JP2014063160A - 酸発生剤化合物およびそれを含むフォトレジスト - Google Patents
酸発生剤化合物およびそれを含むフォトレジスト Download PDFInfo
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- JP2014063160A JP2014063160A JP2013190007A JP2013190007A JP2014063160A JP 2014063160 A JP2014063160 A JP 2014063160A JP 2013190007 A JP2013190007 A JP 2013190007A JP 2013190007 A JP2013190007 A JP 2013190007A JP 2014063160 A JP2014063160 A JP 2014063160A
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- acid
- acid generator
- acid labile
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- 239000002253 acid Substances 0.000 title claims abstract description 167
- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 76
- 150000001875 compounds Chemical class 0.000 title claims description 97
- 229920000642 polymer Polymers 0.000 claims abstract description 46
- 239000000203 mixture Substances 0.000 claims abstract description 45
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical group C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 claims abstract description 11
- 229910052739 hydrogen Inorganic materials 0.000 claims description 30
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 30
- 239000010410 layer Substances 0.000 claims description 26
- 230000005855 radiation Effects 0.000 claims description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 19
- 239000001257 hydrogen Substances 0.000 claims description 19
- 239000000758 substrate Substances 0.000 claims description 16
- 150000001450 anions Chemical class 0.000 claims description 14
- 229910021607 Silver chloride Inorganic materials 0.000 claims description 10
- 238000003556 assay Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 10
- HKZLPVFGJNLROG-UHFFFAOYSA-M silver monochloride Chemical compound [Cl-].[Ag+] HKZLPVFGJNLROG-UHFFFAOYSA-M 0.000 claims description 10
- 230000003213 activating effect Effects 0.000 claims description 7
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 7
- 239000011247 coating layer Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 abstract description 10
- 230000035945 sensitivity Effects 0.000 abstract description 2
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 91
- -1 cyclic sulfonium salts Chemical class 0.000 description 41
- 239000007787 solid Substances 0.000 description 34
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 30
- 150000002148 esters Chemical class 0.000 description 28
- 239000000243 solution Substances 0.000 description 26
- 239000000178 monomer Substances 0.000 description 24
- 229910052799 carbon Inorganic materials 0.000 description 22
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 22
- 125000000217 alkyl group Chemical group 0.000 description 21
- 230000015572 biosynthetic process Effects 0.000 description 18
- 238000003786 synthesis reaction Methods 0.000 description 17
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 16
- 239000011541 reaction mixture Substances 0.000 description 14
- 125000003118 aryl group Chemical group 0.000 description 13
- 229910052731 fluorine Inorganic materials 0.000 description 13
- 125000004093 cyano group Chemical group *C#N 0.000 description 12
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 11
- 229940116333 ethyl lactate Drugs 0.000 description 11
