JP6151679B2 - 再剥離粘着剤組成物、粘着シート及びテープ - Google Patents

再剥離粘着剤組成物、粘着シート及びテープ Download PDF

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Publication number
JP6151679B2
JP6151679B2 JP2014229125A JP2014229125A JP6151679B2 JP 6151679 B2 JP6151679 B2 JP 6151679B2 JP 2014229125 A JP2014229125 A JP 2014229125A JP 2014229125 A JP2014229125 A JP 2014229125A JP 6151679 B2 JP6151679 B2 JP 6151679B2
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Prior art keywords
sensitive adhesive
peeling
pressure
peeling pressure
adhesive sheet
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Japanese (ja)
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JP2015034302A (ja
JP2015034302A5 (enExample
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川西　道朗
道朗 川西
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Nitto Denko Corp
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Nitto Denko Corp
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  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2014229125A 2014-11-11 2014-11-11 再剥離粘着剤組成物、粘着シート及びテープ Active JP6151679B2 (ja)

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JP2014229125A JP6151679B2 (ja) 2014-11-11 2014-11-11 再剥離粘着剤組成物、粘着シート及びテープ

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JP2014229125A JP6151679B2 (ja) 2014-11-11 2014-11-11 再剥離粘着剤組成物、粘着シート及びテープ

Related Parent Applications (1)

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JP2013151141A Division JP5700466B2 (ja) 2013-07-19 2013-07-19 再剥離粘着剤組成物、粘着シート及びテープ

Publications (3)

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JP2015034302A JP2015034302A (ja) 2015-02-19
JP2015034302A5 JP2015034302A5 (enExample) 2016-09-01
JP6151679B2 true JP6151679B2 (ja) 2017-06-21

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114276755B (zh) * 2021-12-28 2023-10-27 苏州赛伍应用技术股份有限公司 一种胶带及其制备方法和用途
CN114558763A (zh) * 2022-03-09 2022-05-31 福州环宇工艺品有限公司 一种仿搪瓷工艺品及其仿旧工艺
CN116515415B (zh) * 2023-04-14 2024-09-10 太仓斯迪克新材料科技有限公司 耐高温紫外减粘保护膜及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000309760A (ja) * 1999-04-26 2000-11-07 Sekisui Chem Co Ltd 両面粘着テープ
JP3897236B2 (ja) * 2001-11-26 2007-03-22 ソマール株式会社 再剥離性粘着シート
JP2004018604A (ja) * 2002-06-13 2004-01-22 Somar Corp 粘着体、それを用いた加熱剥離型粘着シート
JP2005023286A (ja) * 2003-07-04 2005-01-27 Nitto Denko Corp 通気性熱剥離型粘着シート
JP4588022B2 (ja) * 2004-03-11 2010-11-24 日東電工株式会社 加熱剥離型粘着シートおよび該加熱剥離型粘着シートを用いた被着体の加工方法
JP3765497B2 (ja) * 2004-03-17 2006-04-12 日東電工株式会社 アクリル系粘着剤組成物および粘着テープ
JP2006160872A (ja) * 2004-12-07 2006-06-22 Nitto Denko Corp 熱剥離型粘着シート及び電子部品、回路基板
JP5150118B2 (ja) * 2007-03-26 2013-02-20 ソマール株式会社 粘着シート
JP5474297B2 (ja) * 2007-12-27 2014-04-16 日本カーバイド工業株式会社 粘着剤組成物および粘着シート
JP4988815B2 (ja) * 2009-12-25 2012-08-01 日東電工株式会社 チップ保持用テープ、チップ状ワークの保持方法、チップ保持用テープを用いた半導体装置の製造方法、及び、チップ保持用テープの製造方法
JP6257128B2 (ja) * 2011-06-27 2018-01-10 日本合成化学工業株式会社 耐熱粘着フィルム用粘着剤組成物、これを架橋させてなる耐熱粘着フィルム用粘着剤、およびこの粘着剤の用途

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JP2015034302A (ja) 2015-02-19

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