JP2013539910A - アンダーフィル付き半導体チップデバイス - Google Patents
アンダーフィル付き半導体チップデバイス Download PDFInfo
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- JP2013539910A JP2013539910A JP2013528347A JP2013528347A JP2013539910A JP 2013539910 A JP2013539910 A JP 2013539910A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013528347 A JP2013528347 A JP 2013528347A JP 2013539910 A JP2013539910 A JP 2013539910A
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- H01L2924/12—Passive devices, e.g. 2 terminal devices
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Abstract
【選択図】図9
Description
Claims (21)
- 基板(120)の表面(215)上に取外し可能なカバー(195、195’、195’’)を設置するステップであって、前記基板は前記表面上に位置決めされる第1の半導体チップ(110)を含み、前記第1の半導体チップは第1の側壁(170)を含み、前記取外し可能なカバーは前記第1の側壁に対向して位置決めされる第2の側壁(200)を含むステップと、
前記第1の半導体チップと前記表面との間に第1のアンダーフィル(155)を設置するステップであって、前記第2の側壁は、前記第1のアンダーフィルの流れに対する障壁を提供するステップと、
を含む製造方法。 - 前記取外し可能なカバーは、前記第1のアンダーフィルが設置された後に前記表面から取り外される、請求項1の方法。
- 前記取り外しは、前記取外し可能なカバーを持ち上げる、または分解するステップを含む、請求項2の方法。
- 前記第1の半導体チップに対して電気試験を実行するステップを含む、請求項2の方法。
- 前記取外し可能なカバーを取り外すステップと、前記第1の半導体チップに隣接する前記表面上に第2の半導体チップ(115)を取り付けるステップとを含む、請求項1の方法。
- 前記第2の半導体チップは、前記第1のアンダーフィルに当接する第3の側壁(190)を含む、請求項5の方法。
- 前記第2の半導体チップと前記表面との間に第2のアンダーフィル(180)を設置するステップを含む、請求項6の方法。
- 前記基板は、半導体チップを含む、請求項1の方法。
- 前記基板は、キャリア基板およびインターポーザの内の1つを備える、請求項1の方法。
- 基板(120’)の表面上に取外し可能なカバー(195’’’’’)を設置するステップであって、前記基板は前記表面上に位置決めされる第1の半導体チップ(110)を含み、前記第1の半導体チップは第1の側壁(170)および前記第1の側壁に隣接する第2の側壁(295)を含み、前記カバーは前記第1の側壁に対向して位置決めされる第3の側壁(305)および前記第2の側壁に対向して位置決めされる第4の側壁(300)を含むステップと、
前記第1の半導体チップと前記表面との間に第1のアンダーフィルを設置するステップであって、前記第3の側壁および前記第4の側壁は前記第1のアンダーフィルの流れに対する障壁を提供するステップと、
を含む製造方法。 - 前記取外し可能なカバーは、前記第1のアンダーフィルが設置された後に前記表面から取り外される、請求項10の方法。
- 前記取り外しは、前記取外し可能なカバーを持ち上げる、または分解するステップを含む、請求項11の方法。
- 前記第1の半導体チップに対して電気試験を実行するステップを含む、請求項11の方法。
- 前記取外し可能なカバーを取り外すステップと、前記第1の半導体チップに隣接する前記表面に第2の半導体チップを取り付けるステップとを含む、請求項10の方法。
- 前記基板は、キャリア基板およびインターポーザの内の1つを備える、請求項10の方法。
- 表面(215)を含む基板(120)と、
前記表面上に位置決めされ、第1の側壁(170)を含む第1の半導体チップ(110)と、
前記表面上に位置決めされる取外し可能なカバー(195、195’、195’’)であって、前記第1の側壁に対向して位置決めされる第2の側壁(200)を含む取外し可能なカバーと、
を備える装置。 - 前記第1の半導体チップと前記表面との間に第1のアンダーフィル(155)を備え、前記第2の側壁は、前記第1のアンダーフィルの流れに対する障壁となる、請求項16の装置。
- 前記第1の半導体チップは第3の側壁を備え、前記取外し可能なカバーは、前記第3の側壁に対向して位置決めされる第4の側壁を備える、請求項16の装置。
- 表面(215)を含む基板(120)と、
前記表面上に位置決めされ、第1の側壁(170)を含む第1の半導体チップ(110)と、
前記第1の半導体チップと前記表面との間に位置決めされているアンダーフィル(155)であって、前記第1の側壁から離れる方向に向く第2の側壁(175)を有する隅肉(165)を含むアンダーフィル(155)と、
前記表面上に位置決めされ、前記第2の側壁に当接する第3の側壁(190)を含む、第2の半導体チップ(115)と、
を備える装置。 - 表面(215)を含む基板(120)と、
前記表面上に位置決めされ、第1の側壁(170)を含む第1の半導体チップ(110)と、
前記第1の半導体チップと前記表面との間に位置決めされているアンダーフィル(155)であって、前記第1の側壁から離れる方向に向き、且つ、前記第1の側壁と実質的に平行な第2の側壁(175)を有する隅肉(165)を含むアンダーフィル(155)と、
前記表面上に位置決めされ、前記第2の側壁に面する第3の側壁(190)を含む第2の半導体チップ(115)と、
を備える装置。 - 表面(215)を含む基板(120)と、
前記表面上に位置決めされ、第1の側壁(170)を含む第1の半導体チップ(110)と、
前記第1の側壁から離れる方向に向き、且つ、前記第1の側壁に実質的に平行な第2の側壁(190)を有する隅肉(165)を含み、前記第1の半導体チップと前記表面との間に位置決めされているアンダーフィル(155)であって、前記第1の側壁に対向して位置決めされる第2の側壁(200)を含む取外し可能なカバー(195、195’、195’’)を前記基板の前記表面上に設置し、前記第1の半導体チップと、前記第2の側壁が前記第1のアンダーフィルの流れに対する障壁を提供する前記表面との間に設置されることによって位置決めされるアンダーフィルと、
前記表面上に位置決めされ、前記第2の側壁に面する第3の側壁(190)を含む第2の半導体チップ(115)と、
を備える装置。
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PCT/US2011/051075 WO2012034064A1 (en) | 2010-09-09 | 2011-09-09 | Semiconductor chip device with underfill |
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