- BZLVMXJERCGZMT-UHFFFAOYSA-N Methyl tert-butyl ether Chemical compound COC(C)(C)C BZLVMXJERCGZMT-UHFFFAOYSA-N 0.000 description 10
- 150000001768 cations Chemical class 0.000 description 10
- 239000012044 organic layer Substances 0.000 description 10
- 239000002904 solvent Substances 0.000 description 10
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 9
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 9
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 9
- 235000012431 wafers Nutrition 0.000 description 9
- 125000004122 cyclic group Chemical group 0.000 description 8
- 150000002596 lactones Chemical class 0.000 description 8
- 125000001424 substituent group Chemical group 0.000 description 8
- 239000004094 surface-active agent Substances 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 7
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 7
- 125000003367 polycyclic group Chemical group 0.000 description 7
- 229910052710 silicon Inorganic materials 0.000 description 7
- 239000010703 silicon Substances 0.000 description 7
- ILIDXWFIWYSBFJ-UHFFFAOYSA-N (1-ethylcyclopentyl) 2-bromoacetate Chemical compound BrCC(=O)OC1(CC)CCCC1 ILIDXWFIWYSBFJ-UHFFFAOYSA-N 0.000 description 6
- 125000002733 (C1-C6) fluoroalkyl group Chemical group 0.000 description 6
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 6
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 6
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 6
- 239000000654 additive Substances 0.000 description 6
- 125000004432 carbon atom Chemical group C* 0.000 description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- YEOCHZFPBYUXMC-UHFFFAOYSA-L copper benzoate Chemical compound [Cu+2].[O-]C(=O)C1=CC=CC=C1.[O-]C(=O)C1=CC=CC=C1 YEOCHZFPBYUXMC-UHFFFAOYSA-L 0.000 description 6
- 238000011161 development Methods 0.000 description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 239000011734 sodium Substances 0.000 description 6
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 150000001412 amines Chemical class 0.000 description 5
- FJDQFPXHSGXQBY-UHFFFAOYSA-L caesium carbonate Chemical compound [Cs+].[Cs+].[O-]C([O-])=O FJDQFPXHSGXQBY-UHFFFAOYSA-L 0.000 description 5
- 229910000024 caesium carbonate Inorganic materials 0.000 description 5
- 150000007942 carboxylates Chemical group 0.000 description 5
- 125000001624 naphthyl group Chemical group 0.000 description 5
- 125000006413 ring segment Chemical group 0.000 description 5
- RWSOTUBLDIXVET-UHFFFAOYSA-O sulfonium Chemical compound [SH3+] RWSOTUBLDIXVET-UHFFFAOYSA-O 0.000 description 5
- JESXATFQYMPTNL-UHFFFAOYSA-N 2-ethenylphenol Chemical compound OC1=CC=CC=C1C=C JESXATFQYMPTNL-UHFFFAOYSA-N 0.000 description 4
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 4
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 4
- 150000001241 acetals Chemical class 0.000 description 4
- 239000008346 aqueous phase Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 239000000470 constituent Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 4
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 4
- WJKHJLXJJJATHN-UHFFFAOYSA-N triflic anhydride Chemical compound FC(F)(F)S(=O)(=O)OS(=O)(=O)C(F)(F)F WJKHJLXJJJATHN-UHFFFAOYSA-N 0.000 description 4
