JP2015130439A - エッチング液、エッチング方法、およびはんだバンプの製造方法 - Google Patents
エッチング液、エッチング方法、およびはんだバンプの製造方法 Download PDFInfo
- Publication number
- JP2015130439A JP2015130439A JP2014001837A JP2014001837A JP2015130439A JP 2015130439 A JP2015130439 A JP 2015130439A JP 2014001837 A JP2014001837 A JP 2014001837A JP 2014001837 A JP2014001837 A JP 2014001837A JP 2015130439 A JP2015130439 A JP 2015130439A
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- Prior art keywords
- layer
- etching
- acid
- copper
- etching solution
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 title claims abstract description 119
- 238000000034 method Methods 0.000 title claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 title claims description 30
- 239000010949 copper Substances 0.000 claims abstract description 87
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 86
- 229910052802 copper Inorganic materials 0.000 claims abstract description 84
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims abstract description 78
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 claims abstract description 70
- 229910017052 cobalt Inorganic materials 0.000 claims abstract description 47
- 239000010941 cobalt Substances 0.000 claims abstract description 47
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims abstract description 47
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims abstract description 36
- 235000015165 citric acid Nutrition 0.000 claims abstract description 26
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims abstract description 24
- 239000002253 acid Substances 0.000 claims abstract description 18
- 235000006408 oxalic acid Nutrition 0.000 claims abstract description 12
- BJEPYKJPYRNKOW-REOHCLBHSA-N (S)-malic acid Chemical compound OC(=O)[C@@H](O)CC(O)=O BJEPYKJPYRNKOW-REOHCLBHSA-N 0.000 claims abstract description 11
- BJEPYKJPYRNKOW-UHFFFAOYSA-N alpha-hydroxysuccinic acid Natural products OC(=O)C(O)CC(O)=O BJEPYKJPYRNKOW-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000001630 malic acid Substances 0.000 claims abstract description 11
- 235000011090 malic acid Nutrition 0.000 claims abstract description 11
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 claims description 21
- 239000003002 pH adjusting agent Substances 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- KRKNYBCHXYNGOX-UHFFFAOYSA-K Citrate Chemical compound [O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O KRKNYBCHXYNGOX-UHFFFAOYSA-K 0.000 claims description 7
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 7
- 238000004519 manufacturing process Methods 0.000 claims description 6
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 5
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 claims description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N ammonia Natural products N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 4
- 235000011114 ammonium hydroxide Nutrition 0.000 claims description 4
- 150000002500 ions Chemical class 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000243 solution Substances 0.000 claims 10
- 239000007864 aqueous solution Substances 0.000 claims 3
- 239000003513 alkali Substances 0.000 claims 1
- 230000004888 barrier function Effects 0.000 description 22
- 229960004106 citric acid Drugs 0.000 description 21
- 239000000758 substrate Substances 0.000 description 19
- 238000010586 diagram Methods 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- 239000002184 metal Substances 0.000 description 16
