JP2015037194A - 半導体ディスクの後ドーピング方法 - Google Patents
半導体ディスクの後ドーピング方法 Download PDFInfo
- Publication number
- JP2015037194A JP2015037194A JP2014164452A JP2014164452A JP2015037194A JP 2015037194 A JP2015037194 A JP 2015037194A JP 2014164452 A JP2014164452 A JP 2014164452A JP 2014164452 A JP2014164452 A JP 2014164452A JP 2015037194 A JP2015037194 A JP 2015037194A
- Authority
- JP
- Japan
- Prior art keywords
- doping
- semiconductor disk
- semiconductor
- bulk
- doping concentration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 260
- 238000000034 method Methods 0.000 title claims abstract description 133
- 238000002347 injection Methods 0.000 claims abstract description 39
- 239000007924 injection Substances 0.000 claims abstract description 39
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 14
- 239000001257 hydrogen Substances 0.000 claims abstract description 14
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 13
- 230000006978 adaptation Effects 0.000 claims abstract 4
- 239000013078 crystal Substances 0.000 claims description 31
- 238000005259 measurement Methods 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 5
- 125000004437 phosphorous atom Chemical group 0.000 claims description 3
- 238000001514 detection method Methods 0.000 abstract description 3
- 239000000243 solution Substances 0.000 abstract 1
- 238000002513 implantation Methods 0.000 description 26
- 238000004519 manufacturing process Methods 0.000 description 20
- 210000000746 body region Anatomy 0.000 description 15
- 238000001465 metallisation Methods 0.000 description 10
- 239000002019 doping agent Substances 0.000 description 7
- 238000009792 diffusion process Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 5
- 230000004913 activation Effects 0.000 description 4
- 239000007943 implant Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- XUIMIQQOPSSXEZ-AKLPVKDBSA-N silicon-31 atom Chemical compound [31Si] XUIMIQQOPSSXEZ-AKLPVKDBSA-N 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- 229910052698 phosphorus Inorganic materials 0.000 description 2
- 239000011574 phosphorus Substances 0.000 description 2
- 230000002285 radioactive effect Effects 0.000 description 2
- FARHYDJOXLCMRP-UHFFFAOYSA-N 2-[4-[2-(2,3-dihydro-1H-inden-2-ylamino)pyrimidin-5-yl]-1-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]pyrazol-3-yl]oxyacetic acid Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C=1C(=NN(C=1)CC(N1CC2=C(CC1)NN=N2)=O)OCC(=O)O FARHYDJOXLCMRP-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- -1 hydrogen ions Chemical class 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000005496 tempering Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/261—Bombardment with radiation to produce a nuclear reaction transmuting chemical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/26—Bombardment with radiation
- H01L21/263—Bombardment with radiation with high-energy radiation
- H01L21/265—Bombardment with radiation with high-energy radiation producing ion implantation
- H01L21/26506—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors
- H01L21/26513—Bombardment with radiation with high-energy radiation producing ion implantation in group IV semiconductors of electrically active species
