JP2013535107A5 - - Google Patents
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- Publication number
- JP2013535107A5 JP2013535107A5 JP2013515362A JP2013515362A JP2013535107A5 JP 2013535107 A5 JP2013535107 A5 JP 2013535107A5 JP 2013515362 A JP2013515362 A JP 2013515362A JP 2013515362 A JP2013515362 A JP 2013515362A JP 2013535107 A5 JP2013535107 A5 JP 2013535107A5
- Authority
- JP
- Japan
- Prior art keywords
- coil
- core structure
- conductive layer
- forming
- contact
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 claims 15
- 229910052751 metal Inorganic materials 0.000 claims 7
- 239000002184 metal Substances 0.000 claims 7
- 239000004065 semiconductor Substances 0.000 claims 4
- 238000000151 deposition Methods 0.000 claims 3
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 2
- 229910003962 NiZn Inorganic materials 0.000 claims 2
- 229910001035 Soft ferrite Inorganic materials 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 230000001939 inductive effect Effects 0.000 claims 1
- 239000012811 non-conductive material Substances 0.000 claims 1
- 238000002161 passivation Methods 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/816,788 US8410576B2 (en) | 2010-06-16 | 2010-06-16 | Inductive structure and method of forming the inductive structure with an attached core structure |
| US12/816,788 | 2010-06-16 | ||
| PCT/US2011/038483 WO2011159458A2 (en) | 2010-06-16 | 2011-05-30 | Inductive structure |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2013535107A JP2013535107A (ja) | 2013-09-09 |
| JP2013535107A5 true JP2013535107A5 (enExample) | 2014-06-19 |
| JP5783620B2 JP5783620B2 (ja) | 2015-09-24 |
Family
ID=45328493
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013515362A Active JP5783620B2 (ja) | 2010-06-16 | 2011-05-30 | 誘導性構造 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8410576B2 (enExample) |
| EP (1) | EP2583287B1 (enExample) |
| JP (1) | JP5783620B2 (enExample) |
| CN (1) | CN102934180B (enExample) |
| TW (1) | TWI549279B (enExample) |
| WO (1) | WO2011159458A2 (enExample) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6219719B2 (ja) * | 2010-10-23 | 2017-10-25 | ポップ テスト エルエルシー | 体液内の特定の成分のレベルを検出、検査、および監視するための装置および調合物、ならびに方法 |
| US8686722B2 (en) * | 2011-08-26 | 2014-04-01 | National Semiconductor Corporation | Semiconductor fluxgate magnetometer |
| FR2979790B1 (fr) * | 2011-09-07 | 2013-10-11 | Commissariat Energie Atomique | Capteur de courant |
| US8525281B2 (en) * | 2011-10-19 | 2013-09-03 | Texas Instruments Incorporated | Z-axis semiconductor fluxgate magnetometer |
| US8803648B2 (en) | 2012-05-03 | 2014-08-12 | Qualcomm Mems Technologies, Inc. | Three-dimensional multilayer solenoid transformer |
| WO2014071813A1 (zh) | 2012-11-08 | 2014-05-15 | 南通富士通微电子股份有限公司 | 半导体器件的封装件和封装方法 |
| CN102915986B (zh) | 2012-11-08 | 2015-04-01 | 南通富士通微电子股份有限公司 | 芯片封装结构 |
| WO2014071815A1 (zh) * | 2012-11-08 | 2014-05-15 | 南通富士通微电子股份有限公司 | 半导体器件及其形成方法 |
| KR101983137B1 (ko) * | 2013-03-04 | 2019-05-28 | 삼성전기주식회사 | 파워 인덕터 및 그 제조방법 |