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 7
- 238000001039 wet etching Methods 0.000 description 6
- 238000012795 verification Methods 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 3
- 239000005751 Copper oxide Substances 0.000 description 3
- 229910020888 Sn-Cu Inorganic materials 0.000 description 3
- 229910019204 Sn—Cu Inorganic materials 0.000 description 3
- -1 citrate ions Chemical class 0.000 description 3
- 229910000431 copper oxide Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052763 palladium Inorganic materials 0.000 description 3
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 description 3
- YASYEJJMZJALEJ-UHFFFAOYSA-N Citric acid monohydrate Chemical compound O.OC(=O)CC(O)(C(O)=O)CC(O)=O YASYEJJMZJALEJ-UHFFFAOYSA-N 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- 229910001128 Sn alloy Inorganic materials 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229960002303 citric acid monohydrate Drugs 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 239000001508 potassium citrate Substances 0.000 description 2
- 229960002635 potassium citrate Drugs 0.000 description 2
- QEEAPRPFLLJWCF-UHFFFAOYSA-K potassium citrate (anhydrous) Chemical compound [K+].[K+].[K+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O QEEAPRPFLLJWCF-UHFFFAOYSA-K 0.000 description 2
- 235000011082 potassium citrates Nutrition 0.000 description 2
- 239000001509 sodium citrate Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- YWYZEGXAUVWDED-UHFFFAOYSA-N triammonium citrate Chemical compound [NH4+].[NH4+].[NH4+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O YWYZEGXAUVWDED-UHFFFAOYSA-N 0.000 description 2
- 229910001316 Ag alloy Inorganic materials 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 244000141359 Malus pumila Species 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCEUXSAXTBNJGO-UHFFFAOYSA-N [Ag].[Sn] Chemical compound [Ag].[Sn] QCEUXSAXTBNJGO-UHFFFAOYSA-N 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 235000021016 apples Nutrition 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- QOSATHPSBFQAML-UHFFFAOYSA-N hydrogen peroxide;hydrate Chemical compound O.OO QOSATHPSBFQAML-UHFFFAOYSA-N 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76883—Post-treatment or after-treatment of the conductive material
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/02—Polishing compositions containing abrasives or grinding agents
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09G—POLISHING COMPOSITIONS; SKI WAXES
- C09G1/00—Polishing compositions
- C09G1/04—Aqueous dispersions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/02—Etching, surface-brightening or pickling compositions containing an alkali metal hydroxide
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- C—CHEMISTRY; METALLURGY
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/06—Etching, surface-brightening or pickling compositions containing an inorganic acid with organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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- C23F1/18—Acidic compositions for etching copper or alloys thereof
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
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- C23F1/44—Compositions for etching metallic material from a metallic material substrate of different composition
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32134—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by liquid etching only
