JP2013539254A - 薄膜超音波振動子 - Google Patents

薄膜超音波振動子 Download PDF

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Publication number
JP2013539254A
JP2013539254A JP2013521254A JP2013521254A JP2013539254A JP 2013539254 A JP2013539254 A JP 2013539254A JP 2013521254 A JP2013521254 A JP 2013521254A JP 2013521254 A JP2013521254 A JP 2013521254A JP 2013539254 A JP2013539254 A JP 2013539254A
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JP
Japan
Prior art keywords
layer
array
transducer
support structure
vibrator
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Pending
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JP2013521254A
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English (en)
Japanese (ja)
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JP2013539254A5 (enExample
Inventor
マレイケ クリー
ルエディガー マウクゾク
ヘンリ マリエ ジョセフ ブーツ
ワイルド ニコ マリス アドリアーン デ
ナイル バイユ クマー スレードハラン
オラフ ウンニッケ
ウィレム フランケ パスヴェール
デ ラゲマート ダーク バン
ペーター ダークセン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Koninklijke Philips NV
Koninklijke Philips Electronics NV
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Application filed by Koninklijke Philips NV, Koninklijke Philips Electronics NV filed Critical Koninklijke Philips NV
Publication of JP2013539254A publication Critical patent/JP2013539254A/ja
Publication of JP2013539254A5 publication Critical patent/JP2013539254A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0688—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction with foil-type piezoelectric elements, e.g. PVDF
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Micromachines (AREA)
  • Measurement Of Velocity Or Position Using Acoustic Or Ultrasonic Waves (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Piezo-Electric Transducers For Audible Bands (AREA)
JP2013521254A 2010-07-30 2011-07-12 薄膜超音波振動子 Pending JP2013539254A (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
EP10305849.1 2010-07-30
EP10305849 2010-07-30
EP11305741.8 2011-06-14
EP11305741 2011-06-14
PCT/IB2011/053096 WO2012014111A2 (en) 2010-07-30 2011-07-12 Thin film ultrasound transducer

Publications (2)

Publication Number Publication Date
JP2013539254A true JP2013539254A (ja) 2013-10-17
JP2013539254A5 JP2013539254A5 (enExample) 2015-08-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013521254A Pending JP2013539254A (ja) 2010-07-30 2011-07-12 薄膜超音波振動子

Country Status (5)

Country Link
US (2) US9440258B2 (enExample)
EP (1) EP2598255A2 (enExample)
JP (1) JP2013539254A (enExample)
CN (1) CN103097041B (enExample)
WO (1) WO2012014111A2 (enExample)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018098580A (ja) * 2016-12-09 2018-06-21 セイコーエプソン株式会社 超音波デバイス及び超音波装置
JP2019016934A (ja) * 2017-07-07 2019-01-31 コニカミノルタ株式会社 Ｍｅｍｓトランスデューサーの製造方法、ｍｅｍｓトランスデューサー、超音波探触子、および超音波診断装置
JP2019100791A (ja) * 2017-11-30 2019-06-24 セイコーエプソン株式会社 液面センサー及び液面検出方法
US10722214B2 (en) 2017-01-06 2020-07-28 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, and ultrasonic apparatus
JP2022042578A (ja) * 2020-09-03 2022-03-15 ホシデン株式会社 検知センサ及びこれを備えた検知装置

