AU2002368201A1 - Semiconductor device with wire bond inductor and method - Google Patents

Semiconductor device with wire bond inductor and method

Info

Publication number
AU2002368201A1
AU2002368201A1 AU2002368201A AU2002368201A AU2002368201A1 AU 2002368201 A1 AU2002368201 A1 AU 2002368201A1 AU 2002368201 A AU2002368201 A AU 2002368201A AU 2002368201 A AU2002368201 A AU 2002368201A AU 2002368201 A1 AU2002368201 A1 AU 2002368201A1
Authority
AU
Australia
Prior art keywords
semiconductor device
wire bond
bond inductor
inductor
wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002368201A
Other versions
AU2002368201A8 (en
Inventor
Harold Anderson
Francis Carney
James Knapp
Cang Ngo
Yenting Wen
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Components Industries LLC
Original Assignee
Semiconductor Components Industries LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Components Industries LLC filed Critical Semiconductor Components Industries LLC
Publication of AU2002368201A8 publication Critical patent/AU2002368201A8/en
Publication of AU2002368201A1 publication Critical patent/AU2002368201A1/en
Abandoned legal-status Critical Current

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AU2002368201A 2002-09-10 2002-09-10 Semiconductor device with wire bond inductor and method Abandoned AU2002368201A1 (en)

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US8242384B2 (en) 2009-09-30 2012-08-14 International Business Machines Corporation Through hole-vias in multi-layer printed circuit boards
US8432027B2 (en) 2009-11-11 2013-04-30 International Business Machines Corporation Integrated circuit die stacks with rotationally symmetric vias
US8258619B2 (en) 2009-11-12 2012-09-04 International Business Machines Corporation Integrated circuit die stacks with translationally compatible vias
US8315068B2 (en) 2009-11-12 2012-11-20 International Business Machines Corporation Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same
US8310841B2 (en) 2009-11-12 2012-11-13 International Business Machines Corporation Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same
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HK1081326A1 (en) 2006-05-12
CN1669139A (en) 2005-09-14

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