CN116864494B - Fan-out type packaging structure and manufacturing method thereof - Google Patents

Fan-out type packaging structure and manufacturing method thereof Download PDF

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Publication number
CN116864494B
CN116864494B CN202311119668.3A CN202311119668A CN116864494B CN 116864494 B CN116864494 B CN 116864494B CN 202311119668 A CN202311119668 A CN 202311119668A CN 116864494 B CN116864494 B CN 116864494B
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inductor
groove
fan
layer
seed layer
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CN116864494A (en
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徐玉鹏
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Forehope Electronic Ningbo Co Ltd
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Forehope Electronic Ningbo Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/645—Inductive arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/4824—Pads with extended contours, e.g. grid structure, branch structure, finger structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0231—Manufacturing methods of the redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0233—Structure of the redistribution layers
    • H01L2224/02331—Multilayer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02381—Side view

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

The disclosure provides a fan-out type packaging structure and a manufacturing method of the fan-out type packaging structure, and relates to the technical field of semiconductor packaging. The fan-out type packaging structure comprises an electronic element, a plastic package body, an inductor and a wiring layer, wherein the electronic element is provided with a bonding pad; the plastic package body wraps the electronic element, and the bonding pad is exposed out of the plastic package body. The inductor and the electronic element are arranged at intervals and distributed along the height direction of the plastic package body; the inductor is provided with an anode and a cathode; the wiring layer is electrically connected with the bonding pad; the positive electrode and the negative electrode are electrically connected to the wiring layers, respectively. In the packaging structure, the inductor is vertically arranged and is spaced apart from the electronic element, so that the arrangement space of the inductor is increased, and the heat dissipation effect is improved.

Description

Fan-out type packaging structure and manufacturing method thereof
Technical Field
The invention relates to the technical field of semiconductor packaging, in particular to a fan-out type packaging structure and a manufacturing method of the fan-out type packaging structure.
Background
In recent years, with the rapid development of the semiconductor industry, wafer level package structures are widely used in the semiconductor industry. Generally, a single chip is cut from a wafer and then packaged on a carrier wafer, which has the main advantages of high density integration, small size of packaged products, excellent product performance, high signal transmission frequency, and the like, and multiple rewiring layers are usually required to be arranged to connect functional pads on the chip and grounding pad lines to the outside, however, the rapid development of the communication field makes the demands of wafer-level radio frequency chip packaged products and the like continuously increase. In order to meet the requirements of low loss and high integration, the design of an inductance structure in a wiring layer has become an important unit in communication modules such as voltage-controlled oscillators, low noise amplifiers, mixers, filters and the like, and the conventional inductance structure is usually formed on the surface of a chip by using the wiring layer structure, which is prone to problems such as poor heat dissipation.
Disclosure of Invention
The invention aims to provide a fan-out type packaging structure and a manufacturing method of the fan-out type packaging structure, which can effectively solve the heat dissipation problem of the packaging structure.
Embodiments of the invention may be implemented as follows:
in a first aspect, the present invention provides a fan-out package structure, comprising:
an electronic component provided with a bonding pad;
the plastic packaging body is used for coating the electronic element, and the bonding pads are exposed out of the plastic packaging body;
the inductor and the electronic element are arranged at intervals and are distributed along the height direction of the plastic package body; the inductor is provided with an anode and a cathode;
a wiring layer electrically connected to the pad; the positive electrode and the negative electrode are electrically connected to the wiring layer, respectively.
In an alternative embodiment, the plastic package body is provided with a first groove, and the inductor is arranged in the first groove.
In an alternative embodiment, a heat conducting layer is disposed in the first groove.
In an alternative embodiment, a seed layer is disposed in the first groove, the seed layer is electrically connected with the inductor, and the heat conducting layer covers the seed layer.
In an alternative embodiment, a seed layer is disposed in the first groove, and the seed layer is electrically connected to the inductor.
In an alternative embodiment, a step is arranged in the first groove, the step is higher than the bottom of the first groove, and the seed layer covers the step and the bottom of the groove.
In an alternative embodiment, a magnetic core structure is provided within the inductor.
In an alternative embodiment, the inductor comprises a plurality of metal posts connected in multiple segments, and the magnetic core structure is arranged among a plurality of the metal posts.
In an alternative embodiment, the inductor comprises a plurality of metal posts connected in multiple segments, and a plurality of the metal posts are distributed in an array, a ring, an arc or a polygon.
In an alternative embodiment, the inductor includes a first inductor and a second inductor, the first inductor and the second inductor are respectively connected with the conductive post, and the positive electrode and the negative electrode are respectively connected with the conductive post.
In an alternative embodiment, the first inductor and the second inductor are disposed opposite to each other or are disposed offset from each other.
In an alternative embodiment, a magnetic core structure is arranged between the first inductor and the second inductor.
In an optional embodiment, the plastic package body is provided with a second groove and a third groove with opposite notches, the first inductor is arranged in the second groove, and the second inductor is arranged in the third groove.