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JP6102075B2 (ja) 2012-03-30 2017-03-29 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
US8767512B2 (en) * 2012-05-01 2014-07-01 Fujifilm Dimatix, Inc. Multi-frequency ultra wide bandwidth transducer
US9660170B2 (en) 2012-10-26 2017-05-23 Fujifilm Dimatix, Inc. Micromachined ultrasonic transducer arrays with multiple harmonic modes
TW201416140A (zh) * 2012-10-31 2014-05-01 Ind Tech Res Inst 可撓式超音波致動裝置
WO2014103593A1 (ja) * 2012-12-26 2014-07-03 富士フイルム株式会社 ユニモルフ型超音波探触子およびその製造方法
JP6442821B2 (ja) * 2013-09-30 2018-12-26 セイコーエプソン株式会社 超音波デバイス及び電子機器
US9309105B2 (en) * 2014-03-06 2016-04-12 Infineon Technologies Ag Sensor structure for sensing pressure waves and ambient pressure
FR3022674B1 (fr) * 2014-06-18 2019-12-13 Iem Sarl Borne de detection comprenant un transducteur piezoelectrique fixe a une membrane liee a une structure de butee
EP3175490B2 (en) * 2014-08-01 2025-03-12 Chirp Microsystems, Inc. Miniature micromachined ultrasonic rangefinder
WO2016016810A1 (en) * 2014-08-01 2016-02-04 Koninklijke Philips N.V. Intravascular ultrasound imaging apparatus, interface architecture, and method of manufacturing
KR102375889B1 (ko) * 2014-12-19 2022-03-16 삼성전자주식회사 에너지 발생 장치 및 그 제조방법
JP6488709B2 (ja) * 2015-01-13 2019-03-27 セイコーエプソン株式会社 振動素子の製造方法、振動素子、電子デバイス、電子機器、および移動体
CN105232146B (zh) * 2015-11-18 2018-01-02 郑州大学 一种具有超声定位功能的介入消融导管
US9842241B2 (en) 2015-12-21 2017-12-12 Intel Corporation Biometric cryptography using micromachined ultrasound transducers
CN106160691A (zh) * 2016-07-05 2016-11-23 电子科技大学 一种基于Si基的高频SAW器件及其制备方法
JP2017000792A (ja) * 2016-08-17 2017-01-05 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
US10675476B2 (en) 2016-12-22 2020-06-09 Cardiac Pacemakers, Inc. Internal thoracic vein placement of a transmitter electrode for leadless stimulation of the heart
JP6311815B2 (ja) * 2017-03-02 2018-04-18 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
US10932062B2 (en) * 2018-02-17 2021-02-23 Apple Inc. Ultrasonic proximity sensors, and related systems and methods
JP7205191B2 (ja) * 2018-11-22 2023-01-17 セイコーエプソン株式会社 超音波センサー、及び電子機器
CN110046556B (zh) * 2019-03-27 2021-06-01 武汉华星光电技术有限公司 一种显示面板及其终端器件
CN110142194B (zh) * 2019-05-22 2021-01-29 京东方科技集团股份有限公司 声波换能器及驱动方法
US11063571B2 (en) * 2019-07-25 2021-07-13 Zhuhai Crystal Resonance Technologies Co., Ltd. Packaged electronic components
CN111001553B (zh) * 2019-12-18 2021-01-26 武汉大学 一种可调谐的超声传感器阵列
DE102020201802A1 (de) 2020-02-13 2021-08-19 Brose Fahrzeugteile Se & Co. Kommanditgesellschaft, Bamberg Ultraschallsensor eines Kraftfahrzeugs
AT523735B1 (de) 2020-11-10 2021-11-15 Ac2T Res Gmbh Hocheffektive Akustische Abschirmvorrichtung für Aerosole im Hinblick auf Atem- und Hautschutz
EP4272520A4 (en) * 2020-12-31 2024-11-13 Sofwave Medical Ltd. COOLING OF ULTRASONIC POWER SUPPLY DEVICES ON PRINTED CIRCUIT BOARDS
CN115078531B (zh) * 2021-03-15 2025-11-14 北京信泰智合科技发展有限公司 一种高频压电换能振元、高频超声探头和制备方法
CN112857276B (zh) * 2021-03-21 2023-05-16 中北大学 声表面波应变传感器及其制备方法
CN114007175B (zh) * 2021-10-19 2022-08-23 上海交通大学 超声换能器阵列及其形成方法
CN115276595A (zh) * 2022-07-04 2022-11-01 深圳市汇芯通信技术有限公司 声表面波滤波器、声表面波谐振器及其制造方法
CN115569827A (zh) * 2022-09-09 2023-01-06 中阳桥科技有限公司 一种陶瓷颗粒拼接成阵耐高温高压换能器
CN115400931B (zh) * 2022-10-31 2023-03-24 浙江仙声科技有限公司 一种减少超声换能器声串扰的深槽隔离方法及超声换能器
WO2025087040A1 (en) * 2023-10-26 2025-05-01 Hong Kong Centre For Logistics Robotics Limited Ultrasound transducers, arrays, systems comprising the same and methods of making the same

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JP2010164331A (ja) * 2009-01-13 2010-07-29 Seiko Epson Corp 入力装置及び電子機器

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JPH02238799A (ja) * 1989-03-13 1990-09-21 Nec Corp ソーナー用送受波器
JPH03125597U (enExample) * 1990-03-30 1991-12-18
JP2003143696A (ja) * 2001-11-07 2003-05-16 Aloka Co Ltd 超音波探触子
JP2005051689A (ja) * 2003-07-31 2005-02-24 Matsushita Electric Works Ltd 超音波アレイセンサおよび超音波センサ並びに超音波アレイセンサの製造方法
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018098580A (ja) * 2016-12-09 2018-06-21 セイコーエプソン株式会社 超音波デバイス及び超音波装置
US10722214B2 (en) 2017-01-06 2020-07-28 Seiko Epson Corporation Ultrasonic device, ultrasonic probe, and ultrasonic apparatus
JP2019016934A (ja) * 2017-07-07 2019-01-31 コニカミノルタ株式会社 Ｍｅｍｓトランスデューサーの製造方法、ｍｅｍｓトランスデューサー、超音波探触子、および超音波診断装置
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JP2019100791A (ja) * 2017-11-30 2019-06-24 セイコーエプソン株式会社 液面センサー及び液面検出方法
JP2022042578A (ja) * 2020-09-03 2022-03-15 ホシデン株式会社 検知センサ及びこれを備えた検知装置
JP7446957B2 (ja) 2020-09-03 2024-03-11 ホシデン株式会社 検知センサ及びこれを備えた検知装置

Also Published As

Publication number Publication date
EP2598255A2 (en) 2013-06-05
CN103097041A (zh) 2013-05-08
US20130208572A1 (en) 2013-08-15
US20160365840A1 (en) 2016-12-15
US9440258B2 (en) 2016-09-13
WO2012014111A2 (en) 2012-02-02
CN103097041B (zh) 2016-03-30
WO2012014111A3 (en) 2013-03-07

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