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 4
- 125000006651 (C3-C20) cycloalkyl group Chemical group 0.000 description 3
- IDNDBZMCTVQNCN-UHFFFAOYSA-M 1,1-difluoro-2-(2-methylprop-2-enoyloxy)ethanesulfonate Chemical compound CC(=C)C(=O)OCC(F)(F)S([O-])(=O)=O IDNDBZMCTVQNCN-UHFFFAOYSA-M 0.000 description 3
- YEZOVIIHKKPUOS-UHFFFAOYSA-N 10-oxothioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3S(=O)C2=C1 YEZOVIIHKKPUOS-UHFFFAOYSA-N 0.000 description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- YLQBMQCUIZJEEH-UHFFFAOYSA-N Furan Chemical group C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 3
- 229920000877 Melamine resin Polymers 0.000 description 3
- SXAOPTATZJCEIJ-UHFFFAOYSA-N [2-(1-ethylcyclopentyl)oxy-2-oxoethyl] 4-methoxy-3-[9-oxo-2-(trifluoromethyl)-4,4a-dihydro-1H-thioxanthen-10-ium-1-ylium-10-yl]benzoate Chemical compound CCC1(CCCC1)OC(COC(C(C=C1)=CC([S+](C2C3=[C+]C(C(F)(F)F)=CC2)C2=CC=CC=C2C3=O)=C1OC)=O)=O SXAOPTATZJCEIJ-UHFFFAOYSA-N 0.000 description 3
- ZGFVNHAKAYIRGI-UHFFFAOYSA-M [2-(1-ethylcyclopentyl)oxy-2-oxoethyl] 4-methoxy-3-[9-oxo-2-(trifluoromethyl)-4,4a-dihydro-1H-thioxanthen-10-ium-1-ylium-10-yl]benzoate iodide Chemical compound CCC1(CCCC1)OC(COC(C(C=C1)=CC([S+](C2C3=[C+]C(C(F)(F)F)=CC2)C2=CC=CC=C2C3=O)=C1OC)=O)=O.[I-] ZGFVNHAKAYIRGI-UHFFFAOYSA-M 0.000 description 3
- 125000004036 acetal group Chemical group 0.000 description 3
- 125000003545 alkoxy group Chemical group 0.000 description 3
- 238000004458 analytical method Methods 0.000 description 3
- MWPLVEDNUUSJAV-UHFFFAOYSA-N anthracene Chemical compound C1=CC=CC2=CC3=CC=CC=C3C=C21 MWPLVEDNUUSJAV-UHFFFAOYSA-N 0.000 description 3
- 125000003710 aryl alkyl group Chemical group 0.000 description 3
- 125000000732 arylene group Chemical group 0.000 description 3
- 229910052794 bromium Inorganic materials 0.000 description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 3
- 150000001735 carboxylic acids Chemical class 0.000 description 3
- 229910052801 chlorine Inorganic materials 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000002484 cyclic voltammetry Methods 0.000 description 3
- 239000008151 electrolyte solution Substances 0.000 description 3
- ULZYGUIFJKUGOK-UHFFFAOYSA-N ethoxymethyl 4-methoxybenzoate Chemical compound CCOCOC(=O)C1=CC=C(OC)C=C1 ULZYGUIFJKUGOK-UHFFFAOYSA-N 0.000 description 3
- 125000003709 fluoroalkyl group Chemical group 0.000 description 3
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Chemical group C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 229910052740 iodine Inorganic materials 0.000 description 3
- 150000002576 ketones Chemical class 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 3
- 125000002950 monocyclic group Chemical group 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- QSUJHKWXLIQKEY-UHFFFAOYSA-N (2-oxooxolan-3-yl) 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CCOC1=O QSUJHKWXLIQKEY-UHFFFAOYSA-N 0.000 description 2
- BKZVDYBZILBKLF-UHFFFAOYSA-N 1,1-difluoro-2-(2-methylprop-2-enoyloxy)ethanesulfonate;triethylazanium Chemical compound CC[NH+](CC)CC.CC(=C)C(=O)OCC(F)(F)S([O-])(=O)=O BKZVDYBZILBKLF-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 2