In an alternative embodiment, seed layers are respectively disposed in the second groove and the third groove, the first inductor is connected with the seed layer in the second groove, and the second inductor is connected with the seed layer in the third groove.
In an alternative embodiment, the seed layer in the second recess and the seed layer in the third recess are connected by the conductive pillars.
In an alternative embodiment, the magnetic core structure further comprises an elastic member, wherein the magnetic core structure is connected with the elastic member, and one end, away from the magnetic core structure, of the elastic member is used for being connected with the fixed carrier.
In an optional embodiment, the device further comprises a housing, the housing is arranged between the first inductor and the second inductor, the magnetic core structure is arranged in the housing, and one end, away from the magnetic core structure, of the elastic piece is fixedly connected with the housing.
In an alternative embodiment, a notch is formed in a side wall of the plastic package body, and the notch is used for assembling and disassembling the magnetic core structure.
In an alternative embodiment, a first heat conducting layer is arranged on one side, close to the second inductor, of the first inductor; and a second heat conduction layer is arranged on one side of the second inductor away from the first inductor.
In an alternative embodiment, the electronic component further comprises a dielectric layer, wherein the dielectric layer covers a wiring layer above the electronic component; alternatively, the dielectric layer covers a wiring layer over the electronic component and a wiring layer over the inductor.
In an alternative embodiment, solder balls are disposed on the dielectric layer, and the solder balls are electrically connected to the wiring layer.
In a second aspect, the present invention provides a method for manufacturing a fan-out package structure, including:
s1: encapsulating the electronic element by using the plastic encapsulation body; the electronic element comprises a bonding pad, wherein the bonding pad is exposed out of the plastic package body;
s2: arranging inductors on the plastic package body at intervals of the electronic elements; the inductor is arranged along the height direction of the plastic package body, and is provided with a positive electrode and a negative electrode;
s3: arranging a wiring layer on the plastic package body; the wiring layer is electrically connected with the bonding pad; the positive electrode and the negative electrode are electrically connected to the wiring layer, respectively.
In an alternative embodiment, step S2 includes:
a first groove is formed in the plastic package body; wherein the first groove and the electronic element are arranged at intervals;
setting a seed layer in the first groove;
a heat conduction layer covering the seed layer is arranged in the first groove;
a connecting hole is formed in the heat conducting layer; wherein the connection hole ends in the seed layer;
and arranging metal posts in the connecting holes to form the vertical inductor.
In an alternative embodiment, the step of forming the first groove on the plastic package body includes:
a first groove is formed in the plastic package body;
and a reinforcing groove is formed at the bottom of the first groove so as to form a step.
In an alternative embodiment, the step of disposing a seed layer in the first recess includes:
seed layers are respectively arranged on the reinforcing grooves and the steps.
In an alternative embodiment, after step S2, the method further comprises:
a magnetic core structure is disposed within the inductor.
In an alternative embodiment, step S2 includes:
a second groove is formed in the plastic package body; wherein the second groove and the electronic element are arranged at intervals;
forming a first seed layer in the second groove;
forming a first inductor connected with the first seed layer in the second groove;
a first dielectric layer is arranged in the second groove to cover the first inductor;
a third groove is formed in the first dielectric layer;
forming a second inductor in the third groove;
forming a second seed layer connected with the second inductor in the third groove;
a second medium layer is arranged in the third groove to cover the second seed layer;
forming a conductive pillar to electrically connect the first seed layer and the second seed layer;
setting a positive electrode and a negative electrode; wherein, the conductive post is connected with positive pole and negative pole respectively.
In an alternative embodiment, before the step of disposing a dielectric layer one in the second recess to cover the first inductor, the method further includes: and a magnetic core structure is arranged on one side of the first inductor, which is far away from the first seed layer.
The beneficial effects of the embodiment of the invention include, for example:
according to the fan-out type packaging structure provided by the embodiment of the invention, the electronic element and the inductor are arranged at intervals, and the inductor is arranged along the height direction of the plastic package body, namely is designed to be a vertical inductor, so that the arrangement space of the inductor can be increased, and the heat dissipation effect of the packaging structure can be improved.
According to the manufacturing method of the fan-out type packaging structure provided by the embodiment of the invention, the electronic element is firstly subjected to plastic packaging, then the vertical inductor is arranged on the plastic packaging body, and finally the wiring layer is arranged. The vertical inductor is electrically connected to the wiring layer on the surface. In the packaging method, the inductor has enough layout space, which is beneficial to improving the heat dissipation performance of the packaging structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of a first structure of a fan-out package structure according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a second structure of a fan-out package structure according to an embodiment of the present invention;
fig. 3 is a schematic top view of an inductor with a fan-out package structure according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a third structure of a fan-out package structure according to an embodiment of the present invention;
fig. 5 is a schematic top view of a third structure of a fan-out package structure according to an embodiment of the present invention;
fig. 6 is a schematic diagram of a fourth structure of a fan-out package structure according to an embodiment of the present invention;
fig. 7 to fig. 9 are schematic views illustrating steps of a fan-out package structure manufacturing method for manufacturing a single inductor according to an embodiment of the present invention;
fig. 10 and 11 are schematic diagrams illustrating steps of a fan-out package structure manufacturing method for manufacturing a dual inductor according to an embodiment of the present invention.
