JP2015032828A - リフロ処理ユニット及び基板処理装置 - Google Patents
リフロ処理ユニット及び基板処理装置 Download PDFInfo
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- JP2015032828A JP2015032828A JP2014150059A JP2014150059A JP2015032828A JP 2015032828 A JP2015032828 A JP 2015032828A JP 2014150059 A JP2014150059 A JP 2014150059A JP 2014150059 A JP2014150059 A JP 2014150059A JP 2015032828 A JP2015032828 A JP 2015032828A
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- Prior art keywords
- substrate
- reflow
- substrate processing
- exhaust
- processing unit
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 159
- 238000000034 method Methods 0.000 claims abstract description 94
- 239000012530 fluid Substances 0.000 claims abstract description 76
- 230000001174 ascending effect Effects 0.000 claims description 13
- 230000032258 transport Effects 0.000 claims description 9
- 239000012535 impurity Substances 0.000 claims description 8
- 238000004140 cleaning Methods 0.000 description 40
- 229910000679 solder Inorganic materials 0.000 description 14
- 239000004065 semiconductor Substances 0.000 description 13
- 238000003860 storage Methods 0.000 description 11
- 230000001105 regulatory effect Effects 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000003672 processing method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Optics & Photonics (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
100 ロードポート、
110 キャリヤー、
200 基板搬送モジュール、
210 搬送ロボット、
300 基板処理モジュール、
301 リフロ処理ユニット、
310 工程チャンバー、
311 上部ハウジング、
312 下部ハウジング、
320 支持部材、
323 ヒーター、
330 排気部材、
331 個別排気ライン、
332 共通排気ライン、
335 トラップ、
340 工程流体供給部材(ガス供給部材)、
370 昇下降部材、
381 回転板、
382 駆動器、
384 基板ホール、
390 支持プレート、
400 洗浄ユニット、
410 洗浄チャンバー、
430 基板支持部材(支持部材)、
431 真空チャック、
433 駆動部、
450 第1流体供給部材(流体供給部材)、
456 圧力調節部、
470 第2流体供給部材(流体供給部材)。
Claims (13)
- 基板を収納するキャリヤーを備えるロードポートと、
前記基板にリフロ工程を遂行する1つ又は複数個のリフロ処理ユニットを含む基板処理モジュールと、
前記基板を前記ロードポートと前記基板処理モジュールとの間に搬送する搬送ロボットを有し、前記ロードポートと前記基板処理モジュールとの間に位置する基板搬送モジュールと、を含み、
前記リフロ処理ユニットは、
内部に処理空間を有する工程チャンバーと、
前記工程チャンバーを排気する排気部材と、を含み、
前記排気部材は、
前記複数個の前記工程チャンバーの各々を連結する複数個の個別排気ラインと、
前記複数個の前記個別排気ラインと連結されて、前記基板処理モジュールの外部に排気する共通排気ラインと、を含む基板処理装置。 - 前記排気部材は、排気される排気流体の不純物を除去するトラップをさらに含む請求項1に記載の基板処理装置。
- 前記トラップは、複数個提供され、
前記複数個の前記トラップは、前記複数個の前記個別排気ラインに各々位置する請求項2に記載の基板処理装置。 - 前記トラップは、前記個別排気ラインから分離可能に提供される請求項3に記載の基板処理装置。
- 前記工程チャンバーは、環形のリング形状をなすように配列され、
前記共通排気ラインは、前記リングの中心に位置し、
前記個別排気ラインは、上部から見る時、前記リングの中心から放射状に延長される請求項1〜4のいずれか1つに記載の基板処理装置。 - 前記個別排気ラインは、前記工程チャンバーの上部と連結される請求項1〜5のいずれか1つに記載の基板処理装置。
- 前記工程チャンバーは、
下部ハウジングと、
