JP2014212305A5 - Method for manufacturing semiconductor device - Google Patents
Method for manufacturing semiconductor device Download PDFInfo
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- JP2014212305A5 JP2014212305A5 JP2014054599A JP2014054599A JP2014212305A5 JP 2014212305 A5 JP2014212305 A5 JP 2014212305A5 JP 2014054599 A JP2014054599 A JP 2014054599A JP 2014054599 A JP2014054599 A JP 2014054599A JP 2014212305 A5 JP2014212305 A5 JP 2014212305A5
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- insulating film
- opening
- forming
- film
- mask
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- 239000004065 semiconductor Substances 0.000 title claims 8
- 238000004519 manufacturing process Methods 0.000 title claims 4
- 239000000758 substrate Substances 0.000 claims 1
Claims (3)
前記第1の導電膜の上方に第1の絶縁膜を形成する工程と、Forming a first insulating film above the first conductive film;
前記第1の絶縁膜の上方に半導体膜を形成する工程と、Forming a semiconductor film over the first insulating film;
前記半導体膜の上方に第2の絶縁膜を形成する工程と、Forming a second insulating film above the semiconductor film;
前記第2の絶縁膜の上方に、第1の領域と、前記第1の領域における厚さよりも小さな厚さを有する第2の領域と、を有する第1のマスクを形成する工程と、Forming a first mask having a first region and a second region having a thickness smaller than the thickness of the first region above the second insulating film;
前記第1のマスクを用いて、前記第1の絶縁膜及び前記第2の絶縁膜のうち前記第1のマスクと重ならない部分を除去することにより、前記第1の絶縁膜及び前記第2の絶縁膜に第1の開口を形成する工程と、By using the first mask, a portion of the first insulating film and the second insulating film that does not overlap with the first mask is removed, whereby the first insulating film and the second insulating film are removed. Forming a first opening in the insulating film;
前記第2の領域における前記第1のマスクを後退させることにより、第2のマスクを形成する工程と、Forming a second mask by retracting the first mask in the second region;
前記第2のマスクを用いて、前記第2の絶縁膜のうち前記第2の領域と重なる部分を除去することにより、前記第2の絶縁膜における前記第1の開口よりも開口が広い第2の開口を形成すると共に、前記半導体膜と重なる領域に第3の開口を形成する工程と、By using the second mask to remove a portion of the second insulating film that overlaps the second region, a second opening having a larger opening than the first opening in the second insulating film is obtained. Forming a third opening in a region overlapping with the semiconductor film, and
前記第2のマスクを除去する工程と、Removing the second mask;
前記第2の絶縁膜の少なくとも一部の上方に、前記第1の絶縁膜における前記第1の開口、前記第2の開口、及び前記第3の開口を介して前記第1の導電膜と前記半導体膜とを電気的に接続する第2の導電膜を形成する工程と、Above the at least part of the second insulating film, the first conductive film and the first opening in the first insulating film via the first opening, the second opening, and the third opening Forming a second conductive film that electrically connects the semiconductor film;
を有することを特徴とする半導体装置の作製方法。A method for manufacturing a semiconductor device, comprising:
前記第1の絶縁膜における前記第1の開口は、テーパー形状を有することを特徴とする半導体装置の作製方法。The method for manufacturing a semiconductor device, wherein the first opening in the first insulating film has a tapered shape.
前記第2の開口及び前記第3の開口は、テーパー形状を有することを特徴とする半導体装置の作製方法。The method for manufacturing a semiconductor device, wherein the second opening and the third opening have a tapered shape.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2014054599A JP6300589B2 (en) | 2013-04-04 | 2014-03-18 | Method for manufacturing semiconductor device |
Applications Claiming Priority (3)
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JP2013078908 | 2013-04-04 | ||
JP2013078908 | 2013-04-04 | ||
JP2014054599A JP6300589B2 (en) | 2013-04-04 | 2014-03-18 | Method for manufacturing semiconductor device |
Related Child Applications (1)
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JP2018032936A Division JP6821617B2 (en) | 2013-04-04 | 2018-02-27 | Manufacturing method of semiconductor device |
Publications (3)
Publication Number | Publication Date |
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JP2014212305A JP2014212305A (en) | 2014-11-13 |
JP2014212305A5 true JP2014212305A5 (en) | 2017-04-06 |
JP6300589B2 JP6300589B2 (en) | 2018-03-28 |
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Family Applications (9)
Application Number | Title | Priority Date | Filing Date |
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JP2014054599A Active JP6300589B2 (en) | 2013-04-04 | 2014-03-18 | Method for manufacturing semiconductor device |
JP2018032936A Active JP6821617B2 (en) | 2013-04-04 | 2018-02-27 | Manufacturing method of semiconductor device |
JP2018150989A Active JP6446591B1 (en) | 2013-04-04 | 2018-08-10 | Semiconductor device |
JP2019095684A Active JP6821741B2 (en) | 2013-04-04 | 2019-05-22 | Manufacturing method of semiconductor device |
JP2019131552A Withdrawn JP2019204960A (en) | 2013-04-04 | 2019-07-17 | Semiconductor device |
JP2019131555A Withdrawn JP2019204961A (en) | 2013-04-04 | 2019-07-17 | Method for manufacturing semiconductor device |
JP2020090427A Active JP6936897B2 (en) | 2013-04-04 | 2020-05-25 | Semiconductor device |
JP2021138539A Withdrawn JP2021192443A (en) | 2013-04-04 | 2021-08-27 | Semiconductor device |
JP2023068981A Pending JP2023109752A (en) | 2013-04-04 | 2023-04-20 | Semiconductor device |
Family Applications After (8)
Application Number | Title | Priority Date | Filing Date |
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JP2018032936A Active JP6821617B2 (en) | 2013-04-04 | 2018-02-27 | Manufacturing method of semiconductor device |
JP2018150989A Active JP6446591B1 (en) | 2013-04-04 | 2018-08-10 | Semiconductor device |
JP2019095684A Active JP6821741B2 (en) | 2013-04-04 | 2019-05-22 | Manufacturing method of semiconductor device |
JP2019131552A Withdrawn JP2019204960A (en) | 2013-04-04 | 2019-07-17 | Semiconductor device |
JP2019131555A Withdrawn JP2019204961A (en) | 2013-04-04 | 2019-07-17 | Method for manufacturing semiconductor device |
JP2020090427A Active JP6936897B2 (en) | 2013-04-04 | 2020-05-25 | Semiconductor device |
JP2021138539A Withdrawn JP2021192443A (en) | 2013-04-04 | 2021-08-27 | Semiconductor device |
JP2023068981A Pending JP2023109752A (en) | 2013-04-04 | 2023-04-20 | Semiconductor device |
Country Status (3)
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US (7) | US9570310B2 (en) |
JP (9) | JP6300589B2 (en) |
KR (6) | KR102241241B1 (en) |
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