Icon: 100-fan-out package structure; 110-an electronic component; 111-bonding pads; 120-plastic package body; 121-a first groove; 122-steps; 123-seed layer; 1231-a first seed layer; 1233-a second seed layer; 125-a thermally conductive layer; 126-a second groove; 127-third groove; 128-conductive pillars; 129-connecting holes; 130-inductance; 131-positive electrode; 133-negative electrode; 135-a first inductance; 136-a second inductance; 137-dielectric layer one; 138-medium layer two; 140-a magnetic core structure; 141-an elastic member; 143-a housing; 145-notch; 150-a wiring layer; 151-metal blocks; 153-metal conductive block; 155-UBM metal layer; 160-a dielectric layer; 161-a first dielectric layer; 1611-opening; 162-a second dielectric layer; 1621-a graphics layer opening; 163-a third dielectric layer; 171-backing film; 173 solder balls; 175-carrier.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments of the present invention. The components of the embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the invention, as presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that: like reference numerals and letters denote like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
In the description of the present invention, it should be noted that, if the terms "upper", "lower", "inner", "outer", and the like indicate an azimuth or a positional relationship based on the azimuth or the positional relationship shown in the drawings, or the azimuth or the positional relationship in which the inventive product is conventionally put in use, it is merely for convenience of describing the present invention and simplifying the description, and it is not indicated or implied that the apparatus or element referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus it should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, if any, are used merely for distinguishing between descriptions and not for indicating or implying a relative importance.
It should be noted that the features of the embodiments of the present invention may be combined with each other without conflict.
First embodiment
Referring to fig. 1, the present embodiment provides a fan-out package structure 100, which includes an electronic component 110, a plastic package body 120, an inductor 130 and a wiring layer 150, wherein the electronic component 110 is provided with a bonding pad 111; the plastic package body 120 encapsulates the electronic component 110, and the bonding pads 111 are exposed out of the plastic package body 120. The inductor 130 and the electronic element 110 are arranged at intervals and distributed along the height direction of the plastic package 120; the inductor 130 is provided with a positive electrode 131 and a negative electrode 133; the wiring layer 150 and the pad 111 are electrically connected; the positive electrode 131 and the negative electrode 133 are electrically connected to the wiring layer 150, respectively. In the package structure, the inductor 130 is vertically arranged and is spaced apart from the electronic component 110, so that the layout space of the inductor 130 is increased, and the heat dissipation effect is improved. In addition, the layout space of the inductor 130 is larger, and the inductor 130 with a thicker diameter can be designed, so that the overcurrent capacity of the inductor 130 is improved.
Referring to fig. 2, a first groove 121 is formed on the plastic package body 120, and the inductor 130 is disposed in the first groove 121. Through setting up first recess 121, bury inductor 130 in plastic envelope body 120, the overall dimension is less, compact structure reduces the volume. Optionally, a heat conducting layer 125 is disposed in the first groove 121, so as to improve the heat conducting performance of the package structure. The heat conductive layer 125 may be made of a high heat conductive adhesive or a high heat conductive thermoplastic sealing material. Optionally, a seed layer 123 is disposed in the first groove 121, and the seed layer 123 is electrically connected to the inductor 130. The seed layer 123 may be a metallic material such as copper, titanium, or other metals. The seed layer 123 is beneficial to better growing the copper pillar to form the inductor 130 and is also beneficial to improving the bonding force between the inductor 130 and the plastic package 120.
In this embodiment, a seed layer 123 is disposed in the first recess 121, the seed layer 123 is electrically connected to the inductor 130, and the heat conducting layer 125 covers the seed layer 123. Thus, the bonding force between the inductor 130 and the plastic package 120 can be improved, and the heat conduction effect can be enhanced. Optionally, a step 122 is disposed in the first groove 121, the step 122 is higher than the bottom of the first groove 121, and the seed layer 123 covers the step 122 and the bottom of the groove, so that the bonding force between the seed layer 123 and the plastic package body 120 can be further improved, and the heat dissipation effect is improved. The first groove 121 is internally provided with the step-shaped steps 122, the number and the size and the shape of the steps 122 are not limited, the groove bottom and the steps 122 can be also arranged to be of an uneven structure, the bonding force between the seed layer 123 and the plastic package body 120 is further improved, the bonding force between the inductor 130 and the seed layer 123 is further improved, the reliability of the inductor 130 is improved, and the occurrence of the structure layering phenomenon is prevented. The step 122 can also increase the contact area with the heat conductive layer 125, improving the heat dissipation effect.
