CN118248681A - Package carrier integrated with magnetic element structure and manufacturing method thereof - Google Patents

Abstract

The invention provides a package carrier integrated with a magnetic element structure and a manufacturing method thereof. The package carrier includes a core layer, a magnetic device structure, and a conductive connection device. The core layer has a first surface and a second surface opposite to the first surface. The magnetic element structure comprises a plurality of patterned magnetic conductive metal layers and a plurality of patterned conductive coil layers. The patterned magnetic conductive metal layers are stacked and embedded in the core layer, and are respectively provided with at least one magnetic conductive metal, and part of the magnetic conductive metal forms an array block. The patterned conductive coil layer is embedded in the core layer, and part of the patterned conductive coil layer is positioned at two sides of the array block. The conductive connecting element penetrates through the core layer and conducts the first surface and the second surface of the core layer.

Description

Package carrier integrated with magnetic element structure and manufacturing method thereof

Technical Field

The present invention relates to a package carrier and a method for manufacturing the same, and more particularly, to a package carrier integrated with a magnetic device structure and a method for manufacturing the same.

Background

In recent years, the functions required by electronic products are increasingly diversified, and under the continuous rising performance requirements, semiconductor IC packages, especially FCBGA packages, integrate a plurality of passive components in response to the high-function requirements of electronic products. In the passive device, the inductor occupies more space because of larger size, so that the package cannot be thinned and miniaturized.

Referring to fig. 1, one prior art solution is to directly penetrate and embed an inductor 120 into the core layer 110 of the FCBGA package carrier. Although the thickness of the package can be reduced slightly compared with the case of directly mounting the inductor on the core layer, the size of the inductor cannot be reduced to be completely embedded in the core layer for achieving a preferable inductance value and electrical performance due to the structure of the conventional inductor, so that the effect of thinning and miniaturization is limited.

In addition, electronic devices applied to ICs such as a web server, high-speed operation, AI artificial intelligence, and the like need to integrate more chips with high-performance requirements, so that FCBGA packages are developed toward large package sizes with Gao Die layers (16L or 22L), high density, high I/O count, and high pin count. The problem encountered in large-scale FCBGA packages is the severe warpage that affects the quality reliability and the processing of the system assembly. The prior art solutions to overcome the warpage problem are to increase the thickness of the core layer of the FCBGA package from 0.8mm to 1.6mm, for example, which suppresses warpage but derives other problems including:

(1) The whole packaging body is more difficult to meet the miniaturization and thinning requirements of the semiconductor industry;

(2) The thin distance between the through holes is difficult to reach due to thicker thickness;

(3) The electrical conductivity is deteriorated due to the higher thickness;

(4) The heat dissipation effect is deteriorated due to the thicker thickness;

(5) The processing cost of the via hole becomes higher as the core layer becomes thicker due to the thicker thickness.

Therefore, how to provide a package carrier integrated with a magnetic device structure and a method for manufacturing the same to solve the above-mentioned problems is one of the important issues.

Disclosure of Invention

In view of the foregoing, an object of the present invention is to provide a package carrier that can integrate magnetic devices in a core layer, so as to achieve a slim and miniaturized package carrier and to improve the electrical performance of the magnetic devices through a special structure.

To achieve the above objective, a package carrier integrated with a magnetic device structure of the present invention includes a core layer, a magnetic device structure and a conductive connection device. The core layer has a first surface and a second surface opposite to each other, and the first surface and the second surface are respectively provided with a patterned conductive circuit layer. The magnetic element structure comprises a plurality of patterned magnetic conductive metal layers and a plurality of patterned conductive coil layers. The patterned magnetic conductive metal layers are stacked at intervals and embedded in the core layer, and are respectively provided with at least one magnetic conductive metal, and part of the magnetic conductive metal forms an array block. The patterned conductive coil layer is embedded in the core layer, and part of the patterned conductive coil layer frame surrounds the array block. The conductive connecting element penetrates through the patterned conductive circuit layer arranged on the core layer and connected with the first surface and the second surface of the core layer.

