JP6294236B2 - 熱可塑性の半導性組成物 - Google Patents

熱可塑性の半導性組成物 Download PDF

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Publication number
JP6294236B2
JP6294236B2 JP2014554939A JP2014554939A JP6294236B2 JP 6294236 B2 JP6294236 B2 JP 6294236B2 JP 2014554939 A JP2014554939 A JP 2014554939A JP 2014554939 A JP2014554939 A JP 2014554939A JP 6294236 B2 JP6294236 B2 JP 6294236B2
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Prior art keywords
silane
carbon black
composition
mixture
crosslinkable
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JP2014554939A
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English (en)
Japanese (ja)
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JP2015510532A (ja
JP2015510532A5 (enExample
Inventor
モハメド・エセギエ
ジェフリー・エム・コーゲン
サウレヴ・エス・セングプタ
ニール・ダブリュ・ダンチュス
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Dow Global Technologies LLC
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Dow Global Technologies LLC
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Publication of JP2015510532A5 publication Critical patent/JP2015510532A5/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/24—Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/20—Compounding polymers with additives, e.g. colouring
    • C08J3/22—Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00—Processes of treating or compounding macromolecular substances
    • C08J3/24—Crosslinking, e.g. vulcanising, of macromolecules
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/02—Elements
    • C08K3/04—Carbon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/08—Copolymers of ethene
    • C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0892—Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with monomers containing atoms other than carbon, hydrogen or oxygen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2296—Oxides; Hydroxides of metals of zinc
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/002—Physical properties
    • C08K2201/006—Additives being defined by their surface area
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/019—Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)
JP2014554939A 2012-01-31 2013-01-29 熱可塑性の半導性組成物 Active JP6294236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
US61/592,700 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (3)

Publication Number Publication Date
JP2015510532A JP2015510532A (ja) 2015-04-09
JP2015510532A5 JP2015510532A5 (enExample) 2016-03-03
JP6294236B2 true JP6294236B2 (ja) 2018-03-14

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014554939A Active JP6294236B2 (ja) 2012-01-31 2013-01-29 熱可塑性の半導性組成物

Country Status (10)

Country Link
US (1) US9595365B2 (enExample)
EP (1) EP2809731B1 (enExample)
JP (1) JP6294236B2 (enExample)
KR (1) KR102012805B1 (enExample)
CN (1) CN104159978B (enExample)
BR (1) BR112014017195B1 (enExample)
CA (1) CA2861113C (enExample)
MX (1) MX346691B (enExample)
TW (1) TWI576382B (enExample)
WO (1) WO2013116196A1 (enExample)

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EP3160738B1 (en) * 2014-06-27 2020-04-01 Dow Global Technologies LLC Cold shrink article for electrical device
US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
CN107075179B (zh) * 2014-10-24 2019-07-30 埃克森美孚化学专利公司 用于改进轮胎胎面的湿牵引力和滚动阻力的链端官能化聚烯烃
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
JP6870898B2 (ja) * 2015-01-09 2021-05-12 モメンティブ パフォーマンス マテリアルズ ゲーエムベーハーＭｏｍｅｎｔｉｖｅ Ｐｅｒｆｏｒｍａｎｃｅ Ｍａｔｅｒｉａｌｓ ＧｍｂＨ 高圧直流適用のための絶縁体の製造のためのシリコンゴム組成物の使用
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
KR102602891B1 (ko) * 2015-04-30 2023-11-17 다우 글로벌 테크놀로지스 엘엘씨 폴리올레핀의 실란 가교결합을 위한 경화 조절 첨가제로서 하이드록실-말단화된 pdms
CN110997835B (zh) * 2017-07-31 2022-05-27 陶氏环球技术有限责任公司 电线和电缆绝缘和护套层的可湿气固化的组合物
WO2019027955A1 (en) * 2017-07-31 2019-02-07 Dow Global Technologies Llc HUMIDITY-CURABLE COMPOSITION FOR ISOLATION AND SHEATH LAYERS OF WIRES AND CABLE
WO2019152830A1 (en) 2018-02-01 2019-08-08 Dow Silicones Corporation Composition, polymer composite article formed therewith, and method of preparing same
WO2019161013A1 (en) * 2018-02-14 2019-08-22 Dow Global Technologies Llc Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
US12163016B2 (en) 2019-05-24 2024-12-10 Dow Global Technologies Llc Crosslinked polymeric composition and coated conductor
KR102348911B1 (ko) 2019-08-07 2022-01-11 다우 실리콘즈 코포레이션 액체 폴리다이오르가노실록산을 포함하는 고체 담체 성분, 및 고체 담체 성분의 제조 및 사용 방법
CA3114141C (en) 2019-08-07 2022-03-08 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
CA3099524C (en) 2019-08-07 2021-08-31 Dow Silicones Corporation Solid carrier component including a liquid polyorganosiloxane and methods for preparation and use of the solid carrier component
US20240067812A1 (en) * 2021-03-31 2024-02-29 Dow Global Technologies Llc Moisture-curable semiconductive formulation
TW202239854A (zh) 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物

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US4144202A (en) 1977-12-27 1979-03-13 Union Carbide Corporation Dielectric compositions comprising ethylene polymer stabilized against water treeing with epoxy containing organo silanes
JPH0743969B2 (ja) * 1985-02-08 1995-05-15 古河電気工業株式会社 架橋ポリオレフイン絶縁電力ケ−ブルの製造方法
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US5272236A (en) 1991-10-15 1993-12-21 The Dow Chemical Company Elastic substantially linear olefin polymers
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Also Published As

Publication number Publication date
US20150200038A1 (en) 2015-07-16
JP2015510532A (ja) 2015-04-09
BR112014017195A8 (pt) 2017-07-04
TWI576382B (zh) 2017-04-01
CA2861113A1 (en) 2013-08-08
EP2809731A1 (en) 2014-12-10
EP2809731B1 (en) 2016-01-20
BR112014017195B1 (pt) 2021-11-23
KR20140117448A (ko) 2014-10-07
TW201339225A (zh) 2013-10-01
CN104159978B (zh) 2017-09-08
BR112014017195A2 (pt) 2017-06-13
MX346691B (es) 2017-03-29
CN104159978A (zh) 2014-11-19
MX2014009222A (es) 2014-09-01
WO2013116196A1 (en) 2013-08-08
KR102012805B1 (ko) 2019-08-22
US9595365B2 (en) 2017-03-14
CA2861113C (en) 2020-03-24

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