Optionally, a magnetic core structure 140 is disposed within the inductor 130. The magnetic structure may be a magnet block, or other magnetic material filled to facilitate increasing the magnetic flux and increasing the current strength of the inductor 130. It is readily understood that the inductor 130 includes a plurality of metallic legs connected in multiple segments, with the magnetic core structure 140 disposed between the plurality of metallic legs. The magnetic core structure 140 may be located in a gap between adjacent metal posts, or may be located in a structural region surrounded by a plurality of metal posts. The plurality of metal posts may be distributed in an array, ring, arc, or polygon shape or a plurality of concentric circle windings, or may be distributed in a shape of a "back" shape or a "meter" shape or a spiral winding shape, etc., and are not particularly limited herein.
The wiring layer 150 in the area above the inductor 130 may be designed to be identical to the cross-sectional size and shape of the inductor 130, or may be designed to be different in shape and size separately, as long as the positive electrode 131 and the negative electrode 133 of the inductor 130 can be electrically connected to an external circuit through the wiring layer 150. The wiring layer 150 over the inductor 130 area may be bare or covered by a dielectric layer 160 as desired.
The side of the electronic component 110 away from the bonding pad 111 is provided with an adhesive-backed film 171 for protecting the electronic component 110. The electronic component 110 may be a chip, a capacitor, an inductor 130, or other components. The plastic package body 120 is provided with a dielectric layer 160, the dielectric layer 160 is internally provided with a wiring layer 150, and the dielectric layer 160 can protect and insulate the wiring layer 150. It is understood that the dielectric layer 160 covers the wiring layer 150 above the electronic component 110, and the wiring layer 150 above the inductor 130 may be disposed bare. Alternatively, the dielectric layer 160 covers the wiring layer 150 above the electronic component 110 and the wiring layer 150 above the inductor 130, and protects the entire wiring layer 150. It is understood that the positive electrode 131 and the negative electrode 133 of the inductor 130 are disposed above the inductor 130 and within the dielectric layer 160. The positive electrode 131 and the negative electrode 133 are electrically connected to an external line through the wiring layer 150.
With reference to fig. 3, it can be appreciated that if the inductor 130 adopts a circular or rectangular multi-turn winding structure, the inductor can be applied in the field of radio frequency communication technology, i.e. wireless communication technology. The RFID radio frequency identification technology is an emerging automatic identification technology developed in the 80 th century of 20, and is a technology which realizes contactless information transmission by using radio frequency signals through spatial coupling (alternating magnetic field or electromagnetic field) and achieves the identification purpose through the transmitted information. RFID is a simple wireless system with only two basic devices for controlling, detecting and tracking objects. The system consists of an interrogator (or reader) and a number of transponders (or tags).
The surface of the dielectric layer 160 is provided with a UBM metal layer 155 for forming the connection pad 111, and the UBM metal layer 155 may be made of at least one material selected from titanium and tungsten, or may be made of the rest of metal materials or a mixture of metals. UBM metal layer 155 is electrically connected to wiring layer 150 and connection pads 111 may be used to form solder balls 173, i.e., solder balls 173 are electrically connected to wiring layer 150. The solder balls 173 protrude from the surface of the dielectric layer 160 and serve as electrical connection terminals of the package structure.
Referring to fig. 4 and 5, alternatively, the inductor 130 includes a first inductor 135 and a second inductor 136, the first inductor 135 and the second inductor 136 are respectively connected to the conductive post 128, and the positive electrode 131 and the negative electrode 133 are respectively connected to the conductive post 128. The first inductor 135 and the second inductor 136 are disposed opposite to each other or are disposed offset from each other. With the dual inductor 130 structure, magnetic flux can be improved. The two inductors 130 share the anode 131 and the cathode 133, so that the structure is more compact, the volume is reduced, and the integration level is improved. Optionally, a magnetic core structure 140 is disposed between the first inductor 135 and the second inductor 136, so as to further increase the magnetic flux and the current intensity of the inductor 130. Of course, in some embodiments, the magnetic core structure 140 may be omitted.
Optionally, the plastic package body 120 is provided with a second groove 126 and a third groove 127 with opposite notches, the first inductor 135 is disposed in the second groove 126, and the second inductor 136 is disposed in the third groove 127. The second groove 126 and the third groove 127 are respectively provided with a seed layer 123, the first inductor 135 is connected with the seed layer 123 in the second groove 126, and the second inductor 136 is connected with the seed layer 123 in the third groove 127. The seed layer 123 in the second recess 126 and the seed layer 123 in the third recess 127 are connected by a conductive post 128.
