TWI576382B - 熱塑性半導電組成物 - Google Patents

熱塑性半導電組成物 Download PDF

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Publication number
TWI576382B
TWI576382B TW102103514A TW102103514A TWI576382B TW I576382 B TWI576382 B TW I576382B TW 102103514 A TW102103514 A TW 102103514A TW 102103514 A TW102103514 A TW 102103514A TW I576382 B TWI576382 B TW I576382B
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TW
Taiwan
Prior art keywords
weight
composition
decane
polyethylene
crosslinkable
Prior art date
Application number
TW102103514A
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English (en)
Chinese (zh)
Other versions
TW201339225A (zh
Inventor
莫哈梅德 愛斯其爾
傑佛瑞M 柯根
沙拉弗S 聖古塔
尼爾W 登裘斯
Original Assignee
陶氏全球科技有限責任公司
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Publication of TW201339225A publication Critical patent/TW201339225A/zh
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Publication of TWI576382B publication Critical patent/TWI576382B/zh

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20Conductive material dispersed in non-conductive organic material
    • H01B1/24Conductive material dispersed in non-conductive organic material the conductive material comprising carbon-silicon compounds, carbon or silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/20Compounding polymers with additives, e.g. colouring
    • C08J3/22Compounding polymers with additives, e.g. colouring using masterbatch techniques
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J3/00Processes of treating or compounding macromolecular substances
    • C08J3/24Crosslinking, e.g. vulcanising, of macromolecules
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/02Elements
    • C08K3/04Carbon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00Compositions of unspecified macromolecular compounds
    • C08L101/02Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C08L101/10Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing hydrolysable silane groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04Homopolymers or copolymers of ethene
    • C08L23/08Copolymers of ethene
    • C08L23/0846Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen
    • C08L23/0892Copolymers of ethene with unsaturated hydrocarbons containing atoms other than carbon or hydrogen with monomers containing atoms other than carbon, hydrogen or oxygen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L51/00Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L51/06Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to homopolymers or copolymers of aliphatic hydrocarbons containing only one carbon-to-carbon double bond
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2296Oxides; Hydroxides of metals of zinc
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/002Physical properties
    • C08K2201/006Additives being defined by their surface area
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00Specific properties of additives
    • C08K2201/019Specific properties of additives the composition being defined by the absence of a certain additive

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
  • Conductive Materials (AREA)
TW102103514A 2012-01-31 2013-01-30 熱塑性半導電組成物 TWI576382B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31

Publications (2)

Publication Number Publication Date
TW201339225A TW201339225A (zh) 2013-10-01
TWI576382B true TWI576382B (zh) 2017-04-01

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
TW102103514A TWI576382B (zh) 2012-01-31 2013-01-30 熱塑性半導電組成物

Country Status (10)

Country Link
US (1) US9595365B2 (enExample)
EP (1) EP2809731B1 (enExample)
JP (1) JP6294236B2 (enExample)
KR (1) KR102012805B1 (enExample)
CN (1) CN104159978B (enExample)
BR (1) BR112014017195B1 (enExample)
CA (1) CA2861113C (enExample)
MX (1) MX346691B (enExample)
TW (1) TWI576382B (enExample)
WO (1) WO2013116196A1 (enExample)

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WO2015196459A1 (en) * 2014-06-27 2015-12-30 Dow Global Technologies Llc Cold shrink article for electrical device
RU2715722C2 (ru) * 2014-10-24 2020-03-03 Эксонмобил Кемикэл Пейтентс Инк. Функционализированные по концу цепи полиолефины, предназначенные для улучшения силы сцепления шины с мокрым дорожным покрытием и сопротивления качанию протекторов шин
US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
EP3243205B2 (en) 2015-01-09 2025-05-14 Momentive Performance Materials GmbH Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
EP3289006B1 (en) * 2015-04-30 2025-04-23 Dow Global Technologies LLC Hydroxyl-terminated pdms as cure control additive for the silane crosslinking of polyolefins
RU2769510C2 (ru) * 2017-07-31 2022-04-01 Дау Глоубл Текнолоджиз Ллк Влагоотверждаемая композиция для изоляции провода и кабеля и слоёв оболочки
CN110997835B (zh) * 2017-07-31 2022-05-27 陶氏环球技术有限责任公司 电线和电缆绝缘和护套层的可湿气固化的组合物
FI3746505T3 (fi) 2018-02-01 2024-07-18 Dow Silicones Corp Koostumus, siitä muodostettu polymeerikomposiittituote ja menetelmä sen valmistamiseksi
EP3752554B1 (en) * 2018-02-14 2023-05-31 Dow Global Technologies LLC Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
CN113840878B (zh) * 2019-05-24 2024-05-10 陶氏环球技术有限责任公司 交联聚合物组合物和涂布的导体
CN112654673B (zh) 2019-08-07 2023-09-01 美国陶氏有机硅公司 包含液体聚有机硅氧烷的固体载体组分及制备和使用该固体载体组分的方法
WO2021025773A1 (en) 2019-08-07 2021-02-11 Dow Silicones Corporation Solid carrier component including a liquid polydiorganosiloxane and methods for preparation and use of the solid carrier component
WO2021025775A1 (en) 2019-08-07 2021-02-11 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
US20240067812A1 (en) 2021-03-31 2024-02-29 Dow Global Technologies Llc Moisture-curable semiconductive formulation
TW202239854A (zh) * 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物

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Also Published As

Publication number Publication date
MX346691B (es) 2017-03-29
BR112014017195B1 (pt) 2021-11-23
TW201339225A (zh) 2013-10-01
CN104159978B (zh) 2017-09-08
CA2861113C (en) 2020-03-24
BR112014017195A8 (pt) 2017-07-04
EP2809731A1 (en) 2014-12-10
US9595365B2 (en) 2017-03-14
MX2014009222A (es) 2014-09-01
JP6294236B2 (ja) 2018-03-14
WO2013116196A1 (en) 2013-08-08
JP2015510532A (ja) 2015-04-09
US20150200038A1 (en) 2015-07-16
KR102012805B1 (ko) 2019-08-22
KR20140117448A (ko) 2014-10-07
CA2861113A1 (en) 2013-08-08
CN104159978A (zh) 2014-11-19
BR112014017195A2 (pt) 2017-06-13
EP2809731B1 (en) 2016-01-20

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