In one embodiment, the package carrier with integrated magnetic element structures further includes a plurality of rigid support layers embedded in the core layer, disposed adjacent to the patterned conductive coil layers. In addition, at least one support piece of the rigid support layer and at least one magnetic conduction metal piece of the patterned magnetic conduction metal layer are a plurality of support pieces or a plurality of magnetic conduction metal pieces in a block shape, a strip shape or a fin shape.

In one embodiment, the patterned magnetically conductive metal layer is made of iron (Fe), nickel (Ni), cobalt (Co), zinc (Zn) or an alloy containing two (including the above), or an alloy doped with manganese (Mn), molybdenum (Mo), boron (B), copper (Cu) or vanadium (V).

In one embodiment, the core layer includes a plurality of stacked insulating layers, and the material of the insulating layers includes an organic photosensitive dielectric material, an organic non-photosensitive dielectric material, and/or an inorganic oxide material.

In one embodiment, the plurality of patterned conductive coil layers are spiral coil-shaped inductor circuits, or toroidal coil-shaped inductor circuits.

In one embodiment, the patterned conductive coil layer is made of copper, copper alloy, nickel or silver.

In one embodiment, the rigid support layer is made of copper (Cu), stainless steel, ceramic, plastic steel, iron (Fe), nickel (Ni), cobalt (Co), zinc (Zn), or an alloy containing two (or more) of them, or an alloy doped with manganese (Mn), molybdenum (Mo), boron (B), copper (Cu), or vanadium (V).

In one embodiment, the package carrier further includes a first circuit build-up structure and a second circuit build-up structure. The first circuit layer-adding structure is arranged on the first surface of the core layer and is provided with a plurality of first insulating layers and a plurality of first conductive circuit layers, wherein the first conductive circuit layers are stacked, and the first insulating layers cover the first conductive circuit layers. The second circuit layer-adding structure is arranged on the second surface of the core layer and is provided with a plurality of second insulating layers and a plurality of second conductive circuit layers, wherein the second conductive circuit layers are stacked, and the second insulating layers cover the second conductive circuit layers.

In one embodiment, another magnetic device structure is embedded in the first circuit build-up structure and/or the second circuit build-up structure.

In addition, in order to achieve the above object, a method for manufacturing a package carrier integrated with a magnetic device structure according to the present invention includes the following steps. Firstly, a patterned magnetic conductive metal layer and a patterned conductive coil layer are respectively formed on an upper surface of an insulating layer by electroplating. Then another insulating layer is formed to cover the patterned magnetic conductive metal layer and the patterned conductive coil layer, and the above steps are repeatedly performed. The insulating layers formed after repeated steps form a core layer, and the patterned magnetically conductive metal layers and the patterned conductive coil layers form a magnetic element structure. And forming a plurality of conductive connecting elements on the core layer to conduct a first surface and a second surface of the core layer. And forming a patterned conductive circuit layer on the first surface and the second surface of the core layer respectively to electrically connect the conductive connection elements.

In one embodiment, the method further includes forming a first circuit build-up structure on the first surface of the core layer and forming a second circuit build-up structure on the second surface of the core layer.

In one embodiment, the first circuit build-up structure and the second circuit build-up structure are formed by a half-additive method.

In one embodiment, the step of forming the conductive connection element further includes forming a via in the core layer, and electroplating a conductive post in the via.

In one embodiment, the method further includes forming a rigid support layer on the upper surface of the insulating layer by electroplating. Wherein, the rigid supporting layer and the patterned magnetic conductive metal layer can be formed together by electroplating or made in a split way.

The beneficial effects of the invention are as follows:

The invention provides a packaging carrier plate integrated with a magnetic element structure and a manufacturing method thereof, wherein the magnetic element structure is integrated and embedded in a core layer of the packaging carrier plate, wherein the magnetic element structure is formed by a patterned magnetic conductive metal layer and a patterned conductive coil layer, and the magnetic conductive metal piece in a block shape, a strip shape or a fin shape in the patterned magnetic conductive metal layer is used as a magnetic core, so that the magnetic carrier plate can achieve lower magnetic loss, lower impedance, lower parasitic capacitance and lower eddy current effect to obtain higher inductance value and better quality factor (quality factor), thereby reducing the energy consumption of the magnetic element and improving the efficiency, and further reducing the size of the packaging structure to be suitable for the design of thinning and microminiaturization.

