JP2014192485A - 半導体装置の製造方法、基板処理方法及び基板処理装置 - Google Patents

半導体装置の製造方法、基板処理方法及び基板処理装置 Download PDF

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Publication number
JP2014192485A
JP2014192485A JP2013069109A JP2013069109A JP2014192485A JP 2014192485 A JP2014192485 A JP 2014192485A JP 2013069109 A JP2013069109 A JP 2013069109A JP 2013069109 A JP2013069109 A JP 2013069109A JP 2014192485 A JP2014192485 A JP 2014192485A
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Japan
Prior art keywords
containing gas
atom
substrate
processing chamber
gas supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013069109A
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English (en)
Japanese (ja)
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JP2014192485A5 (https=
Inventor
Naoharu Nakaiso
直春 中磯
Kazuhiro Yuasa
和宏 湯浅
Yuki Kitahara
侑樹 北原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kokusai Denki Electric Inc
Original Assignee
Hitachi Kokusai Electric Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Kokusai Electric Inc filed Critical Hitachi Kokusai Electric Inc
Priority to JP2013069109A priority Critical patent/JP2014192485A/ja
Priority to KR1020140010007A priority patent/KR101550590B1/ko
Priority to TW103107888A priority patent/TWI578384B/zh
Priority to US14/227,360 priority patent/US9437426B2/en
Publication of JP2014192485A publication Critical patent/JP2014192485A/ja
Publication of JP2014192485A5 publication Critical patent/JP2014192485A5/ja
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3402—Deposited materials, e.g. layers characterised by the chemical composition
    • H10P14/3404—Deposited materials, e.g. layers characterised by the chemical composition being Group IVA materials
    • H10P14/3411—Silicon, silicon germanium or germanium
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
    • C23C16/24—Deposition of silicon only
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
    • C23C16/45523—Pulsed gas flow or change of composition over time
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/24—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials using chemical vapour deposition [CVD]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/20—Formation of materials, e.g. in the shape of layers or pillars of semiconductor materials
    • H10P14/34—Deposited materials, e.g. layers
    • H10P14/3438—Doping during depositing
    • H10P14/3441—Conductivity type
    • H10P14/3444—P-type
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/40—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials
    • H10P14/416—Formation of materials, e.g. in the shape of layers or pillars of conductive or resistive materials of highly doped semiconductor materials, e.g. polysilicon layers or amorphous silicon layers

Landscapes

  • Chemical & Material Sciences (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
JP2013069109A 2013-03-28 2013-03-28 半導体装置の製造方法、基板処理方法及び基板処理装置 Pending JP2014192485A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2013069109A JP2014192485A (ja) 2013-03-28 2013-03-28 半導体装置の製造方法、基板処理方法及び基板処理装置
KR1020140010007A KR101550590B1 (ko) 2013-03-28 2014-01-28 반도체 장치의 제조 방법, 기판 처리 방법 및 기판 처리 장치
TW103107888A TWI578384B (zh) 2013-03-28 2014-03-07 A semiconductor device manufacturing method, a substrate processing method, and a substrate processing apparatus
US14/227,360 US9437426B2 (en) 2013-03-28 2014-03-27 Method of manufacturing semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013069109A JP2014192485A (ja) 2013-03-28 2013-03-28 半導体装置の製造方法、基板処理方法及び基板処理装置

Publications (2)

Publication Number Publication Date
JP2014192485A true JP2014192485A (ja) 2014-10-06
JP2014192485A5 JP2014192485A5 (https=) 2016-05-19

Family

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JP2013069109A Pending JP2014192485A (ja) 2013-03-28 2013-03-28 半導体装置の製造方法、基板処理方法及び基板処理装置

Country Status (4)

Country Link
US (1) US9437426B2 (https=)
JP (1) JP2014192485A (https=)
KR (1) KR101550590B1 (https=)
TW (1) TWI578384B (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12080546B2 (en) 2018-04-27 2024-09-03 Kokusai Electric Corporation Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5394360B2 (ja) * 2010-03-10 2014-01-22 東京エレクトロン株式会社 縦型熱処理装置およびその冷却方法
JP6630237B2 (ja) 2016-06-06 2020-01-15 株式会社Ｋｏｋｕｓａｉ Ｅｌｅｃｔｒｉｃ 半導体装置の製造方法、基板処理装置及びプログラム
JP7228612B2 (ja) * 2020-03-27 2023-02-24 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法及びプログラム
KR102880091B1 (ko) 2020-09-29 2025-11-04 삼성전자주식회사 이미지 센서