- ZSFZIHCEENJPAJ-UHFFFAOYSA-N 10-oxo-2-(trifluoromethyl)thioxanthen-9-one Chemical compound C1=CC=C2S(=O)C3=CC=C(C(F)(F)F)C=C3C(=O)C2=C1 ZSFZIHCEENJPAJ-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- ABQQKCWREBFTSV-UHFFFAOYSA-N 2-hydroxy-1,3-dimethylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=C(C)C(O)=C2C ABQQKCWREBFTSV-UHFFFAOYSA-N 0.000 description 2
- PPXAHQRRLKQYTG-UHFFFAOYSA-N 2-phenylpropan-2-yl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C1=CC=CC=C1 PPXAHQRRLKQYTG-UHFFFAOYSA-N 0.000 description 2
- QDFXRVAOBHEBGJ-UHFFFAOYSA-N 3-(cyclononen-1-yl)-4,5,6,7,8,9-hexahydro-1h-diazonine Chemical compound C1CCCCCCC=C1C1=NNCCCCCC1 QDFXRVAOBHEBGJ-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- ZEYHEAKUIGZSGI-UHFFFAOYSA-N 4-methoxybenzoic acid Chemical compound COC1=CC=C(C(O)=O)C=C1 ZEYHEAKUIGZSGI-UHFFFAOYSA-N 0.000 description 2
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 2
- PPFNJKRRFYQNLD-UHFFFAOYSA-N 9-oxothioxanthene-2-carboxylic acid Chemical compound C1=CC=C2C(=O)C3=CC(C(=O)O)=CC=C3SC2=C1 PPFNJKRRFYQNLD-UHFFFAOYSA-N 0.000 description 2
- BQFGTBACYLXPNP-UHFFFAOYSA-N CC(C)(C)C(C=C1)=CC=C1[S+](C1=CC=CC=C11)C(C=CC(C([O-])=O)=[C+]2)=C2C1=O Chemical compound CC(C)(C)C(C=C1)=CC=C1[S+](C1=CC=CC=C11)C(C=CC(C([O-])=O)=[C+]2)=C2C1=O BQFGTBACYLXPNP-UHFFFAOYSA-N 0.000 description 2
- WMVLANGOCUHHEY-UHFFFAOYSA-N COC(C=CC(C([O-])=O)=C1)=C1[S+]1C(C=CC=C2)=C2SC2=CC=CC=C12 Chemical compound COC(C=CC(C([O-])=O)=C1)=C1[S+]1C(C=CC=C2)=C2SC2=CC=CC=C12 WMVLANGOCUHHEY-UHFFFAOYSA-N 0.000 description 2
- KXDHJXZQYSOELW-UHFFFAOYSA-M Carbamate Chemical compound NC([O-])=O KXDHJXZQYSOELW-UHFFFAOYSA-M 0.000 description 2
- 239000004971 Cross linker Substances 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- XYVQFUJDGOBPQI-UHFFFAOYSA-N Methyl-2-hydoxyisobutyric acid Chemical compound COC(=O)C(C)(C)O XYVQFUJDGOBPQI-UHFFFAOYSA-N 0.000 description 2
- JGFZNNIVVJXRND-UHFFFAOYSA-N N,N-Diisopropylethylamine (DIPEA) Chemical compound CCN(C(C)C)C(C)C JGFZNNIVVJXRND-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical group C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- NSOXQYCFHDMMGV-UHFFFAOYSA-N Tetrakis(2-hydroxypropyl)ethylenediamine Chemical compound CC(O)CN(CC(C)O)CCN(CC(C)O)CC(C)O NSOXQYCFHDMMGV-UHFFFAOYSA-N 0.000 description 2
- YTPLMLYBLZKORZ-UHFFFAOYSA-N Thiophene Chemical group C=1C=CSC=1 YTPLMLYBLZKORZ-UHFFFAOYSA-N 0.000 description 2
- KZCIPBACPLWZSZ-UHFFFAOYSA-N [2-(1-ethylcyclopentyl)oxy-2-oxoethyl] 10-(4-tert-butylphenyl)-9-oxo-1H-thioxanthen-10-ium-1-ylium-2-carboxylate Chemical compound CCC1(CCCC1)OC(COC(C(C=C1)=[C+]C2=C1[S+](C1=CC=C(C(C)(C)C)C=C1)C1=CC=CC=C1C2=O)=O)=O KZCIPBACPLWZSZ-UHFFFAOYSA-N 0.000 description 2
- ICURIFUTRQEJPA-UHFFFAOYSA-N [3,5-bis(1,1,1,3,3,3-hexafluoro-2-hydroxypropan-2-yl)cyclohexyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC1CC(C(O)(C(F)(F)F)C(F)(F)F)CC(C(O)(C(F)(F)F)C(F)(F)F)C1 ICURIFUTRQEJPA-UHFFFAOYSA-N 0.000 description 2
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 125000004390 alkyl sulfonyl group Chemical group 0.000 description 2
- 125000004414 alkyl thio group Chemical group 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000000304 alkynyl group Chemical group 0.000 description 2
- 150000001408 amides Chemical class 0.000 description 2
