BR112014017195A8 - composição termoplástica reticulável semicondutora livre de peróxido, processo para preparar um artigo termoplástico semicondutor reticulado, processo em-linha e grânulo - Google Patents

composição termoplástica reticulável semicondutora livre de peróxido, processo para preparar um artigo termoplástico semicondutor reticulado, processo em-linha e grânulo

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Publication number
BR112014017195A8
BR112014017195A8 BR112014017195A BR112014017195A BR112014017195A8 BR 112014017195 A8 BR112014017195 A8 BR 112014017195A8 BR 112014017195 A BR112014017195 A BR 112014017195A BR 112014017195 A BR112014017195 A BR 112014017195A BR 112014017195 A8 BR112014017195 A8 BR 112014017195A8
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BR
Brazil
Prior art keywords
weight
semiconductor
preparing
granule
thermoplastic
Prior art date
Application number
BR112014017195A
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English (en)
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BR112014017195A2 (pt
BR112014017195B1 (pt
Inventor
M Cogen Jeffrey
Esseghir Mohamed
W Dunchus Neil
S Sengupta Saurav
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Dow Global Technologies Llc
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Application filed by Dow Global Technologies Llc filed Critical Dow Global Technologies Llc
Publication of BR112014017195A2 publication Critical patent/BR112014017195A2/pt
Publication of BR112014017195A8 publication Critical patent/BR112014017195A8/pt
Publication of BR112014017195B1 publication Critical patent/BR112014017195B1/pt

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
    • C08L23/0892—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms containing monomers with other atoms than carbon, hydrogen or oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)

Abstract

resumo “composição termoplástica reticulável semicondutora livre de peróxido, processo para preparar um artigo termoplástico semicondutor reticulado, processo em-linha e grânulo” composições termoplásticas reticuláveis semicondutoras livres de peróxido, tendo uma resistividade volumétrica estável inferior a 1000 ohm-cm compreendendo, com base no peso da composição: a. de 60-90% em peso de polietileno funcionalizado com silano; b. de 0,5-20% em peso de organopolissiloxano contendo dois ou mais grupos terminais funcionais; c. de 10-20% em peso de negro de fumo de alta condutividade, como por exemplo, um negro de fumo tendo um tamanho médio de partícula de 50 nm ou menos, uma área superficial (bet) de 700-1250 m2/g e uma absorção de óleo (dbp) de 300-500 ml/100 g; e d. de 0,05 – 0,2% em peso de catalisador reticulante. 1/1
BR112014017195-5A 2012-01-31 2013-01-29 Composição termoplástica reticulável semicondutora livre de peróxido, processo para preparar um artigo termoplástico semicondutor reticulado, processo em-linha para preparar uma composição reticulável e grânulo BR112014017195B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
US61/592,700 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (3)

Publication Number Publication Date
BR112014017195A2 BR112014017195A2 (pt) 2017-06-13
BR112014017195A8 true BR112014017195A8 (pt) 2017-07-04
BR112014017195B1 BR112014017195B1 (pt) 2021-11-23

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014017195-5A BR112014017195B1 (pt) 2012-01-31 2013-01-29 Composição termoplástica reticulável semicondutora livre de peróxido, processo para preparar um artigo termoplástico semicondutor reticulado, processo em-linha para preparar uma composição reticulável e grânulo

Country Status (10)

Country Link
US (1) US9595365B2 (pt)
EP (1) EP2809731B1 (pt)
JP (1) JP6294236B2 (pt)
KR (1) KR102012805B1 (pt)
CN (1) CN104159978B (pt)
BR (1) BR112014017195B1 (pt)
CA (1) CA2861113C (pt)
MX (1) MX346691B (pt)
TW (1) TWI576382B (pt)
WO (1) WO2013116196A1 (pt)

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US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
CN107075179B (zh) * 2014-10-24 2019-07-30 埃克森美孚化学专利公司 用于改进轮胎胎面的湿牵引力和滚动阻力的链端官能化聚烯烃
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
JP6870898B2 (ja) 2015-01-09 2021-05-12 モメンティブ パフォーマンス マテリアルズ ゲーエムベーハーＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ ＧｍｂＨ 高圧直流適用のための絶縁体の製造のためのシリコンゴム組成物の使用
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
EP3289006A1 (en) * 2015-04-30 2018-03-07 Dow Global Technologies LLC Hydroxyl-terminated pdms as cure control additive for the silane crosslinking of polyolefins
KR102540460B1 (ko) * 2017-07-31 2023-06-12 다우 글로벌 테크놀로지스 엘엘씨 와이어 및 케이블 절연 층 및 재킷 층을 위한 수분 경화성 조성물
KR102540458B1 (ko) * 2017-07-31 2023-06-12 다우 글로벌 테크놀로지스 엘엘씨 와이어 및 케이블 절연 층 및 재킷 층을 위한 수분 경화성 조성물
WO2019152830A1 (en) 2018-02-01 2019-08-08 Dow Silicones Corporation Composition, polymer composite article formed therewith, and method of preparing same
US11753521B2 (en) * 2018-02-14 2023-09-12 Dow Global Technologies Llc Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
MX2021013289A (es) 2019-05-24 2021-12-10 Dow Global Technologies Llc Composicion polimerica reticulada y conductor recubierto.
US11377561B2 (en) 2019-08-07 2022-07-05 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
US11312861B2 (en) 2019-08-07 2022-04-26 Dow Silicones Corporation Solid carrier component including a liquid polyorganosiloxane and methods for preparation and use of the solid carrier component
JP7092898B2 (ja) 2019-08-07 2022-06-28 ダウ シリコーンズ コーポレーション 液状ポジリオルガノシロキサンを含む固体状担体成分、並びに該固体状担体成分の調製方法及び使用
BR112023017644A2 (pt) 2021-03-31 2023-10-10 Dow Global Technologies Llc Formulação semicondutiva, métodos para a produção de uma formulação semicondutiva, para a produção do artigo fabricado e do condutor revestido e para conduzir eletricidade, produto semicondutivo, artigo fabricado, e, condutor revestido
TW202239854A (zh) * 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物

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Also Published As

Publication number Publication date
CA2861113A1 (en) 2013-08-08
KR102012805B1 (ko) 2019-08-22
TW201339225A (zh) 2013-10-01
EP2809731B1 (en) 2016-01-20
WO2013116196A1 (en) 2013-08-08
CN104159978A (zh) 2014-11-19
CN104159978B (zh) 2017-09-08
MX2014009222A (es) 2014-09-01
BR112014017195A2 (pt) 2017-06-13
KR20140117448A (ko) 2014-10-07
JP6294236B2 (ja) 2018-03-14
TWI576382B (zh) 2017-04-01
MX346691B (es) 2017-03-29
CA2861113C (en) 2020-03-24
US20150200038A1 (en) 2015-07-16
US9595365B2 (en) 2017-03-14
EP2809731A1 (en) 2014-12-10
BR112014017195B1 (pt) 2021-11-23
JP2015510532A (ja) 2015-04-09

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B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B350 Update of information on the portal [chapter 15.35 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 29/01/2013, OBSERVADAS AS CONDICOES LEGAIS.