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/36—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the concentration or distribution of impurities in the bulk material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/30—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface
- H01L29/32—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by physical imperfections; having polished or roughened surface the imperfections being within the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66234—Bipolar junction transistors [BJT]
- H01L29/66325—Bipolar junction transistors [BJT] controlled by field-effect, e.g. insulated gate bipolar transistors [IGBT]
- H01L29/66333—Vertical insulated gate bipolar transistors
- H01L29/66348—Vertical insulated gate bipolar transistors with a recessed gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66674—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/66712—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/66734—Vertical DMOS transistors, i.e. VDMOS transistors with a step of recessing the gate electrode, e.g. to form a trench gate electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/72—Transistor-type devices, i.e. able to continuously respond to applied control signals
- H01L29/739—Transistor-type devices, i.e. able to continuously respond to applied control signals controlled by field-effect, e.g. bipolar static induction transistors [BSIT]
- H01L29/7393—Insulated gate bipolar mode transistors, i.e. IGBT; IGT; COMFET
- H01L29/7395—Vertical transistors, e.g. vertical IGBT
- H01L29/7396—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions
- H01L29/7397—Vertical transistors, e.g. vertical IGBT with a non planar surface, e.g. with a non planar gate or with a trench or recess or pillar in the surface of the emitter, base or collector region for improving current density or short circuiting the emitter and base regions and a gate structure lying on a slanted or vertical surface or formed in a groove, e.g. trench gate IGBT
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/70—Bipolar devices
- H01L29/74—Thyristor-type devices, e.g. having four-zone regenerative action
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/7801—DMOS transistors, i.e. MISFETs with a channel accommodating body or base region adjoining a drain drift region
- H01L29/7802—Vertical DMOS transistors, i.e. VDMOS transistors
- H01L29/7813—Vertical DMOS transistors, i.e. VDMOS transistors with trench gate electrode, e.g. UMOS transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/8611—Planar PN junction diodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/86—Types of semiconductor device ; Multistep manufacturing processes therefor controllable only by variation of the electric current supplied, or only the electric potential applied, to one or more of the electrodes carrying the current to be rectified, amplified, oscillated or switched
- H01L29/861—Diodes
- H01L29/872—Schottky diodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- High Energy & Nuclear Physics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Toxicology (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Thyristors (AREA)
Abstract
Description
NGES=NG+NH (1)
ここで、NGESは全ドーピング濃度、NGはバルクドーピングのドーピング濃度そしてNHは後ドーピングによって付加されるドーピング濃度である。
検出されたバルクドーピング:3.08E13cm−3(140Ohm−cm)
注入エネルギー:4MeV
注入線量:1E14cm−2
温度プロセスの時間:10時間
温度プロセスの温度:505°C
