JP2013539910A5 - - Google Patents

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Publication number
JP2013539910A5
JP2013539910A5 JP2013528347A JP2013528347A JP2013539910A5 JP 2013539910 A5 JP2013539910 A5 JP 2013539910A5 JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013539910 A5 JP2013539910 A5 JP 2013539910A5
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JP
Japan
Prior art keywords
semiconductor chip
sidewall
underfill
removable cover
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013528347A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013539910A (ja
Filing date
Publication date
Priority claimed from US12/878,812 external-priority patent/US8691626B2/en
Application filed filed Critical
Publication of JP2013539910A publication Critical patent/JP2013539910A/ja
Publication of JP2013539910A5 publication Critical patent/JP2013539910A5/ja
Pending legal-status Critical Current

Links

JP2013528347A 2010-09-09 2011-09-09 アンダーフィル付き半導体チップデバイス Pending JP2013539910A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US12/878,812 2010-09-09
US12/878,812 US8691626B2 (en) 2010-09-09 2010-09-09 Semiconductor chip device with underfill
PCT/US2011/051075 WO2012034064A1 (en) 2010-09-09 2011-09-09 Semiconductor chip device with underfill

Publications (2)

Publication Number Publication Date
JP2013539910A JP2013539910A (ja) 2013-10-28
JP2013539910A5 true JP2013539910A5 (enExample) 2014-10-30

Family

ID=44652038

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013528347A Pending JP2013539910A (ja) 2010-09-09 2011-09-09 アンダーフィル付き半導体チップデバイス

Country Status (6)

Country Link
US (1) US8691626B2 (enExample)
EP (1) EP2614521B1 (enExample)
JP (1) JP2013539910A (enExample)
KR (1) KR101571837B1 (enExample)
CN (1) CN103098190A (enExample)
WO (1) WO2012034064A1 (enExample)

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CN113571430B (zh) * 2020-04-28 2025-10-31 桑迪士克科技股份有限公司 具有减小的底部填充面积的倒装芯片封装体
KR102825809B1 (ko) * 2020-07-10 2025-06-27 삼성전자주식회사 언더필이 구비된 반도체 패키지 및 이의 제조 방법
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