1) WO2013116196A1 (enExample)

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EP3160738B1 (en) * 2014-06-27 2020-04-01 Dow Global Technologies LLC Cold shrink article for electrical device
WO2016093934A2 (en) * 2014-10-24 2016-06-16 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
CN107207861B (zh) * 2015-01-09 2021-10-22 迈图高新材料集团 有机硅橡胶组合物在用于制备高压直流绝缘体应用中的用途
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
JP6882192B2 (ja) * 2015-04-30 2021-06-02 ダウ グローバル テクノロジーズ エルエルシー ポリオレフィンのシラン架橋のための硬化制御添加剤としてのヒドロキシル末端pdms
US10954410B2 (en) 2017-07-31 2021-03-23 Dow Global Technologies Llc Moisture curable composition for wire and cable insulation and jacket layers
WO2019027955A1 (en) * 2017-07-31 2019-02-07 Dow Global Technologies Llc HUMIDITY-CURABLE COMPOSITION FOR ISOLATION AND SHEATH LAYERS OF WIRES AND CABLE
WO2019152829A1 (en) 2018-02-01 2019-08-08 Dow Silicones Corporation Composition, polymer composite article formed therewith, and method of preparing same
US11753521B2 (en) * 2018-02-14 2023-09-12 Dow Global Technologies Llc Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
US12163016B2 (en) 2019-05-24 2024-12-10 Dow Global Technologies Llc Crosslinked polymeric composition and coated conductor
JP7109604B2 (ja) 2019-08-07 2022-07-29 ダウ シリコーンズ コーポレーション 木材プラスチック複合体の形成における、アルケニル官能性ポリジオルガノシロキサン組成物及びその使用方法
CN112513169B (zh) 2019-08-07 2021-06-22 美国陶氏有机硅公司 包含液体聚二有机硅氧烷的固体载体组分及制备和使用该固体载体组分的方法
FI3794070T3 (fi) 2019-08-07 2024-12-09 Dow Silicones Corp Nestemäistä polyorganosiloksaania sisältävä kiinteä kantajakomponentti ja menetelmiä kiinteän kantajakomponentin valmistamiseksi ja käyttämiseksi
TW202239854A (zh) * 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物
EP4315371A1 (en) 2021-03-31 2024-02-07 Dow Global Technologies LLC Moisture-curable semiconductive formulation

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JP5475006B2 (ja) * 2008-12-23 2014-04-16 ダウ グローバル テクノロジーズ エルエルシー 多成分反応系を成形工程に送達する方法
US20120178868A1 (en) 2009-09-16 2012-07-12 Mohamed Esseghir Crosslinked, Melt-Shapped Articles and Compositions for Producing Same

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