| KR102260374B1 (ko) * | 2015-03-16 | 2021-06-03 | 삼성전기주식회사 | 인덕터 및 인덕터의 제조 방법 |
| JP6507027B2 (ja) * | 2015-05-19 | 2019-04-24 | 新光電気工業株式会社 | インダクタ及びその製造方法 |
| KR102105388B1 (ko) * | 2015-11-20 | 2020-04-28 | 삼성전기주식회사 | 코일 부품 및 그 제조 방법 |
| KR102163056B1 (ko) * | 2015-12-30 | 2020-10-08 | 삼성전기주식회사 | 코일 전자 부품 및 그 제조방법 |
| JP6658681B2 (ja) * | 2017-06-22 | 2020-03-04 | 株式会社村田製作所 | 積層インダクタの製造方法および積層インダクタ |
| US10930425B2 (en) * | 2017-10-25 | 2021-02-23 | Samsung Electro-Mechanics Co., Ltd. | Inductor |
| CN107808756B (zh) * | 2017-11-09 | 2020-03-20 | 西安华为技术有限公司 | 一种平板变压器及开关电源适配器 |
| KR101973448B1 (ko) * | 2017-12-11 | 2019-04-29 | 삼성전기주식회사 | 코일 부품 |
| KR102064041B1 (ko) * | 2017-12-11 | 2020-01-08 | 삼성전기주식회사 | 코일 부품 |
| KR102047595B1 (ko) * | 2017-12-11 | 2019-11-21 | 삼성전기주식회사 | 인덕터 및 그 제조방법 |
| US11398334B2 (en) * | 2018-07-30 | 2022-07-26 | At&S Austria Technologie & Systemtechnik Aktiengesellschaft | Component carrier comprising embedded inductor with an inlay |
| US20210375540A1 (en) * | 2020-05-28 | 2021-12-02 | Texas Instruments Incorporated | Integrated magnetic device with laminate embedded magnetic core |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0461267A (ja) * | 1990-06-29 | 1992-02-27 | Nippon Telegr & Teleph Corp <Ntt> | インダクタンス素子 |
| JPH0582736A (ja) * | 1991-07-15 | 1993-04-02 | Matsushita Electric Ind Co Ltd | インダクタ |
| US5336921A (en) * | 1992-01-27 | 1994-08-09 | Motorola, Inc. | Vertical trench inductor |
| JPH07183458A (ja) * | 1993-12-24 | 1995-07-21 | Toshiba Corp | 半導体装置 |
| JPH09213894A (ja) * | 1996-02-06 | 1997-08-15 | Nippon Telegr & Teleph Corp <Ntt> | 平滑回路素子 |
| US5852866A (en) * | 1996-04-04 | 1998-12-29 | Robert Bosch Gmbh | Process for producing microcoils and microtransformers |
| US5793272A (en) | 1996-08-23 | 1998-08-11 | International Business Machines Corporation | Integrated circuit toroidal inductor |
| JP3580054B2 (ja) * | 1996-10-29 | 2004-10-20 | 富士電機デバイステクノロジー株式会社 | 薄膜磁気素子およびその製造方法 |
| US6083802A (en) * | 1998-12-31 | 2000-07-04 | Winbond Electronics Corporation | Method for forming an inductor |
| US6835576B2 (en) * | 2000-05-02 | 2004-12-28 | Fuji Electric Co., Ltd. | Magnetic thin film, a magnetic component that uses this magnetic thin film, manufacturing methods for the same, and a power conversion device |
| JP2002043520A (ja) * | 2000-07-19 | 2002-02-08 | Sony Corp | 半導体装置及びその製造方法 |
| US6667536B2 (en) * | 2001-06-28 | 2003-12-23 | Agere Systems Inc. | Thin film multi-layer high Q transformer formed in a semiconductor substrate |
| US6639298B2 (en) * | 2001-06-28 | 2003-10-28 | Agere Systems Inc. | Multi-layer inductor formed in a semiconductor substrate |
| US7202152B2 (en) * | 2002-10-24 | 2007-04-10 | Davies Robert B | Semiconductor device with inductive component and method of making |
| US7132297B2 (en) * | 2002-05-07 | 2006-11-07 | Agere Systems Inc. | Multi-layer inductor formed in a semiconductor substrate and having a core of ferromagnetic material |