Drawings

FIG. 1 is a schematic cross-sectional view of a conventional FCBGA package carrier;

FIG. 2 is a schematic cross-sectional view of a package carrier according to a first embodiment of the invention;

FIG. 3 is a schematic diagram showing an embodiment of the patterned magnetically conductive metal layer in which the magnetically conductive metal member is fin-shaped;

FIG. 4 is a schematic cross-sectional view of a package carrier according to a second embodiment of the invention;

FIGS. 5A-5C are schematic diagrams showing a variation of the patterned conductive coil layer from a top view;

FIG. 6 is a schematic cross-sectional view of a package carrier according to a third embodiment of the invention;

FIG. 7 is a schematic cross-sectional view of a package carrier according to a fourth embodiment of the invention;

FIG. 8 is a schematic cross-sectional view of a package structure formed by the package carrier of the present invention;

fig. 9A to 9D are schematic views showing a structure corresponding to a method for manufacturing a package carrier according to a preferred embodiment of the invention.

Reference numerals illustrate:

110: core layer

120: Inductor(s)

20,30,40,50: Package carrier

21: Core layer

21 A-21 f insulating layers

21A1: upper surface of

211: A first surface

212: A second surface

22,28: Magnetic element structure

221A to 221e: patterned magnetically conductive metal layer

222A to 222e: patterned conductive coil layer

A11: first array block

A12: second array block

O1: an opening

23: Conductive connecting element

231: Plated through hole

232: Hole plugging resin

241,242: Patterned conductive circuit layer

25A to 25e: rigid support layer

252A,252b: support member

261: First circuit build-up structure

261A,262a: surface of the body

2611: A first insulating layer

2612: First conductive circuit layer

P11, P12: electrode pad

262: Layer-adding structure of second circuit

2621: Second insulating layer

2622: Second conductive circuit layer

271: First insulating protective layer

272: Second insulating protective layer

400: Packaging structure

410: Wafer with a plurality of wafers

420: Conductive bump

430: Filling element

440: And an electrical connection element.

Detailed Description

In order that those skilled in the art will appreciate and realize the teachings of the present invention, reference will now be made to the preferred embodiments and accompanying drawings.

Fig. 2 is a schematic cross-sectional view of a package carrier 20 according to a first embodiment of the invention. The package carrier 20 includes a core layer 21, a magnetic element structure 22, and a conductive connection element 23. The package carrier 20 of the present embodiment is exemplified by a Flip Chip Ball Grid Array (FCBGA) package carrier, which is a high-density semiconductor package carrier that achieves high speed and multi-functionality of large-scale integrated circuits. The magnetic element structure 22 is exemplified by an inductor, which may be a spiral inductor (Spiral Inductor), a solenoid inductor (Solenoid Inductor), a toroidal inductor (toroidal Inductor), or a combination thereof. In other embodiments, the magnetic element structure 22 may also be a transformer. Embodiments of the present invention are described with reference to spiral inductors.

The core layer 21 includes a plurality of insulating layers 21 a-21 f, which are stacked on each other and have a first surface 211 and a second surface 212 opposite to each other. The insulating layers 21a to 21f may be made of an organic photosensitive dielectric material or an organic non-photosensitive dielectric material, for example, an insulating material including glass fibers and organic resins. Among them, the organic resin includes, for example, but is not limited to, an epoxy resin of a substrate or prepreg (prepreg) of BT, FR4, FR5, or the like, an organic substrate ABF (Ajinomoto Build-up Film), an epoxy molding resin (Epoxy Molding Compound, EMC), a Film-like EMC, or Polyimide (PI). The material of the insulating layers 21a to 21f may also include micro-or nano-sized inorganic oxide materials, such as silicon oxide (SiOx), nickel oxide (NiO), or copper oxide. In certain embodiments, each of the insulating layers 21 a-21 f may be composed of the same or different materials.