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- DNFSNYQTQMVTOK-UHFFFAOYSA-N bis(4-tert-butylphenyl)iodanium Chemical compound C1=CC(C(C)(C)C)=CC=C1[I+]C1=CC=C(C(C)(C)C)C=C1 DNFSNYQTQMVTOK-UHFFFAOYSA-N 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N butyl acetate Chemical compound CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 2
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- 125000002091 cationic group Chemical group 0.000 description 2
- 238000003776 cleavage reaction Methods 0.000 description 2
- 125000000753 cycloalkyl group Chemical group 0.000 description 2
- 125000002993 cycloalkylene group Chemical group 0.000 description 2
- NZNMSOFKMUBTKW-UHFFFAOYSA-N cyclohexanecarboxylic acid Chemical compound OC(=O)C1CCCCC1 NZNMSOFKMUBTKW-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- DMBHHRLKUKUOEG-UHFFFAOYSA-N diphenylamine Chemical compound C=1C=CC=CC=1NC1=CC=CC=C1 DMBHHRLKUKUOEG-UHFFFAOYSA-N 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001900 extreme ultraviolet lithography Methods 0.000 description 2
- 239000012527 feed solution Substances 0.000 description 2
- 238000003818 flash chromatography Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- VPVSTMAPERLKKM-UHFFFAOYSA-N glycoluril Chemical compound N1C(=O)NC2NC(=O)NC21 VPVSTMAPERLKKM-UHFFFAOYSA-N 0.000 description 2
- 229910052736 halogen Inorganic materials 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- 150000004679 hydroxides Chemical class 0.000 description 2
- 150000002466 imines Chemical class 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000006574 non-aromatic ring group Chemical group 0.000 description 2
- 239000012454 non-polar solvent Substances 0.000 description 2
- 229920005596 polymer binder Polymers 0.000 description 2
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- GJSGGHOYGKMUPT-UHFFFAOYSA-N phenoxathiine Chemical compound C1=CC=C2OC3=CC=CC=C3SC2=C1 GJSGGHOYGKMUPT-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 125000004076 pyridyl group Chemical group 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 230000003381 solubilizing effect Effects 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000005017 substituted alkenyl group Chemical group 0.000 description 1
- 125000000547 substituted alkyl group Chemical group 0.000 description 1
- SEEPANYCNGTZFQ-UHFFFAOYSA-N sulfadiazine Chemical compound C1=CC(N)=CC=C1S(=O)(=O)NC1=NC=CC=N1 SEEPANYCNGTZFQ-UHFFFAOYSA-N 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000008054 sulfonate salts Chemical class 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 description 1
- 238000010345 tape casting Methods 0.000 description 1
- 239000011975 tartaric acid Substances 0.000 description 1
- 235000002906 tartaric acid Nutrition 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- ISXSCDLOGDJUNJ-UHFFFAOYSA-N tert-butyl prop-2-enoate Chemical compound CC(C)(C)OC(=O)C=C ISXSCDLOGDJUNJ-UHFFFAOYSA-N 0.000 description 1
- 150000005622 tetraalkylammonium hydroxides Chemical class 0.000 description 1
- KBLZDCFTQSIIOH-UHFFFAOYSA-M tetrabutylazanium;perchlorate Chemical compound [O-]Cl(=O)(=O)=O.CCCC[N+](CCCC)(CCCC)CCCC KBLZDCFTQSIIOH-UHFFFAOYSA-M 0.000 description 1
