JP2014014868A5 - - Google Patents

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Publication number
JP2014014868A5
JP2014014868A5 JP2013130895A JP2013130895A JP2014014868A5 JP 2014014868 A5 JP2014014868 A5 JP 2014014868A5 JP 2013130895 A JP2013130895 A JP 2013130895A JP 2013130895 A JP2013130895 A JP 2013130895A JP 2014014868 A5 JP2014014868 A5 JP 2014014868A5
Authority
JP
Japan
Prior art keywords
stamp
solder
substrate
yarn
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013130895A
Other languages
English (en)
Japanese (ja)
Other versions
JP6150205B2 (ja
JP2014014868A (ja
Filing date
Publication date
Priority claimed from CH01044/12A external-priority patent/CH706712A1/de
Application filed filed Critical
Publication of JP2014014868A publication Critical patent/JP2014014868A/ja
Publication of JP2014014868A5 publication Critical patent/JP2014014868A5/ja
Application granted granted Critical
Publication of JP6150205B2 publication Critical patent/JP6150205B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2013130895A 2012-07-05 2013-06-21 フラックスフリーのハンダを基板に供給する方法および装置 Active JP6150205B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CH01044/12 2012-07-05

Publications (3)

Publication Number Publication Date
JP2014014868A JP2014014868A (ja) 2014-01-30
JP2014014868A5 true JP2014014868A5 (enExample) 2016-07-21
JP6150205B2 JP6150205B2 (ja) 2017-06-21

Family

ID=49578377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013130895A Active JP6150205B2 (ja) 2012-07-05 2013-06-21 フラックスフリーのハンダを基板に供給する方法および装置

Country Status (11)

Country Link
US (2) US9339885B2 (enExample)
JP (1) JP6150205B2 (enExample)
KR (1) KR102136896B1 (enExample)
CN (1) CN103521871B (enExample)
CH (2) CH706712A1 (enExample)
DE (1) DE102013105931A1 (enExample)
FR (1) FR2992879B1 (enExample)
IT (1) ITAN20130119A1 (enExample)
MX (1) MX362114B (enExample)
MY (1) MY175176A (enExample)
TW (1) TWI561324B (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
CN108326390B (zh) * 2017-01-17 2021-03-23 白光株式会社 熔融控制装置及计算机可读存储介质
DE102019103140A1 (de) * 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
CN110190001B (zh) * 2019-06-05 2020-11-03 扬州扬杰电子科技股份有限公司 一种轴向二极管的加工工艺

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
JPS57188832A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Soldering method
JPS6334269Y2 (enExample) * 1981-05-28 1988-09-12
US4577398A (en) 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4709849A (en) 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JPS6450595A (en) 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
CH680176A5 (enExample) * 1989-11-14 1992-06-30 Esec Sa
JPH04178266A (ja) * 1990-11-08 1992-06-25 Apollo Seiko Kk はんだゴテのコテ先構造
GB9126530D0 (en) * 1991-12-13 1992-02-12 Spirig Ernest Soldering device
JPH0745646A (ja) 1993-07-28 1995-02-14 Hitachi Ltd はんだ塗布装置
DE59609491D1 (de) 1995-07-01 2002-08-29 Esec Trading Sa Formstempel zum Austragen von flüssigem Lot
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
JP2844330B2 (ja) * 1996-05-09 1999-01-06 黒田電気株式会社 超音波ハンダ付方法及び装置
EP0852983B1 (de) 1997-01-08 2002-09-04 ESEC Trading SA Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
JP3319740B2 (ja) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ ロウ材塗布装置
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
JP4080326B2 (ja) 2002-12-27 2008-04-23 キヤノンマシナリー株式会社 ろう材供給ノズル
JP2006315043A (ja) * 2005-05-13 2006-11-24 Toko Inc リフロー溶接装置
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
JP2008296265A (ja) * 2007-06-01 2008-12-11 Canon Inc はんだ付け装置
US7699208B2 (en) * 2007-11-30 2010-04-20 Nordson Corporation Soldering tip, soldering iron, and soldering system
US7735715B2 (en) * 2007-12-07 2010-06-15 Asm Assembly Automation Ltd Dispensing solder for mounting semiconductor chips
JP5411542B2 (ja) * 2008-10-27 2014-02-12 和仁 鬼頭 溶接装置
JP2011051007A (ja) * 2009-09-04 2011-03-17 Japan Unix Co Ltd 超音波はんだ付け装置
DE102010000520A1 (de) * 2010-02-23 2011-08-25 SCHOTT Solar AG, 55122 Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
US20110272452A1 (en) 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
DE102010016814B3 (de) * 2010-05-05 2011-10-06 Schott Solar Ag Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
JP5498879B2 (ja) * 2010-07-09 2014-05-21 本田技研工業株式会社 半田付け装置及び方法
CH705035B1 (de) * 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.

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