JP2017501574A5 - - Google Patents

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Publication number
JP2017501574A5
JP2017501574A5 JP2016539293A JP2016539293A JP2017501574A5 JP 2017501574 A5 JP2017501574 A5 JP 2017501574A5 JP 2016539293 A JP2016539293 A JP 2016539293A JP 2016539293 A JP2016539293 A JP 2016539293A JP 2017501574 A5 JP2017501574 A5 JP 2017501574A5
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JP
Japan
Prior art keywords
inductor
wire
substrate
wire loop
series
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016539293A
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English (en)
Japanese (ja)
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JP2017501574A (ja
JP6360174B2 (ja
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Publication date
Priority claimed from US14/177,620 external-priority patent/US9692386B2/en
Application filed filed Critical
Publication of JP2017501574A publication Critical patent/JP2017501574A/ja
Publication of JP2017501574A5 publication Critical patent/JP2017501574A5/ja
Application granted granted Critical
Publication of JP6360174B2 publication Critical patent/JP6360174B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2016539293A 2013-12-23 2014-12-16 ３次元ワイヤボンド型インダクタ Expired - Fee Related JP6360174B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201361920334P 2013-12-23 2013-12-23
US61/920,334 2013-12-23
US14/177,620 US9692386B2 (en) 2013-12-23 2014-02-11 Three-dimensional wire bond inductor
US14/177,620 2014-02-11
PCT/US2014/070517 WO2015100067A1 (en) 2013-12-23 2014-12-16 Three-dimensional wire bond inductor

Publications (3)

Publication Number Publication Date
JP2017501574A JP2017501574A (ja) 2017-01-12
JP2017501574A5 true JP2017501574A5 (enExample) 2017-09-28
JP6360174B2 JP6360174B2 (ja) 2018-07-18

Family

ID=53401229

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016539293A Expired - Fee Related JP6360174B2 (ja) 2013-12-23 2014-12-16 ３次元ワイヤボンド型インダクタ

Country Status (5)

Country Link
US (1) US9692386B2 (enExample)
EP (1) EP3087600A1 (enExample)
JP (1) JP6360174B2 (enExample)
CN (1) CN105874594B (enExample)
WO (1) WO2015100067A1 (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9999121B2 (en) 2016-04-25 2018-06-12 Laird Technologies, Inc. Board level shields with virtual grounding capability
EP3282304B1 (fr) * 2016-08-08 2023-10-04 Essilor International Equipement ophtalmique; procédé d'alimentation d'un équipement ophtalmique
US10236852B2 (en) * 2016-12-09 2019-03-19 Nxp Usa, Inc. Parallel LC resonator and method therefor
CN106876372A (zh) * 2017-02-06 2017-06-20 无锡吉迈微电子有限公司 三维玻璃电感结构和制作工艺
CN109037196A (zh) * 2018-08-28 2018-12-18 湖南格兰德芯微电子有限公司 耦合电感结构
KR102830158B1 (ko) 2022-03-28 2025-07-07 삼성전자주식회사 캐패시터 와이어를 포함하는 칩 캐패시터
CN119731938A (zh) * 2023-02-17 2025-03-28 京东方科技集团股份有限公司 滤波器、集成无源器件、电子器件及显示装置

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