- VLLMWSRANPNYQX-UHFFFAOYSA-N thiadiazole Chemical compound C1=CSN=N1.C1=CSN=N1 VLLMWSRANPNYQX-UHFFFAOYSA-N 0.000 description 1
- GVIJJXMXTUZIOD-UHFFFAOYSA-N thianthrene Chemical compound C1=CC=C2SC3=CC=CC=C3SC2=C1 GVIJJXMXTUZIOD-UHFFFAOYSA-N 0.000 description 1
- NYVGTLXTOJKHJN-UHFFFAOYSA-N thianthrene 5-oxide Chemical compound C1=CC=C2S(=O)C3=CC=CC=C3SC2=C1 NYVGTLXTOJKHJN-UHFFFAOYSA-N 0.000 description 1
- 229930192474 thiophene Chemical group 0.000 description 1
- IBBLKSWSCDAPIF-UHFFFAOYSA-N thiopyran Chemical compound S1C=CC=C=C1 IBBLKSWSCDAPIF-UHFFFAOYSA-N 0.000 description 1
- NBOMNTLFRHMDEZ-UHFFFAOYSA-N thiosalicylic acid Chemical compound OC(=O)C1=CC=CC=C1S NBOMNTLFRHMDEZ-UHFFFAOYSA-N 0.000 description 1
- 229940103494 thiosalicylic acid Drugs 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- ITMCEJHCFYSIIV-UHFFFAOYSA-M triflate Chemical compound [O-]S(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-M 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- 239000012953 triphenylsulfonium Substances 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000001075 voltammogram Methods 0.000 description 1
- 229940045860 white wax Drugs 0.000 description 1
Classifications
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C381/00—Compounds containing carbon and sulfur and having functional groups not covered by groups C07C301/00 - C07C337/00
- C07C381/12—Sulfonium compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0046—Photosensitive materials with perfluoro compounds, e.g. for dry lithography
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
- G03F7/0382—Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
- G03F7/0397—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition the macromolecular compound having an alicyclic moiety in a side chain
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- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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Abstract
【解決手段】(a)ポリマー、並びに(b)(i)チオキサントン部分、および(ii)1つ以上の共有結合した酸不安定基を含む酸発生剤を含むフォトレジスト組成物。
【選択図】なし
Description
機能的特性の性能を改善するためにフォトレジスト組成物の構成を変更する種々の試みがなされている。特に、種々の光活性化合物が、フォトレジスト組成物に使用するために報告されている。米国特許出願公開第20070224540号および欧州特許出願公開第1906241号を参照。極紫外線(EUV)およびeビーム像形成技術も使用されている。米国特許第7,459,260号を参照。EUVは、短波長放射線、通常1nm〜40nmを利用しており、13.5nm放射線が使用されることが多い。
Rは、非水素置換基であり、
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、それぞれのTおよびそれぞれのT’は、同じかまたは異なる非水素置換基であり、
それぞれのLおよびそれぞれのL’は、同じかまたは異なる酸不安定基であり、T、L、T’およびL’非水素基が一緒になって環を形成してもよく、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1、2、3または4であり、nおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1、2、3または4であり、ここで、Rが酸不安定基を含まない場合、nおよびn’の少なくとも1つは、0より大きく、それによって酸発生剤化合物は、少なくとも1つの酸不安定基を含む。特定の態様において、好ましくはmおよびm’の一方または両方は0である。
本発明の特に好ましい酸発生剤化合物には、以下の式(IA)の構造を含む化合物が挙げられる:
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、それぞれのT、それぞれのT’、およびそれぞれのT’’は、同じかまたは異なる非水素置換基であり、それぞれのL、それぞれのL’およびそれぞれのL’’は、同じかまたは異なる酸不安定基であり、T、L、T’、L’、T’’およびL’’非水素基が一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1、2、3または4であり、m’’は0(T’’について水素が存在する場合)、1、2、3、4または5であり、nおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1、2、3または4であり、n’’は独立に0(L’’について水素が存在する場合)、1、2、3、4または5であり、並びにn、n’およびn’’の少なくとも1つは0以外である。特定の態様において、好ましくはm、m’およびm’’の1つ以上が0であり、並びにm、m’およびm’’のそれぞれが0であってもよい。
Zは対アニオンであり、
