JP5639280B2 - ウエハの処理方法 - Google Patents

ウエハの処理方法 Download PDF

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Publication number
JP5639280B2
JP5639280B2 JP2013538746A JP2013538746A JP5639280B2 JP 5639280 B2 JP5639280 B2 JP 5639280B2 JP 2013538746 A JP2013538746 A JP 2013538746A JP 2013538746 A JP2013538746 A JP 2013538746A JP 5639280 B2 JP5639280 B2 JP 5639280B2
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Japan
Prior art keywords
adhesive
wafer
support plate
group
acid
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Active
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JP2013538746A
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English (en)
Japanese (ja)
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JPWO2014024861A1 (ja
Inventor
隆浩 麻生
隆浩 麻生
亨 利根川
亨 利根川
洸造 上田
洸造 上田
博秀 藪口
博秀 藪口
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2013538746A priority Critical patent/JP5639280B2/ja
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Publication of JP5639280B2 publication Critical patent/JP5639280B2/ja
Publication of JPWO2014024861A1 publication Critical patent/JPWO2014024861A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B37/1207—Heat-activated adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/94—Batch processes at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/98—Methods for disconnecting semiconductor or solid-state bodies
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
    • B32B2037/1253—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives curable adhesive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2310/00—Treatment by energy or chemical effects
    • B32B2310/08—Treatment by energy or chemical effects by wave energy or particle radiation
    • B32B2310/0806—Treatment by energy or chemical effects by wave energy or particle radiation using electromagnetic radiation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/14—Semiconductor wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/30—Partial laminating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B43/00—Operations specially adapted for layered products and not otherwise provided for, e.g. repairing; Apparatus therefor
    • B32B43/006—Delaminating
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Organic Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Adhesive Tapes (AREA)
JP2013538746A 2012-08-10 2013-08-06 ウエハの処理方法 Active JP5639280B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013538746A JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
JP2012178576 2012-08-10
JP2012178576 2012-08-10
JP2012264463 2012-12-03
JP2012264463 2012-12-03
JP2013122027 2013-06-10
JP2013122027 2013-06-10
JP2013538746A JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法
PCT/JP2013/071208 WO2014024861A1 (ja) 2012-08-10 2013-08-06 ウエハの処理方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014164252A Division JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Publications (2)

Publication Number Publication Date
JP5639280B2 true JP5639280B2 (ja) 2014-12-10
JPWO2014024861A1 JPWO2014024861A1 (ja) 2016-07-25

Family

ID=50068085

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2013538746A Active JP5639280B2 (ja) 2012-08-10 2013-08-06 ウエハの処理方法
JP2014164252A Expired - Fee Related JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014164252A Expired - Fee Related JP6212450B2 (ja) 2012-08-10 2014-08-12 ウエハの処理方法

Country Status (6)

Country Link
US (1) US9855734B2 (enExample)
JP (2) JP5639280B2 (enExample)
KR (1) KR101516147B1 (enExample)
CN (1) CN104520974B (enExample)
TW (1) TWI539535B (enExample)
WO (1) WO2014024861A1 (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119236A1 (ja) * 2014-02-07 2015-08-13 積水化学工業株式会社 ウエハの処理方法
WO2019235287A1 (ja) * 2018-06-06 2019-12-12 積水化学工業株式会社 粘着テープ

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107922796B (zh) * 2015-07-06 2020-09-25 蓝星有机硅法国两合公司 自粘多层制品及其制备方法
JP6897569B2 (ja) * 2015-11-26 2021-06-30 昭和電工マテリアルズ株式会社 電子部品の製造方法、仮固定用樹脂組成物、仮固定用樹脂フィルム及び仮固定用樹脂フィルムシート
CN108243615B (zh) * 2016-02-29 2021-03-09 琳得科株式会社 半导体加工片
WO2020054146A1 (ja) * 2018-09-10 2020-03-19 昭和電工株式会社 粘着シート
JP7640675B2 (ja) * 2021-03-26 2025-03-05 三井化学Ictマテリア株式会社 ウエハの処理方法
WO2023127395A1 (ja) 2021-12-28 2023-07-06 三井化学東セロ株式会社 両面粘接着材
WO2024024862A1 (ja) 2022-07-28 2024-02-01 日東電工株式会社 接合体、接合体の解体方法および接合体に用いられる熱硬化性粘着剤
JPWO2024024860A1 (enExample) 2022-07-28 2024-02-01
WO2024024861A1 (ja) 2022-07-28 2024-02-01 日東電工株式会社 粘着シートおよび粘着シートの剥離方法
CN120476186A (zh) 2023-01-30 2025-08-12 日东电工株式会社 粘合片材
KR20250141204A (ko) 2023-01-30 2025-09-26 닛토덴코 가부시키가이샤 점착 시트