The magnetic element structure 22 is embedded in the core layer 21 and includes a plurality of patterned magnetically conductive metal layers 221 a-221 e and a plurality of patterned electrically conductive coil layers 222 a-222 e. The patterned magnetically conductive metal layers 221a to 221e are stacked on each other and embedded in the core layer 21, and the patterned electrically conductive coil layers 222a to 222e are stacked on each other and embedded in the core layer 21. The patterned magnetically conductive metal layers 221a to 221e and the patterned conductive coil layers 222a to 222e are separated by corresponding insulating layers 21a to 21 f.

Each patterned magnetically conductive metal layer 221 a-221 e has at least one magnetically conductive metal piece, and a portion of the magnetically conductive metal pieces form an array block. In this embodiment, the magnetically conductive metal member forms a first array block a11 and a second array block a12. The number and the range of the magnetic conductive metal pieces included in the first array block a11 and the second array block a12 are not limited. The magnetically conductive metal members of the patterned magnetically conductive metal layers 221 a-221 e may be in the shape of blocks (as shown in fig. 2), fins (as shown in fig. 3), or bars (not shown), which are not limited thereto. It should be noted that, as shown in fig. 3, the opening O1 of the fin-shaped magnetically conductive metal member faces upward, and in other embodiments, the opening of the fin-shaped magnetically conductive metal member may also face downward, or a combination of both.

Some of the conductive coils in each patterned conductive coil layer 222 a-222 e are located on both sides of the first array block a11, and some of the conductive coils are located on both sides of the second array block a 12. The conductive coil may be wound in a single layer or multiple layers, or may be wound around the first array block a11 or the second array block a12 to form a toroidal inductor or a solenoid inductor. In other words, the patterned conductive coil layers 222 a-222 e may constitute a spiral coil-like inductive line, or a toroidal coil-like inductive line.

The patterned magnetically conductive metal layers 221a to 221e may be made of, but not limited to, iron (Fe), nickel (Ni), cobalt (Co), zinc (Zn), or an alloy containing at least two of them (including the above), or a material doped with manganese (Mn), molybdenum (Mo), boron (B), copper (Cu), or vanadium (V). The material of the patterned conductive coil layers 222 a-222 e includes, but is not limited to, copper alloy, nickel, or silver (Ag).

The conductive connection element 23 penetrates through the core layer 21 and conducts the first surface 211 and the second surface 212 of the core layer 21. Here, the term "conducting the first surface 211 and the second surface 212" means conducting the wires or circuits on the first surface 211 and the second surface 212, which can be widely interpreted as conducting the wires or circuits between different layers. In the present embodiment, the conductive connection element 23 conducts the patterned conductive trace layer 241 disposed on the first surface 211 and the patterned conductive trace layer 242 disposed on the second surface 212. The conductive connection element 23 may be formed by mechanically drilling or laser drilling the core layer 21 to form the plated through hole 231 and then filling the hole filling resin 232, or by electroplating the conductive post after the core layer 21 is formed with the through hole, which is not limited thereto.

Fig. 4 is a schematic cross-sectional view of a package carrier 30 according to a second embodiment of the invention. Unlike the first embodiment, the package carrier 30 further includes a plurality of rigid support layers 25a to 25e. Rigid support layers 25 a-25 e are embedded in core layer 21 and are adjacent to patterned conductive coil layers 222 a-222 e. Each rigid support layer 25 a-25 e further includes at least one support member, which may be block-shaped, bar-shaped, or fin-shaped, as desired. The strip-shaped support is, for example, the support 252a, and the fin-shaped support is, for example, the support 252b. In other words, the support of the rigid support layers 25 a-25 e may be disposed between the conductive connecting element 23 and the patterned conductive coil layers 222 a-222 e.

The material of the rigid support layers 25 a-25 e includes, but is not limited to, copper, stainless steel, ceramic, plastic steel, iron, nickel, cobalt, zinc, or alloys containing at least two of them (including the above), or alloys doped with manganese, molybdenum, boron, copper, or vanadium. By the rigid support layers 25a to 25e, the package carrier 30 can be provided with sufficient rigidity to avoid the occurrence of warpage, and particularly, the effect thereof can be exhibited in the case where the package carrier 30 is of a large size or a large layout (PANEL LEVEL).

The magnetically conductive metal members of the patterned magnetically conductive metal layers 221a to 221e and the supporting members of the rigid supporting layers 25a to 25e may be designed into blocks, strips, sheets, or fins and combinations thereof according to the requirements (such as supporting, electrical characteristics or size requirements), but are not limited thereto.