Rは、非水素置換基であり、
それぞれのTおよびそれぞれのT’は、同じかまたは異なる非水素置換基であり、
それぞれのLおよびそれぞれのL’は、同じかまたは異なる酸不安定基であり、T、L、T’およびL’非水素基が一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1、2、3または4であり、並びにnおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1、2、3または4である。特定の態様において、好ましくはmおよびm’の一方または両方は0である。好ましくは式(IB)の化合物は、酸不安定基を含み、例えばRは、酸不安定基を含んでいてもよく、および/またはnおよびn’’の一方または両方は0より大きい。
それぞれのT、それぞれのT’およびそれぞれのT’’は、同じかまたは異なる非水素置換基であり、
それぞれのL、それぞれのL’およびそれぞれのL’’は、同じかまたは異なる酸不安定基であり、T、L、T’、L’、T’’およびL’’非水素基が一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1、2、3または4であり、
m’’は0(T’’について水素が存在する場合)、1、2、3、4または5であり、
nおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1、2、3または4であり、n’’は独立に0(L’’が水素である場合)、1、2、3、4または5であり、n、n’およびn’’の少なくとも1つは0以外である。特定の態様において、好ましくはmおよびm’の一方または両方が0である。
Zは対アニオンであり、
Rは、非水素置換基であり、
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、好ましくはXは>C=Oであり、
それぞれのTおよびそれぞれのT’は、同じかまたは異なる非水素置換基であり、
それぞれのLおよびそれぞれのL’は、同じかまたは異なる酸不安定基であり、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1〜11であり、
nおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1〜12であり、より典型的には1〜4であり、またはさらにより典型的には1、2または3であり、
n’’は、独立に0(L’’が水素である場合)、1、2、3、4または5であり、
ここでRが酸不安定基を含まない場合、nおよびn’’の少なくとも1つは0より大きく、それによって酸発生剤化合物は、少なくとも1つの酸不安定基を含む。特定の態様において、好ましくはmおよびm’の一方または両方は0である。
Zは対アニオンであり、
Rは、非水素置換基であり、
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、好ましくはXは>C=Oであり、
それぞれのTおよびそれぞれT’は、同じかまたは異なる非水素置換基であり、
それぞれのLおよびそれぞれのL’は、同じかまたは異なる酸不安定基であり、
mおよびm’はそれぞれ独立に0(TまたはT’について水素が存在する場合)、1〜15であり、
nおよびn’はそれぞれ独立に0(LまたはL’について水素が存在する場合)、1〜16であり、より典型的には1〜4であり、またはさらにより典型的には1、2または3であり、
ここでRが酸不安定基を含まない場合、nおよびn’’の少なくとも1つは0より大きく、それによって酸発生剤化合物は少なくとも1つの酸不安定基を含む。特定の態様において、好ましくはmおよびm’の一方または両方は0である。
10−(5−((2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)カルボニル)−2−メトキシフェニル)−9−オキソ−4,4a,9,10−テトラヒドロチオキサンチリウム、
10−(5−((2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)カルボニル)−2−メトキシフェニル)−9−オキソ−2−(トリフルオロメチル)−4,4a,9,10−テトラヒドロチオキサンチリウム、
10−(4−tert−ブチルフェニル)−2−(2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)−1,3−ジメチル−9−オキソ−9,10−ジヒドロチオキサンチリウム、
5−(5−((2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)カルボニル)−2−メトキシフェニル)−5H−チアントレンオキシド−5−イウム、
10−(4−tert−ブチルフェニル)−2−((2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)カルボニル)−9−オキソ−9,10−ジヒドロチオキサンチリウム。
上記で議論されたように、本明細書に開示されるような酸発生剤化合物は、ポジ型およびネガ型化学増幅型レジスト組成物の双方をはじめとするフォトレジスト組成物における放射線感受性構成成分として有用である。
本発明のフォトレジストは、典型的には、本明細書に開示されるようなポリマーおよび1種以上の酸発生剤化合物を含む。好ましくはポリマーは、レジスト組成物に水性アルカリ現像性を付与する官能基を有する。例えば、極性官能基、例えばヒドロキシルまたはカルボキシレートまたはリソグラフィ処理時にこうした極性部分を放出できる酸不安定基を含むポリマーが好ましい。好ましくはポリマーは、アルカリ水溶液によりレジストを現像可能にするのに十分な量でレジスト組成物において使用される。
ヒール溶液は、2−フェニルプロパン−2−イルメタクリレート(0.39g)、2−オキソテトラヒドロフラン−3−イルメタクリレート(0.33g)、3,5−ビス(1,1,1,3,3,3−ヘキサフルオロ−2−ヒドロキシプロパン−2−イル)シクロヘキシルメタクリレート(0.57g)および5−(4−(2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)−3,5−ジメチルフェニル)−5H−ジベンゾ[b,d]チオフェニウム1,1−ジフルオロ−2−(メタクリロイルオキシ)エタンスルホネート(0.31g)を、12.81gのアセトニトリル/THF(2/1 v/v)に溶解させることによって製造された。フィード溶液は、2−フェニルプロパン−2−イルメタクリレート(185.54g、0.967mol)、2−オキソテトラヒドロフラン−3−イルメタクリレート(204.27、1.26mol)、3,5−ビス(1,1,1,3,3,3−ヘキサフルオロ−2−ヒロドキシプロパン−2−イル)シクロヘキシルメタクリレート(127.98g、0.29mol)および5−(4−(2−(1−エチルシクロペンチルオキシ)−2−オキソエトキシ)−3,5−ジメチルフェニル)−5H−ジベンゾ[b,d]チオフェニウム1,1−ジフルオロ−2−(メタクリロイルオキシ)エタンスルホネート(81.5g、0.132mol)を606gのEL/GBL(30/70v/v)中に溶解させることによって調製された。開始剤溶液は、65.96gの開始剤(V−65)を66gのアセトニトリル/THF(2/1v/v)中に溶解させることによって調製した。重合を、水冷却器およびフラスコ中の反応をモニターするための温度計を備えた2Lの3ッ口丸底フラスコにて行った。内容物をオーバーヘッド攪拌機を用いて撹拌した。反応器に、ヒール溶液を充填し、内容物を75℃で加熱した。フィード溶液および開始剤溶液をシリンジポンプを用いて4時間の期間にわたって反応器に供給した。次いで内容物をさらに2時間撹拌し、それによって反応をヒドロキノン(2.0g)を用いてクエンチした。内容物を室温まで冷却し、10×(重量による)のIPE/MeOH95/5(w/w)から2回沈澱させた。得られたポリマーを各沈澱工程の後に減圧下、50℃で24時間乾燥させ、500gのポリマーを得た。