Optionally, a heat conducting layer 125 is filled between the first inductor 135 and the second inductor 136 and the plastic package body 120, so as to improve heat dissipation performance. Specifically, a first heat conducting layer 125 is disposed on a side of the first inductor 135 close to the second inductor 136; the side of the second inductor 136 away from the first inductor 135 is provided with a second heat conducting layer 125. The conductive pillars 128 are respectively connected to the two seed layers 123 through the heat conductive layer 125. The heat conducting layer 125 may be made of heat conducting glue, plastic package 120 or buffer material, and has the functions of buffering, absorbing stress and conducting heat. It can be appreciated that the heat conductive layer 125 may be a high-conductivity thermoplastic sealing body, and the insulating property and the high dielectric constant of the high-conductivity thermoplastic sealing body, for example, the dielectric constant is 10-20 ∈r, so as to prevent the parasitic inductance 130 and the heat energy generated by the inductance 130 from affecting the other wiring layers 150, and improve the insulating property and the heat dissipation performance of the inductance 130. In this way, the dielectric layer 160 can be made of a material with a lower dielectric constant, for example, a material with a dielectric constant of 3 εr or less, so as to improve the transmission efficiency of the chip surface wiring layer 150. Of course, the heat conducting layer 125 is made of a material inconsistent with the material of the plastic package body 120, and the heat conducting layer 125 is used as a buffer layer, so that stress generated by the plastic package body 120 is avoided, and stress influence caused by buckling deformation is prevented. In this embodiment, the dielectric constant of the heat conducting layer 125 is higher than that of the plastic package body 120, and the dielectric constant of the plastic package body 120 is higher than that of the dielectric layer 160.
It should be noted that, the first heat conducting layer 125 may also be made of a magnetic material and serve as the magnetic core structure 140, so that the first inductor 135 and the second inductor 136 share the magnetic core structure 140, and the structure is more compact.
The other end of the conductive post 128 is flush with the surface of the plastic package body 120, and is connected with the positive electrode 131 and the negative electrode 133 respectively. The positive electrode 131 and the negative electrode 133 are electrically connected to an external line through the wiring layer 150.
Referring to fig. 6, optionally, the fan-out package structure 100 further includes an elastic member 141, the magnetic core structure 140 is connected to the elastic member 141, and an end of the elastic member 141 away from the magnetic core structure 140 is used for being connected to the fixing carrier. In this embodiment, a housing 143 is disposed between the first inductor 135 and the second inductor 136, and the housing 143 serves as a fixing carrier for connecting the elastic member 141. The magnetic core structure 140 is disposed in the housing 143, and an end of the elastic member 141 away from the magnetic core structure 140 is fixedly connected with the housing 143. So arranged, by passing different magnitudes of current between the first inductor 135 and the second inductor 136, the magnetic core structure 140 is magnetically affected to generate transverse or longitudinal vibration, and can be applied to products having linear or nonlinear vibration motors. It is readily understood that the magnetic core structure 140 is disposed between the first inductor 135 and the second inductor 136, and the step 122 may support the magnetic core structure 140 or the housing 143.
Optionally, a notch 145 is provided on a side wall of the plastic package body 120, and the notch 145 is used for assembling and disassembling the magnetic core structure 140, so as to facilitate replacement and assembling and disassembling of the magnetic core structure 140. At the same time, the notch 145 can further improve heat dissipation.
Second embodiment
Referring to fig. 7 to fig. 9, the embodiment of the present invention further provides a method for manufacturing a fan-out package structure 100, which mainly includes the following steps:
s1: encapsulating the electronic component 110 with the plastic encapsulation 120; the electronic component 110 includes a bonding pad 111, and the bonding pad 111 exposes the plastic package 120. Specifically, the electronic component 110 is exemplified by a chip. A substrate or carrier 175 is taken, an adhesive layer is coated on the carrier 175, a chip is attached on the carrier 175, a plastic packaging process is performed, and the plastic package body 120 is used for protecting the bottom structure. The carrier 175 may be made of glass, silicon oxide or metal, and the adhesive layer may be separated by UV light, and the adhesive layer includes, but is not limited to, epoxy, polyimide or benzocyclobutene.
S2: an inductor 130 is arranged on the plastic package body 120 at intervals of the electronic element 110; the inductor 130 is arranged along the height direction of the plastic package body 120, and the inductor 130 is provided with a positive electrode 131 and a negative electrode 133. Alternatively, if the single inductor 130 structure is provided, this may be achieved by:
a first groove 121 is formed on the plastic package body 120; wherein the first recess 121 and the electronic component 110 are spaced apart. The first groove 121 may be designed with a step 122 to improve the coupling force and heat dissipation performance of the seed layer 123. Covering a protective film on the surface of the plastic package body 120, and not covering the protective film on the area needing to be etched with the grooving, and adopting O by using a plasma dry etching process 2 And SF (sulfur hexafluoride) 6 The mixed plasma gas forms a first groove 121 structure having a step 122 on the molding compound 120. Of course, laser grooving or machining grooving may be used, and is not particularly limited herein. Optionally, the step 122 structure is formed by: the plastic package body 120 may be first provided with a first groove 121; and a reinforcing groove is formed at the bottom of the first groove 121, wherein the size of the reinforcing groove is smaller than that of the first groove 121 so as to form a step 122.
A seed layer 123 is disposed within the first recess 121. Optionally, a seed layer 123 is provided on the stiffening grooves and the steps 122, respectively. A metal seed layer 123 is deposited on the surface of the first recess 121 using a physical vapor deposition Process (PVD). The seed layer 123 may be a multi-layered metal structure such as a metal including copper, titanium, etc.