検出されたバルクドーピング:2.16E13cm−3(200Ohm−cm)
注入エネルギー:4MeV
注入線量:1.5E14cm−2
温度プロセスの時間:8時間
温度プロセスの温度:500°C
NGES=NG+NN (2)
が当てはまる。この場合、NGESは後ドーピングの実施後の全バルクドーピング、NGは後ドーピングの前のバルクドーピング、そしてNNは中性子注入によって生じる後ドーピングである。
Claims (23)
- バルクドーピングを有する半導体ディスク(100)を処理するための方法であって、この方法が、
前記バルクドーピングのドーピング濃度の検出と、
後ドーピングによる前記半導体ディスク(100)の前記バルクドーピングの適合と、を含み、前記後ドーピングが、
水素誘導のドナーを発生するための陽子注入および後続の温度プロセスと、
中性子照射と、
の少なくとも1つの方法を含み、
この場合、次のパラメータ、すなわち
陽子注入の注入線量、
温度プロセスの温度、
中性子照射の照射線量
の少なくとも1つが、前記バルクドーピングの検出されたドーピング濃度に依存する、
上記方法。 - アニーリングステップ中の温度が400°Cと570°Cの間または450°Cと550°Cの間である、請求項1に記載の方法。
- 前記温度プロセスの時間が1時間と10時間の間あるいは3時間と6時間の間である、請求項2に記載の方法。
- 前記中性子照射の後で温度プロセスが実施され、この温度プロセスにおいて前記半導体ディスクが800°Cと1000°Cの間の温度に加熱される、請求項1に記載の方法。
- 前記温度プロセスの時間が1時間と10時間の間である、請求項4に記載の方法。
- 前記半導体ディスク(100)が第1の側(101)を有し、陽子注入がこの第1の側(101)から行われる、請求項1に記載の方法。
- 前記陽子注入が少なくとも2つの陽子注入ステップを含み、この陽子注入ステップにおいて陽子が異なる注入エネルギーで注入されることを特徴とする請求項6に記載の方法。
- 前記半導体ディスク(100)が第1の側(101)を有し、前記中性子照射がこの第1の側(101)から行われる、請求項1に記載の方法。
- 前記半導体ディスク(100)が単結晶(10)の一部であり、この単結晶が少なくとも2つの半導体ディスクを有し、かつ第1の側(101)を有し、
前記中性子照射が前記単結晶(10)の前記第1の側(101)から行われる、請求項1に記載の方法。 - 前記半導体ディスク(100)のバルクドーピングのドーピング濃度の検出が、前記半導体ディスクの比抵抗の測定を含んでいる、請求項1〜9のいずれか一項に記載の方法。
- 前記半導体ディスク(100)が円筒状単結晶の分割によって得られた半導体ディスク(100)であり、
前記比抵抗の測定が前記単結晶の分割の後で行われる、請求項10に記載の方法。 - 前記半導体ディスク(100)が円筒状単結晶の分割によって得られた半導体ディスク(100)であり、
前記比抵抗の測定が前記単結晶の分割の前に行われる、請求項10に記載の方法。 - 前記バルクドーピングがn型バルクドーピングである、請求項1〜12のいずれか一項に記載の方法。
- 前記バルクドーピングが燐原子によって形成されている、請求項13に記載の方法。
- 前記バルクドーピングがp型バルクドーピングである、請求項1〜12のいずれか一項に記載の方法。
- 前記バルクドーピングのドーピング濃度が1E13cm−3よりも大きい、請求項11または12に記載の方法。
- 前記バルクドーピングのドーピング濃度が1E12cm−3よりも大きい、請求項16に記載の方法。
- 前記適合前の前記バルクドーピングのドーピング濃度が、前記適合後の前記ドーピング濃度の20%、40%または60%である、請求項1〜17のいずれか一項に記載の方法。
- 陽子が前記陽子注入中に前記半導体ディスクの第1の側から前記半導体ディスクのエンド−オブ−レンジ−範囲に注入され、
前記適合によって追加されるドーピング濃度が前記エンド−オブ−レンジ−範囲と前記第1の側との間の範囲において前記半導体ディスクの容積の少なくとも60%または少なくとも80%において均質化されるように、温度プロセスが選定されている、請求項1〜18のいずれか一項に記載の方法。 - 少なくともほぼ均質にドーピングされた容積内の最大ドーピング濃度と最小ドーピング濃度の間の比が、3よりも小さい、2よりも小さい、1.5よりも小さいまたは1.2よりも小さい、請求項17に記載の方法。
- 陽子が前記陽子注入中に前記半導体ディスクの第1の側からエンド−オブ−レンジ−範囲に注入され、
前記半導体ディスクが前記の第1の側とは反対の第2の側から出発して少なくともエンド−オブ−レンジ−範囲まで切除される、請求項1〜20のいずれか一項に記載の方法。 - 前記半導体ディスクがMCZ法に従って作られた半導体ディスクである、請求項1〜21のいずれか一項に記載の方法。
- 前記半導体ディスクが12インチ以上の直径を有する、請求項1〜22のいずれか一項に記載の方法。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102013216195.6 | 2013-08-14 | ||
DE102013216195.6A DE102013216195B4 (de) | 2013-08-14 | 2013-08-14 | Verfahren zur Nachdotierung einer Halbleiterscheibe |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015037194A true JP2015037194A (ja) | 2015-02-23 |
JP6100217B2 JP6100217B2 (ja) | 2017-03-22 |
Family
ID=52430251
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014164452A Active JP6100217B2 (ja) | 2013-08-14 | 2014-08-12 | 半導体ウェハの後ドーピング方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US9245811B2 (ja) |
JP (1) | JP6100217B2 (ja) |
DE (1) | DE102013216195B4 (ja) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017063187A (ja) * | 2015-08-26 | 2017-03-30 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体デバイス、シリコンウェハ、及びシリコンウェハの製造方法 |
JP2018195806A (ja) * | 2017-04-24 | 2018-12-06 | インフィネオン テクノロジーズ アクチエンゲゼルシャフトInfineon Technologies AG | 半導体ウェハの中性子照射ドーピングのための装置および方法 |
WO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
WO2021199687A1 (ja) * | 2020-04-02 | 2021-10-07 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