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JP2003231872A (ja) 2001-08-03 2003-08-19 Sekisui Chem Co Ltd 両面粘着テープ及びそれを用いたｉｃチップの製造方法
JP3532186B2 (ja) 2002-01-11 2004-05-31 旭化成ケミカルズ株式会社 半導体ウエハーの加工方法
US7534498B2 (en) * 2002-06-03 2009-05-19 3M Innovative Properties Company Laminate body, method, and apparatus for manufacturing ultrathin substrate using the laminate body
JP2004022634A (ja) 2002-06-13 2004-01-22 Sekisui Chem Co Ltd ウエハ支持体及び半導体ウエハの製造方法
JP2004182797A (ja) 2002-11-29 2004-07-02 Sekisui Chem Co Ltd 両面粘着テープ及びｉｃチップの製造方法
JPWO2007018120A1 (ja) * 2005-08-05 2009-02-19 日立化成工業株式会社 接着フィルム及びこれを用いた半導体装置
KR101386367B1 (ko) 2007-12-12 2014-04-16 세키스이가가쿠 고교가부시키가이샤 반도체 가공용 양면 점착 테이프 및 반도체 가공용 테이프
JP2009146974A (ja) 2007-12-12 2009-07-02 Sekisui Chem Co Ltd 半導体加工用両面粘着テープ
JP5448430B2 (ja) 2007-12-18 2014-03-19 古河電気工業株式会社 ウエハ貼着用貼着シートおよびウエハの加工方法
JP5519971B2 (ja) * 2008-11-26 2014-06-11 日東電工株式会社 ダイシング・ダイボンドフィルム及び半導体装置の製造方法
TWI490303B (zh) 2008-12-01 2015-07-01 Furukawa Electric Co Ltd Wafer adhesive tape and wafer processing methods
JP2010205807A (ja) 2009-03-02 2010-09-16 Jsr Corp 被覆層形成方法
JP5437111B2 (ja) 2010-03-01 2014-03-12 日東電工株式会社 ダイボンドフィルム、ダイシング・ダイボンドフィルム及び半導体装置
JP4846067B2 (ja) * 2010-03-24 2011-12-28 積水化学工業株式会社 半導体ウエハの処理方法及びｔｓｖウエハの製造方法
US8852391B2 (en) * 2010-06-21 2014-10-07 Brewer Science Inc. Method and apparatus for removing a reversibly mounted device wafer from a carrier substrate
WO2012036209A1 (ja) * 2010-09-16 2012-03-22 積水化学工業株式会社 粘着剤組成物、粘着テープ、及び、ウエハの処理方法
US20130084459A1 (en) * 2011-09-30 2013-04-04 3M Innovative Properties Company Low peel adhesive

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015119236A1 (ja) * 2014-02-07 2015-08-13 積水化学工業株式会社 ウエハの処理方法
JPWO2015119236A1 (ja) * 2014-02-07 2017-03-30 積水化学工業株式会社 ウエハの処理方法
WO2019235287A1 (ja) * 2018-06-06 2019-12-12 積水化学工業株式会社 粘着テープ

Also Published As

Publication number Publication date
KR101516147B1 (ko) 2015-04-29
KR20150018648A (ko) 2015-02-23
US20150217552A1 (en) 2015-08-06
US9855734B2 (en) 2018-01-02
TWI539535B (zh) 2016-06-21
JPWO2014024861A1 (ja) 2016-07-25
JP2015029105A (ja) 2015-02-12
JP6212450B2 (ja) 2017-10-11
CN104520974B (zh) 2016-02-10
WO2014024861A1 (ja) 2014-02-13
CN104520974A (zh) 2015-04-15
TW201411739A (zh) 2014-03-16

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