ポジ型トーンフォトレジスト組成物は、エチルラクテート中の実施例22のポリマーの10重量%溶液4.943g、エチルラクテート中の実施例9の2重量%溶液9.627g、エチルラクート中の1,1’,1’’,1’’’−(エタン−1,2−ジイルビス(アザントリイル))テトラプロパン−2−オールの0.5重量%溶液6.525g、エチルラクテート中のフッ素化界面活性剤(OmnovaPF656)の0.5重量%溶液0.099gの、0.021gのエチルラクテートおよび8.784gのメチル−2−ヒドロキシイソブチレート(HBM)を合わせることによって調製された。
ポジ型トーンフォトレジスト組成物は、エチルラクテート中の実施例22のポリマーの10重量%溶液4.943g、エチルラクテート中の実施例13の2重量%溶液9.430g、エチルラクテート中の1,1’,1’’,1’’’−(エタン−1,2−ジイルビス(アザントリイル))テトラプロパン−2−オールの0.5重量%溶液6.525g、エチルラクテート中のフッ素化界面活性剤(OmnovaPF656)の0.5重量%溶液0.099g、0.021gのエチルラクテートおよび8.784gのHBMを合わせることによって調製された。
比較フォトレジスト(以下の表1の比較フォトレジスト)は、上記実施例23に記載されるように調製および処理されたが、ここで酸発生剤化合物は、縮合チオキサントン環の代わりに縮合5員スルホニウム環(すなわち、縮合(C)4S+環)を含有する。
還元電位は、アッセイが本明細書において定義されるように、標準電気化学電位アッセイによって決定された。以下の値が決定された(すべてAg/AgClに対する値、カソードピーク電位):
上記実施例6、7、8、9および19のそれぞれにおいて生じるカチオンに関して:−0.66ボルト。上記実施例11、12、13および14のそれぞれにおいて生じるカチオンに関して:−0.61V。比較分析として、トリフェニルスルホニウムカチオンに関して:−1.44V。
Claims (11)
- (a)ポリマー、並びに
(b)(i)チオキサントン部分、および
(ii)1つ以上の共有結合した酸不安定基
を含む酸発生剤
を含むフォトレジスト組成物。 - (a)ポリマー、および
(b)式(I)の構造を含む酸発生剤化合物
Rは、非水素置換基であり、
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、
それぞれのTおよびそれぞれのT’は、同じかまたは異なる非水素置換基であり、
それぞれのLおよびそれぞれのL’は、同じかまたは異なる酸不安定基であり、
T、L、T’およびL’非水素基は一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0、1、2、3または4であり、並びに
nおよびn’はそれぞれ独立に0、1、2、3または4であり、
ここで、Rが酸不安定基を含まない場合、nおよびn’の少なくとも1つは0より大きく、それによって前記酸発生剤化合物が少なくとも1つの酸不安定基を含む)
を含む、フォトレジスト組成物。 - 前記酸発生剤が式(IA)
Xは、>C=O、>S(O)、>S(O)2、−C(=O)O−、−C(=O)NH−、−C(=O)−C(=O)−、−O−、CHOH、CH2、またはSであり、
それぞれのT、それぞれのT’およびそれぞれのT’’は、同じかまたは異なる非水素置換基であり、
それぞれのL、それぞれのL’およびそれぞれのL’’は、同じかまたは異なる酸不安定基であり、
T、L、T’、L’、T’’およびL’’非水素基は一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0、1、2、3または4であり、m’’は0、1、2、3、4または5であり、nおよびn’はそれぞれ独立に0、1、2、3または4であり、n’’は独立に0、1、2、3、4または5であり、並びにn、n’およびn’’の少なくとも1つは0以外である)
の構造を含む、請求項2に記載のフォトレジスト組成物。 - 前記酸発生剤が、式(IC)
それぞれのT、それぞれのT’およびそれぞれのT’’は、同じかまたは異なる非水素置換基であり、
それぞれのL、それぞれのL’およびそれぞれのL’’は、同じかまたは異なる酸不安定基であり、T、L、T’、L’、T’’およびL’’非水素基は一緒になって環を形成していてもよく、
mおよびm’はそれぞれ独立に0、1、2、3または4であり、m’’は0、1、2、3、4または5であり、nおよびn’はそれぞれ独立に0、1、2、3または4であり、n’’は独立に0、1、2、3、4または5であり、n、n’およびn’’の少なくとも1つは0以外である)
の構造を含む、請求項2に記載のフォトレジスト組成物。 - 前記酸発生剤化合物が、標準還元電位アッセイにおいて−0.9〜0V(Ag/AgClに対して、カソードピーク電位)の還元電位を示す、請求項1から6のいずれか一項に記載のフォトレジスト組成物。
- 前記酸発生剤化合物がポリマーに共有結合されている、請求項1から7のいずれか一項に記載のフォトレジスト組成物。
- a)請求項1から9のいずれか一項に記載のフォトレジスト組成物のコーティング層を基体上に適用し、並びに
b)前記フォトレジスト組成物層を活性化放射線に露光し、および前記露光されたフォトレジスト組成物コーティング層を現像すること
を含むフォトレジストレリーフ像を提供するための方法。 - 前記フォトレジスト組成物層がEUVまたはeビーム放射線に露光される、請求項9に記載の方法。
- 請求項1から8のいずれか一項に記載の酸発生剤化合物。
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CN103728836A (zh) | 2014-04-16 |
TW201431850A (zh) | 2014-08-16 |
JP5739497B2 (ja) | 2015-06-24 |
TWI545118B (zh) | 2016-08-11 |
KR102019692B1 (ko) | 2019-09-09 |
KR101977603B1 (ko) | 2019-08-28 |
US9500947B2 (en) | 2016-11-22 |
KR20160009086A (ko) | 2016-01-25 |
US20140080059A1 (en) | 2014-03-20 |
KR20180132016A (ko) | 2018-12-11 |
CN103728836B (zh) | 2017-04-19 |
KR20140036115A (ko) | 2014-03-25 |
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