JP2015153922A - 電力用半導体装置 - Google Patents
電力用半導体装置 Download PDFInfo
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Abstract
Description
図1および図2を参照して、電力モジュール91(電力用半導体装置)は、回路基板と、これに実装された電力用半導体素子8とを有する。
図5および図6を参照して、本実施の形態の電力モジュール92(電力用半導体装置)は、回路基板と、これに実装された電力用半導体素子8とを有する。回路基板は、絶縁板5Sと、接合パターン4Cと、回路パターン6Cと、パッド板1Aとを有する。
Claims (6)
- 電力用半導体素子と、
前記電力用半導体素子が実装された回路基板とを備え、前記回路基板は、
窒化アルミニウムセラミックスから作られ、第1の面と前記第1の面と反対の第2の面とを有する絶縁板と、
前記絶縁板の前記第1の面上に接合され、アルミニウムおよびアルミニウム合金のいずれかから作られた接合パターンと、
前記絶縁板の前記第2の面上に接合され、アルミニウムおよびアルミニウム合金のいずれかから作られた回路パターンと、
前記回路パターンに接合され、前記回路パターンを部分的にのみ覆い、銅および銅合金のいずれかから作られたパッド板と、を含む、
電力用半導体装置。 - 前記パッド板上に直接に接合され、銅および銅合金のいずれかから作られた電極をさらに備える、請求項1に記載の電力用半導体装置。
- 前記電力用半導体素子は前記パッド板に、銀を含有する接合材を用いて接合されている、請求項1または2に記載の電力用半導体装置。
- 前記回路パターンに直接に接合され、アルミニウムおよびアルミニウム合金のいずれかから作られたワイヤをさらに備える、請求項1から3のいずれか1項に記載の電力用半導体装置。
- 電力用半導体素子と、
前記電力用半導体素子が実装された回路基板とを備え、前記回路基板は、
窒化ケイ素セラミックスから作られ、第1の面と前記第1の面と反対の第2の面とを有する絶縁板と、
前記絶縁板の前記第1の面上に接合され、銅および銅合金のいずれかから作られた接合パターンと、
前記絶縁板の前記第2の面上に接合され、銅および銅合金のいずれかから作られた回路パターンと、
前記回路パターンに接合され、前記回路パターンを部分的にのみ覆い、アルミニウムおよびアルミニウム合金のいずれかから作られたパッド板と、を含む、
電力用半導体装置。 - 前記パッド板に直接に接合され、アルミニウムおよびアルミニウム合金のいずれかから作られたワイヤをさらに備える、請求項5に記載の電力用半導体装置。
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JP2014027200A JP6192561B2 (ja) | 2014-02-17 | 2014-02-17 | 電力用半導体装置 |
US14/535,639 US20150237718A1 (en) | 2014-02-17 | 2014-11-07 | Power semiconductor device |
DE102015201182.8A DE102015201182A1 (de) | 2014-02-17 | 2015-01-23 | Leistungshalbleitervorrichtung |
CN201510085084.8A CN104851843A (zh) | 2014-02-17 | 2015-02-16 | 电力用半导体装置 |
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JP2014027200A JP6192561B2 (ja) | 2014-02-17 | 2014-02-17 | 電力用半導体装置 |
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JP6642719B2 (ja) * | 2016-08-10 | 2020-02-12 | 三菱電機株式会社 | 半導体装置 |
DE102016123917A1 (de) * | 2016-12-09 | 2018-06-14 | Endress+Hauser SE+Co. KG | Elektronik-Baugruppe |
JP2019054069A (ja) * | 2017-09-14 | 2019-04-04 | 株式会社東芝 | 半導体装置 |
DE102018212272A1 (de) * | 2018-07-24 | 2020-01-30 | Robert Bosch Gmbh | Keramischer Schaltungsträger und Elektronikeinheit |
JP7279324B2 (ja) * | 2018-09-14 | 2023-05-23 | 富士電機株式会社 | 半導体モジュール |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62120037A (ja) * | 1985-11-20 | 1987-06-01 | Furukawa Electric Co Ltd:The | 半導体装置 |
JPS63296250A (ja) * | 1987-05-27 | 1988-12-02 | Mitsubishi Electric Corp | 半導体装置 |
JPS6425554A (en) * | 1987-07-22 | 1989-01-27 | Denki Kagaku Kogyo Kk | High power circuit board and hybrid integrated circuit thereof |
JPH05166968A (ja) * | 1991-12-17 | 1993-07-02 | Mitsubishi Materials Corp | 半導体装置の実装構造 |
JP2003078086A (ja) * | 2001-09-04 | 2003-03-14 | Kubota Corp | 半導体素子モジュール基板の積層構造 |
JP2006114641A (ja) * | 2004-10-14 | 2006-04-27 | Mitsubishi Electric Corp | 半導体装置 |
JP2010199251A (ja) * | 2009-02-25 | 2010-09-09 | Hitachi Ltd | 半導体装置の製造方法 |
JP2012028561A (ja) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | 半導体装置 |
WO2012157584A1 (ja) * | 2011-05-13 | 2012-11-22 | 富士電機株式会社 | 半導体装置とその製造方法 |
