JP2015115420A5 - - Google Patents

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Publication number
JP2015115420A5
JP2015115420A5 JP2013255423A JP2013255423A JP2015115420A5 JP 2015115420 A5 JP2015115420 A5 JP 2015115420A5 JP 2013255423 A JP2013255423 A JP 2013255423A JP 2013255423 A JP2013255423 A JP 2013255423A JP 2015115420 A5 JP2015115420 A5 JP 2015115420A5
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JP
Japan
Prior art keywords
substrate
wiring layer
substrates
semiconductor layer
imaging device
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Application number
JP2013255423A
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English (en)
Japanese (ja)
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JP2015115420A (ja
JP6177117B2 (ja
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Priority to JP2013255423A priority Critical patent/JP6177117B2/ja
Priority claimed from JP2013255423A external-priority patent/JP6177117B2/ja
Priority to PCT/JP2014/082696 priority patent/WO2015087918A1/ja
Publication of JP2015115420A publication Critical patent/JP2015115420A/ja
Priority to US15/149,955 priority patent/US20160254299A1/en
Publication of JP2015115420A5 publication Critical patent/JP2015115420A5/ja
Application granted granted Critical
Publication of JP6177117B2 publication Critical patent/JP6177117B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2013255423A 2013-12-10 2013-12-10 固体撮像装置、撮像装置、固体撮像装置の製造方法 Expired - Fee Related JP6177117B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013255423A JP6177117B2 (ja) 2013-12-10 2013-12-10 固体撮像装置、撮像装置、固体撮像装置の製造方法
PCT/JP2014/082696 WO2015087918A1 (ja) 2013-12-10 2014-12-10 固体撮像装置、撮像装置、固体撮像装置の製造方法
US15/149,955 US20160254299A1 (en) 2013-12-10 2016-05-09 Solid-state imaging device, imaging device, solid-state imaging device manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013255423A JP6177117B2 (ja) 2013-12-10 2013-12-10 固体撮像装置、撮像装置、固体撮像装置の製造方法

Publications (3)

Publication Number Publication Date
JP2015115420A JP2015115420A (ja) 2015-06-22
JP2015115420A5 true JP2015115420A5 (enExample) 2017-01-12
JP6177117B2 JP6177117B2 (ja) 2017-08-09

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013255423A Expired - Fee Related JP6177117B2 (ja) 2013-12-10 2013-12-10 固体撮像装置、撮像装置、固体撮像装置の製造方法

Country Status (3)

Country Link
US (1) US20160254299A1 (enExample)
JP (1) JP6177117B2 (enExample)
WO (1) WO2015087918A1 (enExample)

Families Citing this family (13)

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Publication number Priority date Publication date Assignee Title
DE112017002162T5 (de) * 2016-04-25 2019-01-10 Olympus Corporation Bildgebungselement, endoskop und endoskopsystem
JP2018081946A (ja) * 2016-11-14 2018-05-24 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置およびその製造方法、並びに電子機器
WO2018154644A1 (ja) * 2017-02-22 2018-08-30 オリンパス株式会社 固体撮像装置、蛍光観察内視鏡装置、および固体撮像装置の製造方法
JP6779825B2 (ja) 2017-03-30 2020-11-04 キヤノン株式会社 半導体装置および機器
WO2018180576A1 (ja) * 2017-03-31 2018-10-04 ソニーセミコンダクタソリューションズ株式会社 半導体装置、固体撮像装置、および電子機器
US11101313B2 (en) * 2017-04-04 2021-08-24 Sony Semiconductor Solutions Corporation Solid-state imaging device and electronic apparatus
WO2018186196A1 (ja) * 2017-04-04 2018-10-11 ソニーセミコンダクタソリューションズ株式会社 固体撮像装置、及び電子機器
CN110494962B (zh) * 2017-04-04 2024-01-12 索尼半导体解决方案公司 半导体器件、制造半导体器件的方法和电子设备
US11031431B2 (en) * 2017-04-04 2021-06-08 Sony Semiconductor Solutions Corporation Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
US11276676B2 (en) * 2018-05-15 2022-03-15 Invensas Bonding Technologies, Inc. Stacked devices and methods of fabrication
WO2020010265A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Microelectronic assemblies
US12027557B2 (en) * 2018-10-16 2024-07-02 Sony Semiconductor Solutions Corporation Semiconductor element and method of manufacturing the same
JP2022040579A (ja) * 2020-08-31 2022-03-11 ソニーセミコンダクタソリューションズ株式会社 半導体装置、および、半導体装置の製造方法

Family Cites Families (11)

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Publication number Priority date Publication date Assignee Title
JPH05267394A (ja) * 1992-03-19 1993-10-15 Sumitomo Electric Ind Ltd 半導体素子の実装方法
JP3713418B2 (ja) * 2000-05-30 2005-11-09 光正 小柳 ３次元画像処理装置の製造方法
US7214999B2 (en) * 2003-10-31 2007-05-08 Motorola, Inc. Integrated photoserver for CMOS imagers
JP2007228460A (ja) * 2006-02-27 2007-09-06 Mitsumasa Koyanagi 集積センサを搭載した積層型半導体装置
US8471939B2 (en) * 2008-08-01 2013-06-25 Omnivision Technologies, Inc. Image sensor having multiple sensing layers
JP2011249562A (ja) * 2010-05-27 2011-12-08 Panasonic Corp 半導体装置及びその製造方法
JP2012033894A (ja) * 2010-06-30 2012-02-16 Canon Inc 固体撮像装置
JP5561190B2 (ja) * 2011-01-31 2014-07-30 富士通株式会社 半導体装置、半導体装置の製造方法及び電子装置
US20130075607A1 (en) * 2011-09-22 2013-03-28 Manoj Bikumandla Image sensors having stacked photodetector arrays
TWI577001B (zh) * 2011-10-04 2017-04-01 Sony Corp 固體攝像裝置、固體攝像裝置之製造方法及電子機器
JP2013187475A (ja) * 2012-03-09 2013-09-19 Olympus Corp 固体撮像装置およびカメラシステム

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