JP2015029105A5 - - Google Patents

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Publication number
JP2015029105A5
JP2015029105A5 JP2014164252A JP2014164252A JP2015029105A5 JP 2015029105 A5 JP2015029105 A5 JP 2015029105A5 JP 2014164252 A JP2014164252 A JP 2014164252A JP 2014164252 A JP2014164252 A JP 2014164252A JP 2015029105 A5 JP2015029105 A5 JP 2015029105A5
Authority
JP
Japan
Prior art keywords
wafer
support plate
adhesive composition
adhesive
processing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2014164252A
Other languages
English (en)
Japanese (ja)
Other versions
JP6212450B2 (ja
JP2015029105A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2014164252A priority Critical patent/JP6212450B2/ja
Priority claimed from JP2014164252A external-priority patent/JP6212450B2/ja
Publication of JP2015029105A publication Critical patent/JP2015029105A/ja
Publication of JP2015029105A5 publication Critical patent/JP2015029105A5/ja
Application granted granted Critical
Publication of JP6212450B2 publication Critical patent/JP6212450B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2014164252A 2012-08-10 2014-08-12 ウエハの処理方法 Expired - Fee Related JP6212450B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014164252A JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JP2012178576 2012-08-10
JP2012178576 2012-08-10
JP2012264463 2012-12-03
JP2012264463 2012-12-03
JP2013122027 2013-06-10
JP2013122027 2013-06-10
JP2014164252A JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2013538746A Division JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Publications (3)

Publication Number Publication Date
JP2015029105A JP2015029105A (ja) 2015-02-12
JP2015029105A5 true JP2015029105A5 (enExample) 2016-07-07
JP6212450B2 JP6212450B2 (ja) 2017-10-11

Family

ID=50068085

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013538746A Active JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法
JP2014164252A Expired - Fee Related JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP2013538746A Active JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Country Status (6)

Country Link
US (1) US9855734B2 (enExample)
JP (2) JP5639280B2 (enExample)
KR (1) KR101516147B1 (enExample)
CN (1) CN104520974B (enExample)
TW (1) TWI539535B (enExample)
WO (1) WO2014024861A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119236A1 (ja) * 2014-02-07 2015-08-13 積水化学工業株式会社 ウエハの処理方法
CN107922796B (zh) * 2015-07-06 2020-09-25 蓝星有机硅法国两合公司 自粘多层制品及其制备方法
US10913248B2 (en) * 2015-11-26 2021-02-09 Showa Denko Materials Co., Ltd. Method for manufacturing electronic component, resin composition for temporary fixing, resin film for temporary fixing, and resin film sheet for temporary fixing
WO2017150018A1 (ja) * 2016-02-29 2017-09-08 リンテック株式会社 半導体加工シート
CN112218926A (zh) * 2018-06-06 2021-01-12 积水化学工业株式会社 粘合带
CN112424308A (zh) * 2018-09-10 2021-02-26 昭和电工株式会社 粘接片
WO2022202653A1 (ja) * 2021-03-26 2022-09-29 三井化学東セロ株式会社 ウエハの処理方法
CN118475663A (zh) * 2021-12-28 2024-08-09 三井化学艾喜缇玛蒂莉亚株式会社 两面黏接着材
KR20250041152A (ko) 2022-07-28 2025-03-25 닛토덴코 가부시키가이샤 점착 시트 및 점착 시트의 박리 방법
KR20250048021A (ko) 2022-07-28 2025-04-07 닛토덴코 가부시키가이샤 접합체, 접합체의 해체 방법 및 접합체에 사용되는 열경화성 점착제
JPWO2024024861A1 (enExample) 2022-07-28 2024-02-01
KR20250141204A (ko) 2023-01-30 2025-09-26 닛토덴코 가부시키가이샤 점착 시트
KR20250141203A (ko) 2023-01-30 2025-09-26 닛토덴코 가부시키가이샤 점착 시트
KR20260041876A (ko) 2023-07-26 2026-03-27 닛토덴코 가부시키가이샤 부재의 분리 방법 및 점착 시트

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003231872A (ja) 2001-08-03 2003-08-19 Sekisui Chem Co Ltd 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP3532186B2 (ja) 2002-01-11 2004-05-31 旭化成ケミカルズ株式会社 半導体ウエハーの加工方法
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP2004022634A (ja) 2002-06-13 2004-01-22 Sekisui Chem Co Ltd ウエハ支持体及び半導体ウエハの製造方法
JP2004182797A (ja) 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 両面粘着テープ及びｉｃチップの製造方法
KR100970798B1 (ko) * 2005-08-05 2010-07-16 히다치 가세고교 가부시끼가이샤 접착 필름 및 이것을 이용한 반도체 장치
JP2009146974A (ja) 2007-12-12 2009-07-02 Sekisui Chem Co Ltd 半導体加工用両面粘着テープ
JP5001955B2 (ja) 2007-12-12 2012-08-15 積水化学工業株式会社 半導体加工用両面粘着テープ
JP5448430B2 (ja) 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
TWI490303B (zh) 2008-12-01 2015-07-01 Furukawa Electric Co Ltd Wafer adhesive tape and wafer processing methods
JP2010205807A (ja) 2009-03-02 2010-09-16 Jsr Corp 被覆層形成方法
JP5437111B2 (ja) 2010-03-01 2014-03-12 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置
US20130071658A1 (en) 2010-03-24 2013-03-21 Sekisui Chemical Co., Ltd. Adhesive composition, adhesive tape, method for processing semiconductor wafer and method for producing tsv wafer
US8852391B2 (en) * 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
KR101393922B1 (ko) * 2010-09-16 2014-05-12 세키스이가가쿠 고교가부시키가이샤 점착제 조성물, 점착 테이프, 및 웨이퍼의 처리 방법
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive

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