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
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- H01L21/76877—Filling of holes, grooves or trenches, e.g. vias, with conductive material
- H01L21/76879—Filling of holes, grooves or trenches, e.g. vias, with conductive material by selective deposition of conductive material in the vias, e.g. selective C.V.D. on semiconductor material, plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
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- H—ELECTRICITY
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/03—Manufacturing methods
- H01L2224/034—Manufacturing methods by blanket deposition of the material of the bonding area
- H01L2224/03444—Manufacturing methods by blanket deposition of the material of the bonding area in gaseous form
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/03614—Physical or chemical etching by chemical means only
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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- H01L2224/03—Manufacturing methods
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Abstract
【解決手段】本発明のエッチング液は、銅層4とコバルト層6とを含む積層構造において、前記銅層4をエッチングするためのエッチング液である。このエッチング液は、クエン酸、シュウ酸、リンゴ酸、およびマロン酸からなる群から選ばれた少なくとも1つの酸と、過酸化水素とを含み、pHが4.3〜5.5の範囲に調整されている。
【選択図】図10
Description
本発明の好ましい態様は、前記少なくとも1つの酸は、クエン酸であり、クエン酸イオン濃度が、0.2mol/L以上であることを特徴とする。
本発明の好ましい態様は、前記過酸化水素の濃度が、0.7重量%〜10重量%であることを特徴とする。
本発明の好ましい態様は、前記少なくとも1つの酸は、クエン酸であり、クエン酸イオン濃度が、0.2mol/L以上であることを特徴とする。
本発明の好ましい態様は、前記過酸化水素の濃度が、0.7重量%〜10重量%であることを特徴とする。
図1は、本発明の一実施形態に係るエッチング液が適用される積層構造の一例を示す図である。図1に示されるように、シリコン基板1上には絶縁層2が形成され、絶縁層2上にバリアメタル層3が形成され、さらにバリアメタル層3上に銅シード層4が形成されている。バリアメタル層3および銅シード層4は、それぞれスパッタリング法により成膜される。銅シード層4の所定の位置には、銅バンプ層5、コバルトから成るバリア層であるコバルト層6、およびはんだ層7がこの順に積層される。このような積層構造が形成された基板を、硫酸と過酸化水素とを含む従来のエッチング液に接触させると、図2に示されるように、最もイオン化しやすいコバルト層6が優先的に溶け出してしまい、銅シード層4が全くエッチングされないという問題があった。これは、硫酸と過酸化水素からなる強酸性のエッチング液を使用すると、異種金属の接触による局部電池効果により、銅よりもコバルトが先に溶解してしまうことによると考えられる。
実験に用意された試料は、図1と同じ積層構造を有し、次のようにして製造されたものである。すなわち、厚さ250nmの銅シード層4上に、直径100μmの開口が形成されたレジスト(図示せず)を形成し、当該開口に、電解めっきで銅バンプ層5を20μm形成する。銅バンプ層5上に、コバルトから成るバリア層としてのコバルト層6を電解めっきで5μm形成し、さらに、コバルト層6の上に、電解めっきで、錫と銅の合金(Sn−Cu合金)から成るはんだ層7を10μm形成する。レジストは、銅バンプ層5、コバルト層6、およびはんだ層7を積層した後に、レジスト剥離液で除去される。
上記した試料と同一の試料を用意し、当該試料を、濃度50g/Lのクエン酸1水和物および濃度1.5重量%の過酸化水素を含むエッチング液に600秒間浸漬した。このエッチング溶液のpHは、1.6であった。試料を洗浄、乾燥した後、試料のエッチング後の断面を観察した。この断面の模式図が図9に示される。図9に示されるように、比較例2におけるコバルト層6は、エッチング液に溶解しており、銅シード層4は、エッチングされていなかった。これらの実験結果から、クエン酸と過酸化水素を添加しただけのエッチング液では、コバルト層6がエッチングされてしまうことが分かる。
上記した試料と同一の試料を用意し、当該試料を、濃度20.4g/Lのクエン酸1水和物、濃度41.1g/Lのクエン酸3ナトリウム2水和物、および濃度1.5重量%の過酸化水素を含むエッチング液に600秒間浸漬した。このエッチング液のpHは、5.3であった。また、このエッチング液中のクエン酸イオンの濃度は、比較例2のクエン酸イオン濃度と同等である。試料を洗浄、乾燥した後、試料のエッチング後の断面を観察した。この断面の模式図が図10に示される。図10に示されるように、コバルト層6およびはんだ層7は、エッチング液に溶解しない一方で、銅シード層4は、エッチングされ、除去されていた。以上の実験結果から、クエン酸と過酸化水素を含むエッチング液を使用し、且つ、エッチング液のpHを所定の範囲(4.3〜5.5)に調整することで、コバルト層6が溶解せずに、銅シード層4のみをエッチングできることが分かる。
2 絶縁層
3 バリアメタル層
4 銅シード層
5 銅バンプ層
6 コバルト(バリア層)
7 はんだ層
8 バリア層
9 レジスト
10 レジスト開口
Claims (9)
- 銅層とコバルト層とを含む積層構造において、前記銅層をエッチングするためのエッチング液であって、
クエン酸、シュウ酸、リンゴ酸、およびマロン酸からなる群から選ばれた少なくとも1つの酸と、過酸化水素とを含み、pHが4.3〜5.5の範囲に調整されていることを特徴とするエッチング液。 - pH調整剤をさらに含み、前記pH調整剤が水酸化ナトリウム水溶液、水酸化カリウム水溶液、アンモニア水溶液、およびアルカリイオン水のうちの少なくとも1つであることを特徴とする請求項1に記載のエッチング液。
- 前記少なくとも1つの酸は、クエン酸であり、
クエン酸イオン濃度が、0.2mol/L以上であることを特徴とする請求項1または2に記載のエッチング液。 - 前記過酸化水素の濃度が、0.7重量%〜10重量%であることを特徴とする請求項1乃至3のいずれか一項に記載のエッチング液。
- クエン酸、シュウ酸、リンゴ酸、およびマロン酸からなる群から選ばれた少なくとも1つの酸と、過酸化水素とを含み、pHが4.3〜5.5の範囲に調整されているエッチング液を用意し、