The patterns formed by the patterned conductive coil layers 222 a-222 e may also have various variations, for example, the patterned conductive coil layer may have a rectangular shape as shown in fig. 5A, a circular shape as shown in fig. 5B, a polygonal shape as shown in fig. 5C, or an elliptical shape (not shown) when viewed from the top of the first surface 211 of the core layer 21, which is not limited thereto.

Fig. 6 is a schematic cross-sectional view of a package carrier 40 according to a third embodiment of the invention. Unlike the second embodiment, the package carrier 40 further includes a first circuit build-up structure 261 and a second circuit build-up structure 262. The first wiring build-up structure 261 is located on the first surface 211 of the core layer 21, and the second wiring build-up structure 262 is located on the second surface 212 of the core layer 21.

The first wiring build-up structure 261 includes a plurality of first insulating layers 2611 and a plurality of first conductive wiring layers 2612. The first conductive trace layers 2612 are stacked and electrically connected to the conductive connecting member 23 and the magnetic device structure 22. The first insulating layers 2611 encapsulate the first conductive trace layers 2612, and a portion of the first conductive trace layers 2612 are exposed on a surface 261a of the outermost side of the first insulating layers 2611 to form electrode pads P11. A first insulating protective layer 271 is further disposed on the surface 261 a.

The second circuit build-up structure 262 includes a plurality of second insulating layers 2621 and a plurality of second conductive circuit layers 2622. The second conductive trace layers 2622 are stacked and electrically connected to the conductive connection element 23 and the magnetic element structure 22. The second insulating layers 2621 encapsulate the second conductive trace layers 2622, and a portion of the second conductive trace layers 2622 is exposed on an outermost surface 262a of the second insulating layers 2621 to form an electrode pad P12. A second insulating passivation layer 272 is further disposed on the surface 262 a.

Fig. 7 is a schematic cross-sectional view of a package carrier 50 according to a fourth embodiment of the invention. Unlike the third embodiment, the second circuit build-up structure 262 of the package carrier 50 may further have another magnetic element structure 28 embedded therein. The magnetic element structure 28 and the magnetic element structure 22 may have similar structures and variations, and will not be described herein. In other embodiments, the magnetic device structure 28 may be embedded in the first circuit build-up layer 261 or both, which is not limited thereto.

Fig. 8 shows a package structure 400 formed by the package carrier 40 according to the third embodiment. A die 410 is electrically connected to the electrode pad P11 through a plurality of conductive bumps 420. In other embodiments, the conductive bump 420 may be conductive adhesive or other components with connection and conductive functions. A filler element 430, such as an insulating glue or Epoxy (Epoxy), may also be provided under the die 410, i.e. between the die 410 and the package carrier 40, to increase the mechanical strength of the connection point. In addition, the package structure 400 further includes a plurality of electrical connection elements 440 disposed and electrically connected to the electrode pads P12 of the package carrier 40. The electrical connection element 440 is, for example but not limited to, a solder ball, a conductive bump, or a conductive pin (pin).

Next, the method for manufacturing the package carrier of the present invention, which includes steps S11 to S18, will be described with reference to the accompanying drawings by taking the package carrier 50 as an example.

As shown in fig. 9A, in step S11, a patterned magnetically conductive metal layer 221a and a rigid supporting layer 25a are formed on an upper surface 21a1 of an insulating layer 21a by electroplating. Step S12 forms a patterned conductive coil layer 222a on the upper surface 21a1 of the insulating layer 21a by electroplating. In step S13, an insulating layer 21b is formed to encapsulate the patterned magnetically conductive metal layer 221a and the patterned conductive coil layer 222a.

The patterned magnetically conductive metal layer 221a, the rigid supporting layer 25a and the patterned conductive coil layer 222a have different material compositions, and specific materials can be formed by electroplating through controlling and adjusting electroplating conditions according to the different materials. The materials are described in the foregoing embodiments, respectively, and will not be described in detail herein.