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521378A (ja) * 1990-08-31 1993-01-29 Hitachi Ltd 半導体装置の製造方法
JPWO2007077917A1 (ja) * 2005-12-28 2009-06-11 株式会社日立国際電気 半導体装置の製造方法および基板処理装置
JP2011254063A (ja) * 2010-05-01 2011-12-15 Tokyo Electron Ltd 薄膜の形成方法及び成膜装置
JP2012204691A (ja) * 2011-03-25 2012-10-22 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4371425B2 (ja) 2004-03-29 2009-11-25 株式会社日立国際電気 半導体装置の製造方法及び基板処理装置
US20070087581A1 (en) * 2005-09-09 2007-04-19 Varian Semiconductor Equipment Associates, Inc. Technique for atomic layer deposition
US20070065576A1 (en) * 2005-09-09 2007-03-22 Vikram Singh Technique for atomic layer deposition
JP2008235397A (ja) * 2007-03-19 2008-10-02 Elpida Memory Inc 半導体装置の製造方法
KR101057188B1 (ko) 2008-11-11 2011-08-16 주식회사 하이닉스반도체 Ｐｍｏｓ 트랜지스터의 제조방법 및 이를 이용한 반도체 소자의 듀얼 게이트 형성방법
JP5697849B2 (ja) * 2009-01-28 2015-04-08 株式会社日立国際電気 半導体装置の製造方法及び基板処理装置
JP2010251654A (ja) 2009-04-20 2010-11-04 Elpida Memory Inc 成膜方法および半導体装置の製造方法
JP2011023576A (ja) 2009-07-16 2011-02-03 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
US8012859B1 (en) * 2010-03-31 2011-09-06 Tokyo Electron Limited Atomic layer deposition of silicon and silicon-containing films
JP2011216784A (ja) * 2010-04-01 2011-10-27 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
JP5847566B2 (ja) * 2011-01-14 2016-01-27 株式会社日立国際電気 半導体装置の製造方法、基板処理方法、基板処理装置およびプログラム
JP5919482B2 (ja) * 2011-03-03 2016-05-18 パナソニックＩｐマネジメント株式会社 触媒化学気相成膜装置、それを用いた成膜方法及び触媒体の表面処理方法
JP2012186275A (ja) * 2011-03-04 2012-09-27 Hitachi Kokusai Electric Inc 基板処理装置及び半導体装置の製造方法
JP5710529B2 (ja) * 2011-09-22 2015-04-30 株式会社東芝 半導体装置及びその製造方法
JP6267080B2 (ja) * 2013-10-07 2018-01-24 東京エレクトロン株式会社 シリコン窒化物膜の成膜方法および成膜装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0521378A (ja) * 1990-08-31 1993-01-29 Hitachi Ltd 半導体装置の製造方法
JPWO2007077917A1 (ja) * 2005-12-28 2009-06-11 株式会社日立国際電気 半導体装置の製造方法および基板処理装置
JP2011254063A (ja) * 2010-05-01 2011-12-15 Tokyo Electron Ltd 薄膜の形成方法及び成膜装置
JP2012204691A (ja) * 2011-03-25 2012-10-22 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
B.CAUSSAT ET AL.: "Influence of dopant concentration and type of substrate on the local organization of low-pressure ch", THIN SOLID FILMS, vol. 446, JPN6016033143, 15 January 2004 (2004-01-15), pages 218 - 226, ISSN: 0003387127 *
SATOSHI NAKAYAMA ET AL.: "Boron Doping Effect on Silicon Film Deposition in the Si2H6-B2H6-He Gas System", JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 133, JPN7016002521, August 1986 (1986-08-01), US, pages 1721 - 1724, ISSN: 0003387126 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12080546B2 (en) 2018-04-27 2024-09-03 Kokusai Electric Corporation Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium

Also Published As

Publication number Publication date
US9437426B2 (en) 2016-09-06
KR20140118711A (ko) 2014-10-08
TWI578384B (zh) 2017-04-11
TW201505078A (zh) 2015-02-01
KR101550590B1 (ko) 2015-09-07
US20140295648A1 (en) 2014-10-02

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