JP2013539910A - アンダーフィル付き半導体チップデバイス - Google Patents

アンダーフィル付き半導体チップデバイス Download PDF

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Publication number
JP2013539910A
JP2013539910A JP2013528347A JP2013528347A JP2013539910A JP 2013539910 A JP2013539910 A JP 2013539910A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013539910 A JP2013539910 A JP 2013539910A
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Japan
Prior art keywords
semiconductor chip
underfill
sidewall
interposer
side wall
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JP2013528347A
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Japanese (ja)
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JP2013539910A5 (enExample
Inventor
ゼット． スー マイケル
フー レイ
リファイ・アハメド ガマル
ブラック ブライアン
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ATI Technologies ULC
Advanced Micro Devices Inc
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ATI Technologies ULC
Advanced Micro Devices Inc
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Publication of JP2013539910A publication Critical patent/JP2013539910A/ja
Publication of JP2013539910A5 publication Critical patent/JP2013539910A5/ja
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    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2013528347A 2010-09-09 2011-09-09 アンダーフィル付き半導体チップデバイス Pending JP2013539910A (ja)

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US12/878,812 US8691626B2 (en) 2010-09-09 2010-09-09 Semiconductor chip device with underfill
PCT/US2011/051075 WO2012034064A1 (en) 2010-09-09 2011-09-09 Semiconductor chip device with underfill

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US20120061853A1 (en) 2012-03-15
US8691626B2 (en) 2014-04-08
CN103098190A (zh) 2013-05-08
EP2614521A1 (en) 2013-07-17
KR20130109116A (ko) 2013-10-07
EP2614521B1 (en) 2018-01-24

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