DE112020001043T5 (de) | 2019-10-11 | 2021-12-23 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und herstellungsverfahren einer halbleitervorrichtung |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102013216195B4 (de) * | 2013-08-14 | 2015-10-29 | Infineon Technologies Ag | Verfahren zur Nachdotierung einer Halbleiterscheibe |
JP6558367B2 (ja) * | 2014-06-13 | 2019-08-14 | 住友電気工業株式会社 | 半導体積層体、半導体積層体の製造方法および半導体装置の製造方法 |
US9779931B2 (en) * | 2015-10-08 | 2017-10-03 | Infineon Technologies Ag | Method of manufacturing semiconductor wafers and method of manufacturing a semiconductor device |
DE102016112049B3 (de) | 2016-06-30 | 2017-08-24 | Infineon Technologies Ag | Verfahren zum herstellen von cz-siliziumwafern und verfahren zum herstellen einer halbleitervorrichtung |
WO2019142249A1 (ja) * | 2018-01-17 | 2019-07-25 | 株式会社Fuji | スプライシング装置 |
DE112019000094T5 (de) | 2018-03-19 | 2020-09-24 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und verfahren zum herstellen einerhalbleitervorrichtung |
JP7067636B2 (ja) | 2018-10-18 | 2022-05-16 | 富士電機株式会社 | 半導体装置および製造方法 |
CN112204710A (zh) | 2018-12-28 | 2021-01-08 | 富士电机株式会社 | 半导体装置及制造方法 |
WO2020230900A1 (ja) | 2019-05-16 | 2020-11-19 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
CN113711364A (zh) | 2019-10-11 | 2021-11-26 | 富士电机株式会社 | 半导体装置和半导体装置的制造方法 |
CN114467182A (zh) | 2020-04-01 | 2022-05-10 | 富士电机株式会社 | 半导体装置及半导体装置的制造方法 |
JP7452632B2 (ja) | 2020-04-01 | 2024-03-19 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53135262A (en) * | 1977-04-30 | 1978-11-25 | Fujitsu Ltd | Composition determing method of multi semi-conductor crystal |
JPS59187271A (ja) * | 1983-04-08 | 1984-10-24 | Hitachi Ltd | 比抵抗測定方法およびその装置 |
JPS6038815A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | 半導体基板の製造方法 |
JPH04132693A (ja) * | 1990-09-21 | 1992-05-06 | Shin Etsu Handotai Co Ltd | 中性子照射シリコン単結晶の熱処理方法 |
JPH10112441A (ja) * | 1996-08-29 | 1998-04-28 | Ind Technol Res Inst | リンをドーピングしたシリコンの製造法 |
JP2000331950A (ja) * | 1999-05-17 | 2000-11-30 | Sony Corp | 半導体への不純物ドーピング方法及び半導体装置製造方法 |
JP2002076080A (ja) * | 2000-08-31 | 2002-03-15 | Shin Etsu Handotai Co Ltd | 半導体シリコン基板の抵抗率測定方法、半導体シリコン基板の導電型判定方法、及び半導体シリコン基板の製造方法 |
JP2003505860A (ja) * | 1999-07-14 | 2003-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 中性子変質を使用する電荷補償半導体素子の製造方法 |
JP2004224582A (ja) * | 2003-01-20 | 2004-08-12 | Shin Etsu Handotai Co Ltd | 単結晶の製造方法 |
JP2005012090A (ja) * | 2003-06-20 | 2005-01-13 | Toshiba Corp | 半導体ウェーハの製造方法及び半導体装置の製造方法 |
JP2006344977A (ja) * | 2005-06-08 | 2006-12-21 | Infineon Technologies Ag | 阻止ゾーンを半導体基板に製造する方法、および、阻止ゾーンを有する半導体部品 |
JP2006352131A (ja) * | 2005-06-14 | 2006-12-28 | Siltron Inc | 結晶成長されたインゴットの品質評価方法 |
WO2007055352A1 (ja) * | 2005-11-14 | 2007-05-18 | Fuji Electric Device Technology Co., Ltd. | 半導体装置およびその製造方法 |
JP2012129308A (ja) * | 2010-12-14 | 2012-07-05 | Sumco Techxiv株式会社 | 半導体ウェーハの製造方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE2362264B2 (de) * | 1973-12-14 | 1977-11-03 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zum herstellen von homogen n-dotierten siliciumeinkristallen durch bestrahlung mit thermischen neutronen |
US4135951A (en) * | 1977-06-13 | 1979-01-23 | Monsanto Company | Annealing method to increase minority carrier life-time for neutron transmutation doped semiconductor materials |