The organic material layer of the insulating layer may be formed by vacuum lamination, hot-press coating printing, or the like, and the inorganic oxide may be formed by sputtering (sputtering), chemical vapor deposition (chemical vapor deposition, CVD), physical vapor deposition (Physical vapor deposition, PVD), plating, or the like.

The patterned magnetically conductive metal layer 221a and the rigid support layer 25a are made of the same material, and thus can be formed simultaneously in the same step, or can be formed separately in different steps when different materials are required for the design.

The steps S11 to S13 are repeated to complete the patterned magnetically conductive metal layers 221B to 221e, the rigid support layers 25a to 25e, the patterned conductive coil layers 222B to 222e, and the insulating layers 21c to 21f as shown in fig. 9B, wherein the insulating layers 21a to 21f form the core layer 21, and the patterned magnetically conductive metal layers 221a to 221e and the patterned conductive coil layers 222a to 222e form the magnetic element structure 22.

It should be noted that the steps S11 to S13 are illustrated as a single-sided process, and may be a double-sided process in other embodiments, i.e., the patterned magnetically conductive metal layer and the patterned conductive coil layer can be formed on the lower surface of the insulating layer.

As shown in fig. 9C, in step S14, a plated through hole 231 is formed in the core layer 21. Step S15 fills the plated through holes 231 with a plug resin 232 to form the conductive connecting elements 23. The plated through hole 231 may be formed by mechanically drilling or laser drilling a through hole in the core layer 21, and then plating a metal on the through hole wall. It should be noted that, in other embodiments, the conductive connection element 23 may be formed by forming a through hole in the core layer 21 and then electroplating a conductive post in the through hole.

Next, in step S16, a patterned conductive circuit layer 241 is formed on the first surface 211 of the core layer 21, and a patterned conductive circuit layer 242 is formed on the second surface 212 of the core layer 21. The patterned conductive line layer 241 and the patterned conductive line layer 242 may be formed separately or simultaneously, which is not limited herein.

Next, as shown in fig. 9D, step S17 forms a first circuit build-up structure 261 on the first surface 211 of the core layer 21, and step S18 forms a second circuit build-up structure 262 on the second surface 212 of the core layer 21. In this embodiment, the first and second circuit build-up structures 261 and 262 may be manufactured by a Semi-additive Process (SAP). It should be noted that the process sequence of the first circuit build-up structure 261 and the second circuit build-up structure 262 may be completed after the first circuit build-up structure 261 is completed, or the two structures may be simultaneously processed through a double-sided process, which is not limited herein.

In summary, the package carrier integrated with the magnetic element structure and the manufacturing method thereof provided by the invention integrate the magnetic element structure into the core layer of the package carrier, wherein the magnetic element structure is formed by the patterned magnetic conductive metal layer and the patterned conductive coil layer, and the magnetic conductive metal piece in the shape of a block, a strip or a fin is used as the magnetic core in the patterned magnetic conductive metal layer, so that the package carrier integrated with the magnetic element structure has low magnetic loss, low impedance, low parasitic capacitance and low eddy current effect, thereby obtaining high inductance value and good quality factor (quality factor), further reducing the energy consumption of the magnetic element and improving the performance, achieving good electrical characteristics, and further reducing the size of the package structure, thereby being suitable for the design of thinning and microminiaturization.

The foregoing description of the preferred embodiment of the invention is merely exemplary of the invention and is not intended to limit the scope of the invention. Equivalent modifications and variations of the invention, which are intended to be within the spirit of the present invention, will be apparent to those skilled in the art to which the invention pertains, and are intended to be encompassed by the following claims.

Claims (18)

1. A package carrier integrated with a magnetic element structure, comprising:

the core layer is provided with a first surface and a second surface which are opposite to each other, and the first surface and the second surface are respectively provided with a patterned conductive circuit layer;

a magnetic element structure comprising:

The patterned magnetic conductive metal layers are stacked at intervals and embedded in the core layer, and are respectively provided with at least one magnetic conductive metal, and part of the magnetic conductive metal forms an array block;

a plurality of patterned conductive coil layers embedded in the core layer, wherein a part of patterned conductive coil layer frames surround the array block; and

The conductive connecting element penetrates through the core layer and conducts the patterned conductive circuit layer on the first surface and the second surface of the core layer.

