JP2015510532A5 - - Google Patents

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Publication number
JP2015510532A5
JP2015510532A5 JP2014554939A JP2014554939A JP2015510532A5 JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5 JP 2014554939 A JP2014554939 A JP 2014554939A JP 2014554939 A JP2014554939 A JP 2014554939A JP 2015510532 A5 JP2015510532 A5 JP 2015510532A5
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JP
Japan
Prior art keywords
mixture
carbon black
silane
less
dbp
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JP2014554939A
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English (en)
Japanese (ja)
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JP6294236B2 (ja
JP2015510532A (ja
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Priority claimed from PCT/US2013/023588 external-priority patent/WO2013116196A1/en
Publication of JP2015510532A publication Critical patent/JP2015510532A/ja
Publication of JP2015510532A5 publication Critical patent/JP2015510532A5/ja
Application granted granted Critical
Publication of JP6294236B2 publication Critical patent/JP6294236B2/ja
Active legal-status Critical Current
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JP2014554939A 2012-01-31 2013-01-29 熱可塑性の半導性組成物 Active JP6294236B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201261592700P 2012-01-31 2012-01-31
US61/592,700 2012-01-31
PCT/US2013/023588 WO2013116196A1 (en) 2012-01-31 2013-01-29 Thermoplastic, semiconductive compositions

Publications (3)

Publication Number Publication Date
JP2015510532A JP2015510532A (ja) 2015-04-09
JP2015510532A5 true JP2015510532A5 (cg-RX-API-DMAC10.html) 2016-03-03
JP6294236B2 JP6294236B2 (ja) 2018-03-14

Family

ID=47679100

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014554939A Active JP6294236B2 (ja) 2012-01-31 2013-01-29 熱可塑性の半導性組成物

Country Status (10)

Country Link
US (1) US9595365B2 (cg-RX-API-DMAC10.html)
EP (1) EP2809731B1 (cg-RX-API-DMAC10.html)
JP (1) JP6294236B2 (cg-RX-API-DMAC10.html)
KR (1) KR102012805B1 (cg-RX-API-DMAC10.html)
CN (1) CN104159978B (cg-RX-API-DMAC10.html)
BR (1) BR112014017195B1 (cg-RX-API-DMAC10.html)
CA (1) CA2861113C (cg-RX-API-DMAC10.html)
MX (1) MX346691B (cg-RX-API-DMAC10.html)
TW (1) TWI576382B (cg-RX-API-DMAC10.html)
WO (1) WO2013116196A1 (cg-RX-API-DMAC10.html)

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US10583692B2 (en) 2014-10-24 2020-03-10 Exxonmobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
EP3209506B1 (en) * 2014-10-24 2020-03-25 ExxonMobil Chemical Patents Inc. Chain end functionalized polyolefins for improving wet traction and rolling resistance of tire treads
US10280270B2 (en) 2014-11-24 2019-05-07 Exxonmobil Chemical Patents Inc. Silane functionalized polyolefins for polyolefin nanocomposites
US10755833B2 (en) 2015-01-09 2020-08-25 Momentive Performance Materials Gmbh Use of a silicone rubber composition for the manufacture of an insulator for high voltage direct current applications
US10023719B2 (en) 2015-02-02 2018-07-17 Exxonmobil Chemical Patents Inc. Toughened polyolefin nanocomposites using silane functionalized polyolefins
EP3289006B1 (en) * 2015-04-30 2025-04-23 Dow Global Technologies LLC Hydroxyl-terminated pdms as cure control additive for the silane crosslinking of polyolefins
BR112020001510B1 (pt) * 2017-07-31 2023-12-12 Dow Global Technologies Llc Composição reticulável, camada de invólucro, e, condutor revestido.
CA3071397A1 (en) * 2017-07-31 2019-02-07 Dow Global Technologies Llc Moisture curable composition for wire and cable insulation and jacket layers
KR102701352B1 (ko) 2018-02-01 2024-09-03 다우 글로벌 테크놀로지스 엘엘씨 조성물, 이를 사용하여 형성된 중합체 복합 물품, 및 이의 제조 방법
WO2019161013A1 (en) * 2018-02-14 2019-08-22 Dow Global Technologies Llc Ethylene/alpha-olefin interpolymer compositions with improved continuous high temperature resistance
KR102743541B1 (ko) * 2019-05-24 2024-12-18 다우 글로벌 테크놀로지스 엘엘씨 가교결합된 중합체 조성물 및 코팅된 전도체
WO2021025775A1 (en) 2019-08-07 2021-02-11 Dow Silicones Corporation Alkenyl-functional polydiorganosiloxane compositions and methods for use thereof in forming wood plastic composites
CA3099524C (en) 2019-08-07 2021-08-31 Dow Silicones Corporation Solid carrier component including a liquid polyorganosiloxane and methods for preparation and use of the solid carrier component
CN112513169B (zh) 2019-08-07 2021-06-22 美国陶氏有机硅公司 包含液体聚二有机硅氧烷的固体载体组分及制备和使用该固体载体组分的方法
TW202239854A (zh) * 2021-03-31 2022-10-16 美商陶氏全球科技有限責任公司 可濕固化半導電調配物
CA3213523A1 (en) 2021-03-31 2022-10-06 Paul J. Caronia Moisture-curable semiconductive formulation

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