銅層とコバルト層とを含む積層構造を前記エッチング液に接触させることにより、前記銅層をエッチングすることを特徴とするエッチング方法。 - 前記エッチング液は、pH調整剤をさらに含み、前記pH調整剤が水酸化ナトリウム水溶液、水酸化カリウム水溶液、アンモニア水溶液、およびアルカリイオン水のうちの少なくとも1つであることを特徴とする請求項5に記載のエッチング方法。
- 前記少なくとも1つの酸は、クエン酸であり、
クエン酸イオン濃度が、0.2mol/L以上であることを特徴とする請求項5または6に記載のエッチング方法。 - 前記過酸化水素の濃度が、0.7重量%〜10重量%であることを特徴とする請求項5乃至7のいずれか一項に記載のエッチング方法。
- 銅シード層上にレジストを塗布する工程と、
前記レジストを露光および現像して、前記レジストに開口を形成する工程と、
前記開口内に、銅バンプ層、コバルト層、およびはんだ層をそれぞれこの順に電解めっきにより積層する工程と、
前記レジストを除去する工程と、
前記銅シード層の露出部を、請求項1乃至4のいずれか一項に記載のエッチング液に接触させて、前記銅シード層の露出部をエッチングする工程と、
を含むはんだバンプの製造方法。
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US14/589,993 US20150191830A1 (en) | 2014-01-08 | 2015-01-05 | Etching liquid, etching method, and method of manufacturing solder bump |
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Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001187879A (ja) * | 1999-12-28 | 2001-07-10 | Nec Corp | 化学的機械的研磨用スラリー |
JP2006245288A (ja) * | 2005-03-03 | 2006-09-14 | Casio Micronics Co Ltd | バンプの形成方法及び半導体装置 |
JP2007520871A (ja) * | 2003-06-06 | 2007-07-26 | アプライド マテリアルズ インコーポレイテッド | 研磨用組成物及び導電性材料研磨方法 |
JP2009503908A (ja) * | 2005-08-04 | 2009-01-29 | アプライド マテリアルズ インコーポレイテッド | 基板を研磨するための方法及び組成物 |
JP2009088266A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 研磨液 |
JP2010265524A (ja) * | 2009-05-15 | 2010-11-25 | Kanto Chem Co Inc | 銅含有積層膜用エッチング液 |
JP2011003665A (ja) * | 2009-06-17 | 2011-01-06 | Jsr Corp | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法 |
WO2011074589A1 (ja) * | 2009-12-15 | 2011-06-23 | 三菱瓦斯化学株式会社 | エッチング液及びこれを用いた半導体装置の製造方法 |
JP2012015353A (ja) * | 2010-07-01 | 2012-01-19 | Hitachi Chem Co Ltd | Cmp用研磨液及びこの研磨液を用いた研磨方法 |
JP2013120885A (ja) * | 2011-12-08 | 2013-06-17 | Hitachi Chemical Co Ltd | Cmp用研磨液及びこの研磨液を用いた研磨方法 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20070290166A1 (en) * | 2001-03-14 | 2007-12-20 | Liu Feng Q | Method and composition for polishing a substrate |
CN101636465A (zh) * | 2007-01-31 | 2010-01-27 | 高级技术材料公司 | 用于化学机械抛光浆料应用的聚合物-二氧化硅分散剂的稳定化 |
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Patent Citations (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001187879A (ja) * | 1999-12-28 | 2001-07-10 | Nec Corp | 化学的機械的研磨用スラリー |
JP2007520871A (ja) * | 2003-06-06 | 2007-07-26 | アプライド マテリアルズ インコーポレイテッド | 研磨用組成物及び導電性材料研磨方法 |
JP2006245288A (ja) * | 2005-03-03 | 2006-09-14 | Casio Micronics Co Ltd | バンプの形成方法及び半導体装置 |
JP2009503908A (ja) * | 2005-08-04 | 2009-01-29 | アプライド マテリアルズ インコーポレイテッド | 基板を研磨するための方法及び組成物 |
JP2009088266A (ja) * | 2007-09-28 | 2009-04-23 | Fujifilm Corp | 研磨液 |
JP2010265524A (ja) * | 2009-05-15 | 2010-11-25 | Kanto Chem Co Inc | 銅含有積層膜用エッチング液 |
JP2011003665A (ja) * | 2009-06-17 | 2011-01-06 | Jsr Corp | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法 |
WO2011074589A1 (ja) * | 2009-12-15 | 2011-06-23 | 三菱瓦斯化学株式会社 | エッチング液及びこれを用いた半導体装置の製造方法 |
JP2012015353A (ja) * | 2010-07-01 | 2012-01-19 | Hitachi Chem Co Ltd | Cmp用研磨液及びこの研磨液を用いた研磨方法 |
JP2013120885A (ja) * | 2011-12-08 | 2013-06-17 | Hitachi Chemical Co Ltd | Cmp用研磨液及びこの研磨液を用いた研磨方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3792000A1 (en) | 2014-11-07 | 2021-03-17 | Fujimi Incorporated | Polishing method and polishing composition |
EP4163057A1 (en) | 2014-11-07 | 2023-04-12 | Fujimi Incorporated | Polishing method and polishing composition |
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US9633898B2 (en) | 2017-04-25 |
US20160042993A1 (en) | 2016-02-11 |
JP6251043B2 (ja) | 2017-12-20 |
US20150191830A1 (en) | 2015-07-09 |
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