JP2013229545A (ja) * | 2012-03-30 | 2013-11-07 | Mitsubishi Materials Corp | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1132961B1 (en) * | 1991-07-24 | 2011-01-05 | Denki Kagaku Kogyo Kabushiki Kaisha | Method for producing a circuit substrate having a mounted semiconductor element |
JPH07231015A (ja) * | 1994-02-17 | 1995-08-29 | Sanyo Electric Co Ltd | 半導体装置及びその製造方法 |
JP4325571B2 (ja) * | 2005-02-28 | 2009-09-02 | 株式会社日立製作所 | 電子装置の製造方法 |
CN101401197B (zh) * | 2006-03-08 | 2011-05-18 | 株式会社东芝 | 电子元器件模块 |
JP2008147307A (ja) | 2006-12-07 | 2008-06-26 | Hitachi Metals Ltd | 回路基板およびこれを用いた半導体モジュール |
JP2009283741A (ja) * | 2008-05-23 | 2009-12-03 | Fuji Electric Device Technology Co Ltd | 半導体装置 |
DE102009033029A1 (de) * | 2009-07-02 | 2011-01-05 | Electrovac Ag | Elektronische Vorrichtung |
DE102009045181B4 (de) * | 2009-09-30 | 2020-07-09 | Infineon Technologies Ag | Leistungshalbleitermodul |
US8603862B2 (en) * | 2010-05-14 | 2013-12-10 | International Business Machines Corporation | Precise-aligned lock-and-key bonding structures |
JP2013016629A (ja) * | 2011-07-04 | 2013-01-24 | Mitsubishi Electric Corp | 半導体モジュール |
US8975117B2 (en) * | 2012-02-08 | 2015-03-10 | Infineon Technologies Ag | Semiconductor device using diffusion soldering |
JP6044097B2 (ja) * | 2012-03-30 | 2016-12-14 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板、冷却器付パワーモジュール用基板及びパワーモジュール |
US9087833B2 (en) * | 2012-11-30 | 2015-07-21 | Samsung Electronics Co., Ltd. | Power semiconductor devices |
JP6230238B2 (ja) * | 2013-02-06 | 2017-11-15 | 三菱電機株式会社 | 半導体装置及びその製造方法 |
JP2014187264A (ja) * | 2013-03-25 | 2014-10-02 | Toshiba Corp | 半導体装置 |
-
2014
- 2014-02-17 JP JP2014027200A patent/JP6192561B2/ja not_active Expired - Fee Related
- 2014-11-07 US US14/535,639 patent/US20150237718A1/en not_active Abandoned
-
2015
- 2015-01-23 DE DE102015201182.8A patent/DE102015201182A1/de not_active Ceased
- 2015-02-16 CN CN201510085084.8A patent/CN104851843A/zh active Pending
Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62120037A (ja) * | 1985-11-20 | 1987-06-01 | Furukawa Electric Co Ltd:The | 半導体装置 |
JPS63296250A (ja) * | 1987-05-27 | 1988-12-02 | Mitsubishi Electric Corp | 半導体装置 |
JPS6425554A (en) * | 1987-07-22 | 1989-01-27 | Denki Kagaku Kogyo Kk | High power circuit board and hybrid integrated circuit thereof |
JPH05166968A (ja) * | 1991-12-17 | 1993-07-02 | Mitsubishi Materials Corp | 半導体装置の実装構造 |
JP2003078086A (ja) * | 2001-09-04 | 2003-03-14 | Kubota Corp | 半導体素子モジュール基板の積層構造 |
JP2006114641A (ja) * | 2004-10-14 | 2006-04-27 | Mitsubishi Electric Corp | 半導体装置 |
JP2010199251A (ja) * | 2009-02-25 | 2010-09-09 | Hitachi Ltd | 半導体装置の製造方法 |
JP2012028561A (ja) * | 2010-07-23 | 2012-02-09 | Mitsubishi Electric Corp | 半導体装置 |
WO2012157584A1 (ja) * | 2011-05-13 | 2012-11-22 | 富士電機株式会社 | 半導体装置とその製造方法 |
JP2013229545A (ja) * | 2012-03-30 | 2013-11-07 | Mitsubishi Materials Corp | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法 |
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CN104851843A (zh) | 2015-08-19 |
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