JP2014086551A5 - - Google Patents
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- JP2014086551A5 JP2014086551A5 JP2012234067A JP2012234067A JP2014086551A5 JP 2014086551 A5 JP2014086551 A5 JP 2014086551A5 JP 2012234067 A JP2012234067 A JP 2012234067A JP 2012234067 A JP2012234067 A JP 2012234067A JP 2014086551 A5 JP2014086551 A5 JP 2014086551A5
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- Prior art keywords
- semiconductor substrate
- imaging device
- metallic region
- photoelectric conversion
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- 238000003384 imaging method Methods 0.000 claims description 22
- 239000004065 semiconductor Substances 0.000 claims description 20
- 239000000758 substrate Substances 0.000 claims description 20
- 238000006243 chemical reaction Methods 0.000 claims description 17
- 239000010410 layer Substances 0.000 claims 15
- 239000011229 interlayer Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012234067A JP2014086551A (ja) | 2012-10-23 | 2012-10-23 | 撮像装置及びカメラ |
| US14/046,491 US9490289B2 (en) | 2012-10-23 | 2013-10-04 | Image sensing device and camera |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012234067A JP2014086551A (ja) | 2012-10-23 | 2012-10-23 | 撮像装置及びカメラ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2014086551A JP2014086551A (ja) | 2014-05-12 |
| JP2014086551A5 true JP2014086551A5 (enExample) | 2015-12-03 |
Family
ID=50485007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012234067A Pending JP2014086551A (ja) | 2012-10-23 | 2012-10-23 | 撮像装置及びカメラ |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9490289B2 (enExample) |
| JP (1) | JP2014086551A (enExample) |
Families Citing this family (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6161258B2 (ja) | 2012-11-12 | 2017-07-12 | キヤノン株式会社 | 固体撮像装置およびその製造方法ならびにカメラ |
| JP6086715B2 (ja) * | 2012-12-17 | 2017-03-01 | オリンパス株式会社 | 固体撮像素子 |
| JP6162999B2 (ja) | 2013-04-15 | 2017-07-12 | キヤノン株式会社 | 固体撮像装置およびカメラ |
| JP2014225536A (ja) | 2013-05-15 | 2014-12-04 | キヤノン株式会社 | 固体撮像装置及びカメラ |
| JP2016082133A (ja) | 2014-10-20 | 2016-05-16 | ソニー株式会社 | 固体撮像素子及び電子機器 |
| JP6541361B2 (ja) | 2015-02-05 | 2019-07-10 | キヤノン株式会社 | 固体撮像装置 |
| JP2016201397A (ja) * | 2015-04-07 | 2016-12-01 | ソニー株式会社 | 固体撮像素子および電子機器 |
| US9768213B2 (en) | 2015-06-03 | 2017-09-19 | Canon Kabushiki Kaisha | Solid-state image sensor and camera |
| US10014333B2 (en) * | 2015-08-26 | 2018-07-03 | Semiconductor Components Industries, Llc | Back-side illuminated pixels with interconnect layers |
| JP6738200B2 (ja) | 2016-05-26 | 2020-08-12 | キヤノン株式会社 | 撮像装置 |
| WO2017208820A1 (ja) | 2016-05-30 | 2017-12-07 | ソニー株式会社 | 映像音響処理装置および方法、並びにプログラム |
| JP2020031074A (ja) * | 2016-12-20 | 2020-02-27 | パナソニックＩｐマネジメント株式会社 | 固体撮像装置およびその製造方法 |
| WO2020045278A1 (en) | 2018-08-31 | 2020-03-05 | Canon Kabushiki Kaisha | Imaging device with motion dependent pixel binning |
| KR102589608B1 (ko) * | 2018-10-22 | 2023-10-16 | 삼성전자주식회사 | 이미지 센서 및 이의 제조 방법 |
| JP2020068289A (ja) * | 2018-10-24 | 2020-04-30 | キヤノン株式会社 | 光電変換装置、撮像システム、移動体、および積層用の半導体チップ |
| CN109524428B (zh) * | 2018-11-13 | 2020-09-25 | 上海奕瑞光电子科技股份有限公司 | X射线探测单元、探测器及探测系统 |
| JP7481811B2 (ja) | 2019-07-26 | 2024-05-13 | キヤノン株式会社 | 半導体装置 |
| CN115210874A (zh) * | 2020-04-20 | 2022-10-18 | 索尼半导体解决方案公司 | 固态成像元件和电子设备 |
| CN121001425A (zh) * | 2020-12-29 | 2025-11-21 | 李学能 | 半导体装置 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4826111B2 (ja) * | 2005-03-17 | 2011-11-30 | ソニー株式会社 | 固体撮像素子および固体撮像素子の製造方法および画像撮影装置 |
| JP4525671B2 (ja) | 2006-12-08 | 2010-08-18 | ソニー株式会社 | 固体撮像装置 |
| KR101550866B1 (ko) * | 2009-02-09 | 2015-09-08 | 삼성전자주식회사 | 광학적 크로스토크를 개선하기 위하여, 절연막의 트렌치 상부만을 갭필하여 에어 갭을 형성하는 이미지 센서의 제조방법 |
| US8368157B2 (en) * | 2010-04-06 | 2013-02-05 | Aptina Imaging Coporation | Backside illumination image sensors with reflective light guides |
| JP5810575B2 (ja) | 2011-03-25 | 2015-11-11 | ソニー株式会社 | 固体撮像装置、および、その製造方法、電子機器 |
| US8680454B2 (en) * | 2011-12-01 | 2014-03-25 | Omnivision Technologies, Inc. | Backside-illuminated (BSI) pixel including light guide |
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2012
- 2012-10-23 JP JP2012234067A patent/JP2014086551A/ja active Pending
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2013
- 2013-10-04 US US14/046,491 patent/US9490289B2/en active Active