A heat conductive layer 125 covering the seed layer 123 is disposed within the first recess 121. Optionally, by using a coating method, the high thermal conductive adhesive is filled in the first groove 121 to cover the seed layer 123, and the entire first groove 121 may be filled, so that the surface of the thermal conductive layer 125 is flush with the surface of the plastic package 120.
The heat conduction layer 125 is provided with a connecting hole 129; wherein the connection hole 129 ends at the seed layer 123. The connection hole 129 is formed by etching, laser grooving, machining grooving, or the like. A metal pillar is disposed in the connection hole 129 to form a vertical inductor 130. Metal posts may be formed in the connection holes 129 by plating or filling, etc. The metal column material is copper material, and the growth speed of the bottom metal column is increased by using the bottom metal seed layer 123, thereby increasing the bonding force. And then removing the protective film by a cleaning mode, and then dehumidifying by a baking process.
S3: a wiring layer 150 is disposed on the molding body 120; the wiring layer 150 and the pad 111 are electrically connected; the positive electrode 131 and the negative electrode 133 are electrically connected to the wiring layer 150, respectively. Optionally, the first dielectric layer 161 is formed on the plastic package 120 by using a spin coating process, and the material of the first dielectric layer 161 may be silicon nitride, silicon oxynitride, polyimide, benzocyclobutene, or the like. By using a plasma dry etching process, adopting O 2 And SF (sulfur hexafluoride) 6 The mixed plasma gas forms an opening 1611 in the first dielectric layer 161, and metal is electroplated within the opening 1611 to form a metal block 151, such as a copper block. It will be appreciated that the copper-plated bump above the chip is electrically connected to the bond pad 111 of the chip as a terminal for the subsequent wiring layer 150. The electroplated copper bumps above the inductor 130 form the positive electrode 131 and the negative electrode 133 of the inductor 130, which are respectively connected with the metal posts in the inductor 130.
A second dielectric layer 162 is formed on the first dielectric layer 161 using a spin coating process, and the material of the second dielectric layer 162 is the same as that of the first dielectric layer 161. Then, a photomask (pattern layer) is covered on the second dielectric layer 162, a pattern layer opening 1621 is formed by an exposure and development process, and an electroplated metal layer is formed on the pattern layer opening 1621 by an electroplating process again, namely, the wiring layer 150 is formed, and the wiring layer 150 can be made of copper. A third dielectric layer 163 is formed on the wiring layer 150 by a spin coating process, and the material of the third dielectric layer 163 is the same as that of the first dielectric layer 161. The wiring layer 150 is exposed by forming an opening on the third dielectric layer 163 again by a dry etching process, the metal conductive bump 153 is formed on the hole thereof and the UBM metal layer 155 is formed on the upper surface of the metal conductive bump 153 again by an electroplating process, the UBM metal layer 155 may be made of TI, TI-WU or the like, and the solderability of the solder ball 173 may be improved by the UBM metal layer 155.
Optionally, after step S2, a magnetic core structure 140 may be further disposed in the inductor 130 to further increase the magnetic flux and the current intensity of the inductor 130.
After forming the UBM metal layer 155, the carrier 175 is removed by irradiating ultraviolet light. The back adhesive film 171 is attached to one side of the carrier 175 or the back adhesive layer is spin-coated, so as to protect the bottom structure. The backing layer material may be epoxy resin or ABF (flavoured film). Ball placement is performed on UBM metal layer 155, and ball 173 may be formed by a steel screen printing method or a ball placement method. The solder ball 173 may be any one or more of tin, silver, and copper, or other metal materials. And finally, separating the packaging structure into single products by adopting a cutting process.
As can be understood from fig. 10 and 11, if the dual inductor 130 is provided, the manufacturing method is as follows:
step S1 corresponds to the foregoing. In step S2, the schematic structure of the carrier 175 is omitted, and in an actual process, the following steps may be performed on the carrier 175. A second groove 126 is formed on the plastic package body 120, wherein the second groove 126 and the electronic element 110 are arranged at intervals; the second groove 126 may be designed with a step 122, which is beneficial to improving the bonding force and heat dissipation performance. A first seed layer 1231 is formed in the second recess 126, and a first inductor 135 connected to the first seed layer 1231 is formed in the second recess 126. A magnetic core structure 140 is disposed on a side of the first inductor 135 remote from the first seed layer 1231 to enhance magnetic flux and current strength. A dielectric layer 137 is disposed in the second recess 126 to cover the first inductor 135. The first dielectric layer 137 may be the heat conducting layer 125, or may be the plastic package 120 or other buffer material, which plays a role in buffering and heat conduction.