| JP2004311504A (ja) * | 2003-04-02 | 2004-11-04 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| JP4904813B2 (ja) * | 2003-06-16 | 2012-03-28 | 日本電気株式会社 | 半導体デバイスおよびその製造方法 |
| US7262680B2 (en) | 2004-02-27 | 2007-08-28 | Illinois Institute Of Technology | Compact inductor with stacked via magnetic cores for integrated circuits |
| US7462317B2 (en) | 2004-11-10 | 2008-12-09 | Enpirion, Inc. | Method of manufacturing an encapsulated package for a magnetic device |
| JP2006319094A (ja) * | 2005-05-12 | 2006-11-24 | Fujikura Ltd | 半導体装置およびその製造方法 |
| JP2006324509A (ja) * | 2005-05-19 | 2006-11-30 | Fujikura Ltd | 半導体装置およびその製造方法 |
| JP2006351686A (ja) * | 2005-06-14 | 2006-12-28 | Seiko Epson Corp | 半導体装置 |
| US7468899B1 (en) | 2007-01-09 | 2008-12-23 | National Semiconductor Corporation | Apparatus and method for wafer level fabrication of high value inductors on semiconductor integrated circuits |
| US7936246B2 (en) | 2007-10-09 | 2011-05-03 | National Semiconductor Corporation | On-chip inductor for high current applications |
| US7584533B2 (en) | 2007-10-10 | 2009-09-08 | National Semiconductor Corporation | Method of fabricating an inductor structure on an integrated circuit structure |
| US20090140383A1 (en) | 2007-11-29 | 2009-06-04 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of creating spiral inductor having high q value |
| US20090160592A1 (en) | 2007-12-20 | 2009-06-25 | Hopper Peter J | Helical core on-chip power inductor |
| DE112009000686T5 (de) * | 2008-03-24 | 2011-02-17 | ASIC Advantage Inc., Sunnyvale | Halbleiterpackage mit eingebetteter magnetischer Komponente und Verfahren zur Herstellung |
| US8044755B2 (en) | 2008-04-09 | 2011-10-25 | National Semiconductor Corporation | MEMS power inductor |
| US7705411B2 (en) | 2008-04-09 | 2010-04-27 | National Semiconductor Corporation | MEMS-topped integrated circuit with a stress relief layer |
| US7901981B2 (en) | 2009-02-20 | 2011-03-08 | National Semiconductor Corporation | Integrated circuit micro-module |
| US7902661B2 (en) | 2009-02-20 | 2011-03-08 | National Semiconductor Corporation | Integrated circuit micro-module |
| US7901984B2 (en) | 2009-02-20 | 2011-03-08 | National Semiconductor Corporation | Integrated circuit micro-module |
| US7898068B2 (en) | 2009-02-20 | 2011-03-01 | National Semiconductor Corporation | Integrated circuit micro-module |
| US7843056B2 (en) | 2009-02-20 | 2010-11-30 | National Semiconductor Corporation | Integrated circuit micro-module |
| US7842544B2 (en) | 2009-02-20 | 2010-11-30 | National Semiconductor Corporation | Integrated circuit micro-module |
-
2010
- 2010-06-16 US US12/816,788 patent/US8410576B2/en active Active
-
2011
- 2011-05-30 WO PCT/US2011/038483 patent/WO2011159458A2/en not_active Ceased
- 2011-05-30 JP JP2013515362A patent/JP5783620B2/ja active Active
- 2011-05-30 EP EP11796148.2A patent/EP2583287B1/en active Active
- 2011-05-30 CN CN201180028266.1A patent/CN102934180B/zh active Active
- 2011-06-14 TW TW100120674A patent/TWI549279B/zh active
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