前記下部ハウジングと対向するように位置する上部ハウジングと、を含み、
前記リフロ処理ユニットは、
前記基板が固定される基板ホールが1つ又は複数個提供され、前記上部ハウジングと前記下部ハウジングとの間に位置する回転板と、
前記回転板を回転させる駆動器と、
前記下部ハウジングを昇下降させることによって、前記工程チャンバーを開くか、或いは閉じる昇下降部材と、をさらに含む請求項1〜6のいずれか1つに記載の基板処理装置。 - 内部に処理空間を有する複数個の工程チャンバーと、
前記複数個の前記工程チャンバーを排気する排気部材と、を含み、
前記排気部材は、
前記複数個の前記工程チャンバーの各々を連結する複数個の個別排気ラインと、
前記複数個の前記個別排気ラインと連結されて、前記基板処理モジュールの外部に排気する共通排気ラインと、を含むリフロ処理ユニット。 - 前記排気部材は、排気される排気流体の不純物を除去するトラップをさらに含む請求項8に記載のリフロ処理ユニット。
- 前記トラップは、複数個提供され、
前記複数個の前記トラップは、前記複数個の前記個別排気ラインに各々位置する請求項9に記載のリフロ処理ユニット。 - 前記トラップは、前記個別排気ラインから分離可能に提供される請求項10に記載のリフロ処理ユニット。
- 前記工程チャンバーは、環形のリング形状をなすように配列され、
前記共通排気ラインは、前記リングの中心に位置し、
前記個別排気ラインは、上部から見る時、前記リングの中心から放射状に延長される請求項8〜11のいずれか1つに記載のリフロ処理ユニット。 - 前記工程チャンバーは、
下部ハウジングと、
前記下部ハウジングと対向するように位置する上部ハウジングと、を含み、
前記リフロ処理ユニットは、
前記基板が固定される基板ホールが1つ又は複数個提供され、前記上部ハウジングと前記下部ハウジングとの間に位置する回転板と、
前記回転板を回転させる駆動器と、
前記下部ハウジングを昇下降させることによって、前記工程チャンバーを開くか、或いは閉じる昇下降部材と、をさらに含む請求項8〜12のいずれか1つに記載のリフロ処理ユニット。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/987,512 US9226407B2 (en) | 2002-07-01 | 2013-08-01 | Reflow treating unit and substrate treating apparatus |
US13/987,512 | 2013-08-01 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2015032828A true JP2015032828A (ja) | 2015-02-16 |
JP5941505B2 JP5941505B2 (ja) | 2016-06-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2014150059A Active JP5941505B2 (ja) | 2013-08-01 | 2014-07-23 | リフロ処理ユニット及び基板処理装置 |
Country Status (5)
Country | Link |
---|---|
US (3) | US9226407B2 (ja) |
JP (1) | JP5941505B2 (ja) |
KR (1) | KR101455772B1 (ja) |
CN (1) | CN104347452B (ja) |
TW (1) | TWI540654B (ja) |
Cited By (1)
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JP2020529922A (ja) * | 2017-08-07 | 2020-10-15 | ボストン プロセス テクノロジーズ,インコーポレイテッド | ホットウォールフラックスフリーはんだボール処理装置 |
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KR20210058962A (ko) * | 2018-09-28 | 2021-05-24 | 보스턴 프로세스 테크놀로지스, 아이엔씨. | 다중 모듈 칩 제조 장치 |
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Also Published As
Publication number | Publication date |
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JP5941505B2 (ja) | 2016-06-29 |
US20160143156A1 (en) | 2016-05-19 |
TWI540654B (zh) | 2016-07-01 |
CN104347452B (zh) | 2017-10-24 |
CN104347452A (zh) | 2015-02-11 |
US20150034700A1 (en) | 2015-02-05 |
US20160143155A1 (en) | 2016-05-19 |
US9572266B2 (en) | 2017-02-14 |
US9226407B2 (en) | 2015-12-29 |
US9629258B2 (en) | 2017-04-18 |
KR101455772B1 (ko) | 2014-11-04 |
TW201507043A (zh) | 2015-02-16 |
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