JP2015034302A5 - - Google Patents
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- Publication number
- JP2015034302A5 JP2015034302A5 JP2014229125A JP2014229125A JP2015034302A5 JP 2015034302 A5 JP2015034302 A5 JP 2015034302A5 JP 2014229125 A JP2014229125 A JP 2014229125A JP 2014229125 A JP2014229125 A JP 2014229125A JP 2015034302 A5 JP2015034302 A5 JP 2015034302A5
- Authority
- JP
- Japan
- Prior art keywords
- sensitive adhesive
- pressure
- peeling
- peeling pressure
- adhesive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims description 27
- 239000010410 layer Substances 0.000 claims description 8
- 239000005011 phenolic resin Substances 0.000 claims description 7
- 150000003505 terpenes Chemical group 0.000 claims description 7
- 235000007586 terpenes Nutrition 0.000 claims description 7
- 239000003431 cross linking reagent Substances 0.000 claims description 6
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims 14
- 239000000178 monomer Substances 0.000 claims 10
- 239000000853 adhesive Substances 0.000 claims 5
- 230000001070 adhesive effect Effects 0.000 claims 5
- 230000009477 glass transition Effects 0.000 claims 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims 3
- 229920006243 acrylic copolymer Polymers 0.000 claims 3
- -1 alkyl acrylate ester Chemical class 0.000 claims 3
- 125000000524 functional group Chemical group 0.000 claims 3
- 229920001519 homopolymer Polymers 0.000 claims 3
- 125000000217 alkyl group Chemical group 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 claims 1
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 claims 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims 1
- 239000003985 ceramic capacitor Substances 0.000 claims 1
- 239000004088 foaming agent Substances 0.000 claims 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 claims 1
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 claims 1
- 239000004821 Contact adhesive Substances 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 239000003094 microcapsule Substances 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014229125A JP6151679B2 (ja) | 2014-11-11 | 2014-11-11 | 再剥離粘着剤組成物、粘着シート及びテープ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014229125A JP6151679B2 (ja) | 2014-11-11 | 2014-11-11 | 再剥離粘着剤組成物、粘着シート及びテープ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013151141A Division JP5700466B2 (ja) | 2013-07-19 | 2013-07-19 | 再剥離粘着剤組成物、粘着シート及びテープ |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2015034302A JP2015034302A (ja) | 2015-02-19 |
| JP2015034302A5 true JP2015034302A5 (enExample) | 2016-09-01 |
| JP6151679B2 JP6151679B2 (ja) | 2017-06-21 |
Family
ID=52543050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2014229125A Active JP6151679B2 (ja) | 2014-11-11 | 2014-11-11 | 再剥離粘着剤組成物、粘着シート及びテープ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6151679B2 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114276755B (zh) * | 2021-12-28 | 2023-10-27 | 苏州赛伍应用技术股份有限公司 | 一种胶带及其制备方法和用途 |
| CN114558763A (zh) * | 2022-03-09 | 2022-05-31 | 福州环宇工艺品有限公司 | 一种仿搪瓷工艺品及其仿旧工艺 |
| CN116515415B (zh) * | 2023-04-14 | 2024-09-10 | 太仓斯迪克新材料科技有限公司 | 耐高温紫外减粘保护膜及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000309760A (ja) * | 1999-04-26 | 2000-11-07 | Sekisui Chem Co Ltd | 両面粘着テープ |
| JP3897236B2 (ja) * | 2001-11-26 | 2007-03-22 | ソマール株式会社 | 再剥離性粘着シート |
| JP2004018604A (ja) * | 2002-06-13 | 2004-01-22 | Somar Corp | 粘着体、それを用いた加熱剥離型粘着シート |
| JP2005023286A (ja) * | 2003-07-04 | 2005-01-27 | Nitto Denko Corp | 通気性熱剥離型粘着シート |
| JP4588022B2 (ja) * | 2004-03-11 | 2010-11-24 | 日東電工株式会社 | 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法 |
| JP3765497B2 (ja) * | 2004-03-17 | 2006-04-12 | 日東電工株式会社 | アクリル系粘着剤組成物および粘着テープ |
| JP2006160872A (ja) * | 2004-12-07 | 2006-06-22 | Nitto Denko Corp | 熱剥離型粘着シート及び電子部品、回路基板 |
| JP5150118B2 (ja) * | 2007-03-26 | 2013-02-20 | ソマール株式会社 | 粘着シート |
| JP5474297B2 (ja) * | 2007-12-27 | 2014-04-16 | 日本カーバイド工業株式会社 | 粘着剤組成物および粘着シート |
| JP4988815B2 (ja) * | 2009-12-25 | 2012-08-01 | 日東電工株式会社 | チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法 |
| JP6257128B2 (ja) * | 2011-06-27 | 2018-01-10 | 日本合成化学工業株式会社 | 耐熱粘着フィルム用粘着剤組成物、これを架橋させてなる耐熱粘着フィルム用粘着剤、およびこの粘着剤の用途 |
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2014
- 2014-11-11 JP JP2014229125A patent/JP6151679B2/ja active Active
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