A third groove 127 is formed in the first dielectric layer 137; forming a second inductor 136 in the third recess 127; a second seed layer 1233 connected to the second inductor 136 is formed in the third groove 127 to enhance the coupling force of the second seed layer 1233 and the second inductor 136. A second dielectric layer 138 is disposed in the third recess 127 to cover the second seed layer 1233, wherein the second dielectric layer 138 is formed of a material identical to that of the first dielectric layer 137. The second dielectric layer 138 may fill the entire third recess 127 such that the surface of the second dielectric layer 138 is flush with the surface of the molding compound 120. A slot is formed in dielectric layer two 138 and a conductive post 128 is formed by plating metal in the slot to electrically connect first seed layer 1231 and second seed layer 1233.
Step S3 corresponds to the foregoing. A first dielectric layer 161, an opening 1611, and a metal block 151 are coated on the plastic package 120, and the metal block 151 is used as a lead-out terminal of the wiring layer 150 and the positive and negative electrodes 133 of the inductor 130. Wherein the conductive posts 128 are connected to the positive electrode 131 and the negative electrode 133, respectively. The subsequent processes of disposing the wiring layer 150, UBM metal layer 155, carrier 175, adhesive film 171, ball mounting, and dicing are the same as above.
Of course, in some embodiments, the sequence of the steps may be flexibly adjusted, where possible, and the magnetic core structure 140 may be omitted according to actual needs, which is not specifically limited herein. The number of the inductors 130 is not limited to two, but may be three or more, and the plurality of inductors 130 may be stacked in a stacked manner, that is, the plurality of inductors 130 may be located on the same axis or may be stacked in a staggered manner. The plurality of inductors 130 may share one positive electrode 131 and one negative electrode 133, or may be provided with the plurality of positive electrodes 131 and the plurality of negative electrodes 133, respectively, which is not particularly limited herein.
In this embodiment, other parts that are not mentioned are similar to those described in the first embodiment, and are not described here again.
In summary, the fan-out package structure 100 and the manufacturing method of the fan-out package structure 100 provided in the embodiments of the present invention have the following beneficial effects, for example:
according to the fan-out type packaging structure 100 provided by the embodiment of the invention, the electronic element 110 and the inductor 130 are arranged at intervals, and the inductor 130 is arranged along the height direction of the plastic package body 120, namely, is designed to be vertical to the inductor 130, so that the arrangement space of the inductor 130 can be increased, and the heat dissipation effect of the packaging structure can be improved. The problems that the traditional inductor 130 is structurally designed on the circuit layer on the surface of the chip, heat of the inductor 130 is directly conducted to the surface of the chip due to the adoption of a tiling design, heat dissipation performance is poor, and the circuit layer of the chip is short-circuited due to current formed by the generated parasitic inductor 130 can be solved. In addition, the magnetic core structure 140 is provided, so that magnetic flux and current intensity can be improved. The fan-out package structure 100 with the inductor 130 can be applied to the fields of vibration motors and wireless communication, and has a wide application range. By providing the recess having the step 122 structure and the seed layer 123, the coupling force and heat dissipation performance can be improved, and the occurrence of structural delamination and the like can be prevented.
In the method for manufacturing the fan-out package structure 100 provided by the embodiment of the invention, the electronic element 110 is firstly molded, then the vertical inductor 130 is arranged on the molded body 120, and finally the wiring layer 150 is arranged. The vertical inductor 130 is electrically connected to the surface wiring layer 150. In the packaging method, the inductor 130 has enough layout space, which is beneficial to improving the heat dissipation performance of the packaging structure. The vertical inductor 130 structure of the single inductor 130 or the multiple inductors 130 can be designed, and the vertical inductor 130 has the advantages of simple process, easy operation, high packaging efficiency, reliable structure, good heat dissipation performance and high product quality.
The foregoing is merely illustrative of the present invention, and the present invention is not limited thereto, and any changes or substitutions easily contemplated by those skilled in the art within the scope of the present invention should be included in the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims (25)

1. A fan-out package structure, comprising:
an electronic component provided with a bonding pad;
the plastic packaging body is used for coating the electronic element, and the bonding pads are exposed out of the plastic packaging body;
the inductor and the electronic element are arranged at intervals and are distributed along the height direction of the plastic package body; the inductor is provided with an anode and a cathode; the inductor comprises a first inductor and a second inductor, the first inductor and the second inductor are respectively connected with the conductive column, and the anode and the cathode are respectively connected with the conductive column; a magnetic core structure is arranged between the first inductor and the second inductor;
the magnetic core structure is connected with the elastic piece, and one end, far away from the magnetic core structure, of the elastic piece is used for being connected with the fixed carrier;
a wiring layer electrically connected to the pad; the positive electrode and the negative electrode are electrically connected to the wiring layer, respectively.
2. The fan-out package structure of claim 1, wherein the plastic package body is provided with a first groove, and the inductor is arranged in the first groove.
3. The fan-out package structure of claim 2, wherein a thermally conductive layer is disposed within the first recess.
4. The fan-out package structure of claim 3, wherein a seed layer is disposed in the first recess, the seed layer is electrically connected to the inductor, and the thermally conductive layer covers the seed layer.