US4129463A (en) * | 1977-06-29 | 1978-12-12 | The United States Of America As Represented By The United States Department Of Energy | Polycrystalline silicon semiconducting material by nuclear transmutation doping |
US4348351A (en) * | 1980-04-21 | 1982-09-07 | Monsanto Company | Method for producing neutron doped silicon having controlled dopant variation |
US4762802A (en) * | 1984-11-09 | 1988-08-09 | American Telephone And Telegraph Company At&T, Bell Laboratories | Method for preventing latchup in CMOS devices |
DE3531631A1 (de) * | 1985-09-05 | 1987-03-05 | Licentia Gmbh | Asymmetrischer thyristor und verfahren zu seiner herstellung |
JP2635450B2 (ja) * | 1991-03-26 | 1997-07-30 | 信越半導体株式会社 | 中性子照射用原料czシリコン単結晶 |
JP2000082679A (ja) * | 1998-07-08 | 2000-03-21 | Canon Inc | 半導体基板とその作製方法 |
US7074697B2 (en) * | 1999-10-01 | 2006-07-11 | The Regents Of The University Of California | Doping-assisted defect control in compound semiconductors |
DE102007033873A1 (de) * | 2007-07-20 | 2009-01-22 | Infineon Technologies Austria Ag | Verfahren zur Dotierung eines Halbleiterwafers und Halbleiterbauelement |
US8378384B2 (en) * | 2007-09-28 | 2013-02-19 | Infineon Technologies Ag | Wafer and method for producing a wafer |
US7879699B2 (en) * | 2007-09-28 | 2011-02-01 | Infineon Technologies Ag | Wafer and a method for manufacturing a wafer |
JP6067585B2 (ja) * | 2011-12-28 | 2017-01-25 | 富士電機株式会社 | 半導体装置および半導体装置の製造方法 |
DE102013216195B4 (de) * | 2013-08-14 | 2015-10-29 | Infineon Technologies Ag | Verfahren zur Nachdotierung einer Halbleiterscheibe |
-
2013
- 2013-08-14 DE DE102013216195.6A patent/DE102013216195B4/de active Active
-
2014
- 2014-08-08 US US14/454,741 patent/US9245811B2/en active Active
- 2014-08-12 JP JP2014164452A patent/JP6100217B2/ja active Active
-
2015
- 2015-12-09 US US14/963,855 patent/US9559020B2/en active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53135262A (en) * | 1977-04-30 | 1978-11-25 | Fujitsu Ltd | Composition determing method of multi semi-conductor crystal |
JPS59187271A (ja) * | 1983-04-08 | 1984-10-24 | Hitachi Ltd | 比抵抗測定方法およびその装置 |
JPS6038815A (ja) * | 1983-08-12 | 1985-02-28 | Hitachi Ltd | 半導体基板の製造方法 |
JPH04132693A (ja) * | 1990-09-21 | 1992-05-06 | Shin Etsu Handotai Co Ltd | 中性子照射シリコン単結晶の熱処理方法 |
JPH10112441A (ja) * | 1996-08-29 | 1998-04-28 | Ind Technol Res Inst | リンをドーピングしたシリコンの製造法 |
JP2000331950A (ja) * | 1999-05-17 | 2000-11-30 | Sony Corp | 半導体への不純物ドーピング方法及び半導体装置製造方法 |
JP2003505860A (ja) * | 1999-07-14 | 2003-02-12 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 中性子変質を使用する電荷補償半導体素子の製造方法 |
JP2002076080A (ja) * | 2000-08-31 | 2002-03-15 | Shin Etsu Handotai Co Ltd | 半導体シリコン基板の抵抗率測定方法、半導体シリコン基板の導電型判定方法、及び半導体シリコン基板の製造方法 |
JP2004224582A (ja) * | 2003-01-20 | 2004-08-12 | Shin Etsu Handotai Co Ltd | 単結晶の製造方法 |
JP2005012090A (ja) * | 2003-06-20 | 2005-01-13 | Toshiba Corp | 半導体ウェーハの製造方法及び半導体装置の製造方法 |
JP2006344977A (ja) * | 2005-06-08 | 2006-12-21 | Infineon Technologies Ag | 阻止ゾーンを半導体基板に製造する方法、および、阻止ゾーンを有する半導体部品 |
JP2006352131A (ja) * | 2005-06-14 | 2006-12-28 | Siltron Inc | 結晶成長されたインゴットの品質評価方法 |
WO2007055352A1 (ja) * | 2005-11-14 | 2007-05-18 | Fuji Electric Device Technology Co., Ltd. | 半導体装置およびその製造方法 |
JP2012129308A (ja) * | 2010-12-14 | 2012-07-05 | Sumco Techxiv株式会社 | 半導体ウェーハの製造方法 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017063187A (ja) * | 2015-08-26 | 2017-03-30 | インフィネオン テクノロジーズ アーゲーInfineon Technologies Ag | 半導体デバイス、シリコンウェハ、及びシリコンウェハの製造方法 |
