MX346691B - Composiciones semiconductoras, termoplasticas. - Google Patents

Composiciones semiconductoras, termoplasticas.

Info

Publication number
MX346691B
MX346691B MX2014009222A MX2014009222A MX346691B MX 346691 B MX346691 B MX 346691B MX 2014009222 A MX2014009222 A MX 2014009222A MX 2014009222 A MX2014009222 A MX 2014009222A MX 346691 B MX346691 B MX 346691B
Authority
MX
Mexico
Prior art keywords
carbon black
less
thermoplastic
semiconductive
semiconductive compositions
Prior art date
Application number
MX2014009222A
Other languages
English (en)
Other versions
MX2014009222A (es
Inventor
W Dunchus Neil
M Cogen Jeffrey
Esseghir Mohamed
S Sengupta Saurav
Original Assignee
Dow Global Technologies Llc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of MX2014009222A publication Critical patent/MX2014009222A/es
Publication of MX346691B publication Critical patent/MX346691B/es

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0892—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms containing monomers with other atoms than carbon, hydrogen or oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)

Abstract

La invención se refiere a composiciones termoplásticas sin peróxido, semiconductoras, reticulables que tienen una resistividad de volumen estable menor que 1000 ohms-cm que comprenden, con base en el peso de la composición: A. 60-90% en peso de polietileno funcionalizado por silano; B. 0.5-20% en peso de organopolisiloxano con contenido de dos o más grupos terminales funcionales; C. 10-20% en peso de negro de carbono de alta conductividad, por ejemplo, un negro de carbono que tiene una granulometría promedio de 50 nm o menos, un área superficial (BET) de 700-1250 m2/g, y una absorción de aceite (DBP) de 300-500 ml/100g; y D. 0.05 - 0.2% en peso de catalizador de reticulación.
MX2014009222A 2012-01-31 2013-01-29 Composiciones semiconductoras, termoplasticas. MX346691B (es)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (2)

Publication Number Publication Date
MX2014009222A MX2014009222A (es) 2014-09-01
MX346691B true MX346691B (es) 2017-03-29

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
MX2014009222A MX346691B (es) 2012-01-31 2013-01-29 Composiciones semiconductoras, termoplasticas.

Country Status (10)

Country Link
US (1) US9595365B2 (es)
EP (1) EP2809731B1 (es)
JP (1) JP6294236B2 (es)
KR (1) KR102012805B1 (es)
CN (1) CN104159978B (es)
BR (1) BR112014017195B1 (es)
CA (1) CA2861113C (es)
MX (1) MX346691B (es)
TW (1) TWI576382B (es)
WO (1) WO2013116196A1 (es)

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WO2015196459A1 (en) 2014-06-27 2015-12-30 Dow Global Technologies Llc Cold shrink article for electrical device
CA2964346C (en) * 2014-10-24 2020-07-21 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
CN107207861B (zh) 2015-01-09 2021-10-22 迈图高新材料集团 有机硅橡胶组合物在用于制备高压直流绝缘体应用中的用途
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
KR102602891B1 (ko) * 2015-04-30 2023-11-17 다우 글로벌 테크놀로지스 엘엘씨 폴리올레핀의 실란 가교결합을 위한 경화 조절 첨가제로서 하이드록실-말단화된 pdms
RU2769510C2 (ru) * 2017-07-31 2022-04-01 Дау Глоубл Текнолоджиз Ллк Влагоотверждаемая композиция для изоляции провода и кабеля и слоёв оболочки
JP7137616B2 (ja) * 2017-07-31 2022-09-14 ダウ グローバル テクノロジーズ エルエルシー ワイヤおよびケーブル絶縁層およびジャケット層のための湿気硬化性組成物
CA3084550A1 (en) 2018-02-01 2019-08-08 Dow Silicones Corporation Composition, polymer composite article formed therewith, and method of preparing same
CN111868155B (zh) * 2018-02-14 2024-01-02 陶氏环球技术有限责任公司 具有改进的持续耐高温性的乙烯/α-烯烃互聚物组合物
US20220227979A1 (en) * 2019-05-24 2022-07-21 Dow Global Technologies Llc Crosslinked Polymeric Composition and Coated Conductor
EP3802704B1 (en) 2019-08-07 2022-06-15 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
JP7092894B2 (ja) 2019-08-07 2022-06-28 ダウ シリコーンズ コーポレーション 液状ポリオルガノシロキサンを含む固体担体成分、並びに該固体担体成分の調製及び使用方法
KR102348911B1 (ko) 2019-08-07 2022-01-11 다우 실리콘즈 코포레이션 액체 폴리다이오르가노실록산을 포함하는 고체 담체 성분, 및 고체 담체 성분의 제조 및 사용 방법
BR112023017644A2 (pt) 2021-03-31 2023-10-10 Dow Global Technologies Llc Formulação semicondutiva, métodos para a produção de uma formulação semicondutiva, para a produção do artigo fabricado e do condutor revestido e para conduzir eletricidade, produto semicondutivo, artigo fabricado, e, condutor revestido
TW202239854A (zh) 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物

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JPH0743969B2 (ja) * 1985-02-08 1995-05-15 古河電気工業株式会社 架橋ポリオレフイン絶縁電力ケ−ブルの製造方法
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Also Published As

Publication number Publication date
EP2809731B1 (en) 2016-01-20
EP2809731A1 (en) 2014-12-10
BR112014017195B1 (pt) 2021-11-23
BR112014017195A2 (pt) 2017-06-13
WO2013116196A1 (en) 2013-08-08
CN104159978B (zh) 2017-09-08
JP6294236B2 (ja) 2018-03-14
BR112014017195A8 (pt) 2017-07-04
JP2015510532A (ja) 2015-04-09
US9595365B2 (en) 2017-03-14
US20150200038A1 (en) 2015-07-16
MX2014009222A (es) 2014-09-01
CA2861113A1 (en) 2013-08-08
CN104159978A (zh) 2014-11-19
KR20140117448A (ko) 2014-10-07
KR102012805B1 (ko) 2019-08-22
TWI576382B (zh) 2017-04-01
CA2861113C (en) 2020-03-24
TW201339225A (zh) 2013-10-01

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