5. The fan-out package structure of claim 2, wherein a seed layer is disposed in the first recess, the seed layer being electrically connected to the inductor.
6. The fan-out package structure of claim 5, wherein a step is provided in the first groove, the step is higher than a bottom of the first groove, and the seed layer covers the step and the bottom of the groove.
7. The fan-out package structure of claim 1, wherein a magnetic core structure is disposed within the inductor.
8. The fan-out package structure of claim 7, wherein the inductor comprises a plurality of metal posts connected in multiple segments, and the magnetic core structure is disposed between a plurality of the metal posts.
9. The fan-out package structure of claim 1, wherein the inductor comprises a plurality of metal posts connected in multiple segments, and a plurality of the metal posts are distributed in an array, ring, arc, or polygon.
10. The fan-out package structure of claim 1, wherein the first inductor and the second inductor are disposed opposite or offset.
11. The fan-out package structure of claim 1, wherein the plastic package body is provided with a second groove and a third groove with opposite notches, the first inductor is arranged in the second groove, and the second inductor is arranged in the third groove.
12. The fan-out package structure of claim 11, wherein seed layers are respectively disposed in the second recess and the third recess, the first inductor is connected to the seed layer in the second recess, and the second inductor is connected to the seed layer in the third recess.
13. The fan-out package structure of claim 12, wherein the seed layer in the second recess and the seed layer in the third recess are connected by the conductive posts.
14. The fan-out package structure of claim 13, further comprising a housing disposed between the first inductor and the second inductor, wherein the magnetic core structure is disposed in the housing, and wherein an end of the elastic member away from the magnetic core structure is fixedly connected with the housing.
15. The fan-out package structure of claim 1, wherein a notch is provided in a side wall of the plastic package body, and the notch is used for assembling and disassembling the magnetic core structure.
16. The fan-out package structure of claim 1, wherein a side of the first inductor adjacent to the second inductor is provided with a first heat conducting layer; and a second heat conduction layer is arranged on one side of the second inductor away from the first inductor.
17. The fan-out package structure of any of claims 1 to 16, further comprising a dielectric layer covering a wiring layer over the electronic component; alternatively, the dielectric layer covers a wiring layer over the electronic component and a wiring layer over the inductor.
18. The fan-out package structure of claim 17, wherein solder balls are disposed on the dielectric layer, and wherein the solder balls are electrically connected to the wiring layer.
19. A method for fabricating a fan-out package structure according to any of claims 1 to 18, wherein the method comprises:
s1: encapsulating the electronic element by using the plastic encapsulation body; the electronic element comprises a bonding pad, wherein the bonding pad is exposed out of the plastic package body;
s2: arranging inductors on the plastic package body at intervals of the electronic elements; the inductor is arranged along the height direction of the plastic package body, and is provided with a positive electrode and a negative electrode;
s3: arranging a wiring layer on the plastic package body; the wiring layer is electrically connected with the bonding pad; the positive electrode and the negative electrode are electrically connected to the wiring layer, respectively.
20. The method for fabricating a fan-out package structure according to claim 19, wherein step S2 includes:
a first groove is formed in the plastic package body; wherein the first groove and the electronic element are arranged at intervals;
setting a seed layer in the first groove;
a heat conduction layer covering the seed layer is arranged in the first groove;
a connecting hole is formed in the heat conducting layer; wherein the connection hole ends in the seed layer;
and arranging metal posts in the connecting holes to form the vertical inductor.
21. The method of manufacturing a fan-out package structure of claim 20, wherein the step of forming the first recess in the plastic package body comprises:
a first groove is formed in the plastic package body;
and a reinforcing groove is formed at the bottom of the first groove so as to form a step.
22. The method of fabricating a fan-out package structure of claim 21, wherein the step of disposing a seed layer in the first recess comprises:
seed layers are respectively arranged on the reinforcing grooves and the steps.
23. The method of fabricating a fan-out package structure of claim 19, wherein after step S2, the method further comprises:
a magnetic core structure is disposed within the inductor.
24. The method for fabricating a fan-out package structure according to claim 19, wherein step S2 includes:
a second groove is formed in the plastic package body; wherein the second groove and the electronic element are arranged at intervals;
forming a first seed layer in the second groove;
forming a first inductor connected with the first seed layer in the second groove;
a first dielectric layer is arranged in the second groove to cover the first inductor;
a third groove is formed in the first dielectric layer;
forming a second inductor in the third groove;
forming a second seed layer connected with the second inductor in the third groove;
a second medium layer is arranged in the third groove to cover the second seed layer;
forming a conductive pillar to electrically connect the first seed layer and the second seed layer;
setting a positive electrode and a negative electrode; wherein, the conductive post is connected with positive pole and negative pole respectively.
25. The method of fabricating a fan-out package structure of claim 24, wherein before the step of disposing a dielectric layer one in the second recess to cover the first inductor, the method further comprises: and a magnetic core structure is arranged on one side of the first inductor, which is far away from the first seed layer.
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