US10566424B2 (en) | 2015-08-26 | 2020-02-18 | Infineon Technologies Ag | Semiconductor device, silicon wafer and method of manufacturing a silicon wafer |
US10957767B2 (en) | 2015-08-26 | 2021-03-23 | Infineon Technologies Ag | Semiconductor device, silicon wafer and method of manufacturing a silicon wafer |
JP2018195806A (ja) * | 2017-04-24 | 2018-12-06 | インフィネオン テクノロジーズ アクチエンゲゼルシャフトInfineon Technologies AG | 半導体ウェハの中性子照射ドーピングのための装置および方法 |
US11250966B2 (en) | 2017-04-24 | 2022-02-15 | Infineon Technologies Ag | Apparatus and method for neutron transmutation doping of semiconductor wafers |
DE112020001043T5 (de) | 2019-10-11 | 2021-12-23 | Fuji Electric Co., Ltd. | Halbleitervorrichtung und herstellungsverfahren einer halbleitervorrichtung |
WO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JPWO2021186944A1 (ja) * | 2020-03-17 | 2021-09-23 | ||
JP7334849B2 (ja) | 2020-03-17 | 2023-08-29 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
WO2021199687A1 (ja) * | 2020-04-02 | 2021-10-07 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JP2021163929A (ja) * | 2020-04-02 | 2021-10-11 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
JP7264100B2 (ja) | 2020-04-02 | 2023-04-25 | 信越半導体株式会社 | シリコン単結晶基板中のドナー濃度の制御方法 |
Also Published As
Publication number | Publication date |
---|---|
US20150050754A1 (en) | 2015-02-19 |
DE102013216195A1 (de) | 2015-02-19 |
DE102013216195B4 (de) | 2015-10-29 |
JP6100217B2 (ja) | 2017-03-22 |
US20160099186A1 (en) | 2016-04-07 |
US9245811B2 (en) | 2016-01-26 |
US9559020B2 (en) | 2017-01-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6100217B2 (ja) | 半導体ウェハの後ドーピング方法 | |
US10199453B2 (en) | Semiconductor device and method for producing semiconductor device | |
US11469297B2 (en) | Semiconductor device and method for producing semiconductor device | |
US10950446B2 (en) | Manufacturing method of semiconductor device | |
US10128360B2 (en) | Semiconductor device and method for producing the same | |
US10388775B2 (en) | Semiconductor device having multiple field stop layers | |
US20190115211A1 (en) | Semiconductor device and method for manufacturing the same | |
JP5104314B2 (ja) | 半導体装置およびその製造方法 | |
JP5754545B2 (ja) | 半導体装置および半導体装置の製造方法 | |
JP6708266B2 (ja) | 半導体装置 | |
US9887125B2 (en) | Method of manufacturing a semiconductor device comprising field stop zone | |
CN107431087A (zh) | 半导体装置及其制造方法 | |
JP2007158320A (ja) | 半導体装置およびその製造方法 | |
US10074715B2 (en) | Semiconductor wafer, implantation apparatus for implanting protons and method for forming a semiconductor device | |
US8993372B2 (en) | Method for producing a semiconductor component | |
WO2021145397A1 (ja) | 半導体装置および半導体装置の製造方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20150910 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20151104 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20160204 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20160913 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20161116 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20170124 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20170222 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6100217 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |