AU2002368201A1 - Semiconductor device with wire bond inductor and method - Google Patents
Semiconductor device with wire bond inductor and methodInfo
- Publication number
- AU2002368201A1 AU2002368201A1 AU2002368201A AU2002368201A AU2002368201A1 AU 2002368201 A1 AU2002368201 A1 AU 2002368201A1 AU 2002368201 A AU2002368201 A AU 2002368201A AU 2002368201 A AU2002368201 A AU 2002368201A AU 2002368201 A1 AU2002368201 A1 AU 2002368201A1
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- wire bond
- bond inductor
- inductor
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
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- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
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- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19102—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device
- H01L2924/19104—Disposition of discrete passive components in a stacked assembly with the semiconductor or solid state device on the semiconductor or solid-state device, i.e. passive-on-chip
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- H01L2924/207—Diameter ranges
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Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2002/028883 WO2004025695A2 (en) | 2002-09-10 | 2002-09-10 | Semiconductor device with wire bond inductor and method |
Publications (2)
Publication Number | Publication Date |
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AU2002368201A8 AU2002368201A8 (en) | 2004-04-30 |
AU2002368201A1 true AU2002368201A1 (en) | 2004-04-30 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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AU2002368201A Abandoned AU2002368201A1 (en) | 2002-09-10 | 2002-09-10 | Semiconductor device with wire bond inductor and method |
Country Status (5)
Country | Link |
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JP (1) | JP4255442B2 (en) |
CN (1) | CN100423255C (en) |
AU (1) | AU2002368201A1 (en) |
HK (1) | HK1081326A1 (en) |
WO (1) | WO2004025695A2 (en) |
Families Citing this family (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7227240B2 (en) * | 2002-09-10 | 2007-06-05 | Semiconductor Components Industries, L.L.C. | Semiconductor device with wire bond inductor and method |
US7489022B2 (en) | 2005-08-02 | 2009-02-10 | Viasat, Inc. | Radio frequency over-molded leadframe package |
US7586193B2 (en) | 2005-10-07 | 2009-09-08 | Nhew R&D Pty Ltd | Mm-wave antenna using conventional IC packaging |
JP4990903B2 (en) * | 2005-10-19 | 2012-08-01 | エヌエックスピー ビー ヴィ | Apparatus comprising an element having an electrode coupled to a connection |
KR100704996B1 (en) | 2006-04-18 | 2007-04-09 | 인티그런트 테크놀로지즈(주) | Integrated circuit and package |
JP2009158839A (en) * | 2007-12-27 | 2009-07-16 | Sharp Corp | Semiconductor package, semiconductor device and wire bonding method |
JP2010118471A (en) * | 2008-11-12 | 2010-05-27 | Panasonic Corp | Semiconductor device |
US8107254B2 (en) | 2008-11-20 | 2012-01-31 | International Business Machines Corporation | Integrating capacitors into vias of printed circuit boards |
US8164158B2 (en) * | 2009-09-11 | 2012-04-24 | Stats Chippac, Ltd. | Semiconductor device and method of forming integrated passive device |
US8242384B2 (en) | 2009-09-30 | 2012-08-14 | International Business Machines Corporation | Through hole-vias in multi-layer printed circuit boards |
US8432027B2 (en) | 2009-11-11 | 2013-04-30 | International Business Machines Corporation | Integrated circuit die stacks with rotationally symmetric vias |
US8258619B2 (en) | 2009-11-12 | 2012-09-04 | International Business Machines Corporation | Integrated circuit die stacks with translationally compatible vias |
US8315068B2 (en) | 2009-11-12 | 2012-11-20 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with fuses and methods of manufacturing the same |
US8310841B2 (en) | 2009-11-12 | 2012-11-13 | International Business Machines Corporation | Integrated circuit die stacks having initially identical dies personalized with switches and methods of making the same |
US9646947B2 (en) | 2009-12-22 | 2017-05-09 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Integrated circuit with inductive bond wires |
CN101840906B (en) * | 2010-04-14 | 2011-08-17 | 锐迪科科技有限公司 | High Q-value chip integrated inductor |
US9159777B2 (en) * | 2011-04-15 | 2015-10-13 | Infineon Technologies Ag | Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil |
US9692386B2 (en) * | 2013-12-23 | 2017-06-27 | Qualcomm Incorporated | Three-dimensional wire bond inductor |
CN105374764A (en) * | 2014-08-29 | 2016-03-02 | 展讯通信(上海)有限公司 | Packaging structure for integrating inductor |
EP3198638A4 (en) * | 2014-09-22 | 2018-05-30 | Mc10, Inc. | Methods and apparatuses for shaping and looping bonding wires that serve as stretchable and bendable interconnects |
US10290412B2 (en) | 2015-06-25 | 2019-05-14 | Intel IP Corporation | Vertical inductor for WLCSP |
US10181435B2 (en) * | 2015-11-02 | 2019-01-15 | Texas Instruments Incorporated | Lead frame assembly |
US11715722B2 (en) * | 2020-04-30 | 2023-08-01 | Wolfspeed, Inc. | Wirebond-constructed inductors |
CN116864494B (en) * | 2023-09-01 | 2023-12-05 | 甬矽电子(宁波)股份有限公司 | Fan-out type packaging structure and manufacturing method thereof |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2089119A (en) * | 1980-12-10 | 1982-06-16 | Philips Electronic Associated | High voltage semiconductor devices |
JPH06140451A (en) * | 1992-10-27 | 1994-05-20 | Hitachi Ltd | Semiconductor integrated circuit device |
JPH10289921A (en) * | 1997-04-14 | 1998-10-27 | Matsushita Electric Ind Co Ltd | Semiconductor device |
KR100530871B1 (en) * | 1998-08-14 | 2006-06-16 | 이해영 | Bonding wire inductor, and chip-inductor, coupler and transformer including the bonding wire inductor |
JP2002164214A (en) * | 2000-10-27 | 2002-06-07 | Xerox Corp | Non-flush microcoil using bonding wire and its manufacturing method |
-
2002
- 2002-09-10 WO PCT/US2002/028883 patent/WO2004025695A2/en active Search and Examination
- 2002-09-10 CN CNB028295935A patent/CN100423255C/en not_active Expired - Fee Related
- 2002-09-10 AU AU2002368201A patent/AU2002368201A1/en not_active Abandoned
- 2002-09-10 JP JP2004535363A patent/JP4255442B2/en not_active Expired - Fee Related
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2006
- 2006-01-26 HK HK06101181.1A patent/HK1081326A1/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
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CN100423255C (en) | 2008-10-01 |
AU2002368201A8 (en) | 2004-04-30 |
WO2004025695A2 (en) | 2004-03-25 |
JP2005538560A (en) | 2005-12-15 |
JP4255442B2 (en) | 2009-04-15 |
WO2004025695A3 (en) | 2004-06-17 |
HK1081326A1 (en) | 2006-05-12 |
CN1669139A (en) | 2005-09-14 |
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