2. The package carrier integrated with the magnetic device structure of claim 1, wherein each patterned magnetically conductive metal layer has a plurality of magnetically conductive metal pieces in a block, stripe or fin shape.

3. The package carrier integrated with a magnetic device structure of claim 1, wherein the patterned magnetically conductive metal layer is made of iron, nickel, cobalt, zinc, or an alloy containing two or more of them, or an alloy doped with manganese, molybdenum, boron, copper, or vanadium.

4. The package carrier integrated with the magnetic device structure of claim 1, wherein the core layer comprises a plurality of stacked insulating layers, and the material of the core layer comprises an organic photosensitive dielectric material, an organic non-photosensitive dielectric material and/or an inorganic oxide material.

5. The package carrier integrated with the magnetic device structure of claim 1, wherein the patterned conductive coil layers are spiral coil-shaped inductor circuits, or toroidal coil-shaped inductor circuits.

6. The package carrier integrated with the magnetic device structure of claim 1, wherein the patterned conductive coil layers are made of copper, copper alloy, nickel or silver.

7. The package carrier integrated with a magnetic element structure of claim 1, further comprising:

A plurality of rigid support layers embedded in the core layer and adjacent to the patterned conductive coil layers.

8. The package carrier integrated with the magnetic element structure of claim 7, wherein each rigid support layer has a plurality of supports in the form of blocks, strips, fins, or a combination thereof.

9. The package carrier integrated with the magnetic device structure of claim 7, wherein each of the rigid support layers is made of copper, stainless steel, ceramic, plastic steel, iron, nickel, cobalt, zinc, or an alloy containing two or more of them, or an alloy doped with manganese, molybdenum, boron, copper, or vanadium.

10. The package carrier integrated with a magnetic element structure of claim 1 or 7, further comprising:

The first circuit layer-adding structure is arranged on the first surface of the core layer and is provided with a plurality of first insulating layers and a plurality of first conductive circuit layers, wherein the first conductive circuit layers are stacked, and the first insulating layers cover the first conductive circuit layers; and

The second circuit layer-adding structure is arranged on the second surface of the core layer and is provided with a plurality of second insulating layers and a plurality of second conductive circuit layers, wherein the second conductive circuit layers are stacked, and the second insulating layers cover the second conductive circuit layers.

11. The package carrier integrated with a magnetic device structure of claim 10, wherein another magnetic device structure is embedded in the first circuit build-up structure and/or the second circuit build-up structure.

12. A method of manufacturing a package carrier having a magnetic element structure integrated therein, comprising:

Electroplating an upper surface of an insulating layer to form a patterned magnetic conductive metal layer and a patterned conductive coil layer respectively, wherein the patterned conductive coil layer is adjacently arranged on the patterned magnetic conductive metal layer;

Forming another insulating layer to cover the patterned magnetic conductive metal layer and the patterned conductive coil layer, and repeating the above steps, wherein the insulating layers form a core layer, and the patterned magnetic conductive metal layer and the patterned conductive coil layer form a magnetic element structure;

Forming a plurality of conductive connection elements on the core layer to conduct a first surface and a second surface of the core layer; and

A patterned conductive circuit layer is formed on the first surface and the second surface of the core layer respectively for electrically connecting the conductive connection element.

13. The method of manufacturing a package carrier with integrated magnetic element structure of claim 12, further comprising:

Forming a first circuit build-up structure on the first surface of the core layer; and

A second circuit build-up structure is formed on the second surface of the core layer.

14. The method of claim 13, wherein the first circuit build-up structure and the second circuit build-up structure are formed by a half-additive process.

15. The method of manufacturing a package carrier integrated with a magnetic device structure of claim 12, wherein the step of forming the conductive connection element comprises:

Forming a plated through hole in the core layer; and

Filling a hole plugging resin in the electroplated through hole.

16. The method of manufacturing a package carrier integrated with a magnetic device structure of claim 12, wherein the step of forming the conductive connection element comprises:

Forming a through hole in the core layer; and

And electroplating to form a conductive column in the through hole.

17. The method of claim 12, further comprising electroplating the top surface of the insulating layer to form a rigid support layer.

18. The method of claim 17, wherein the rigid support layer and the patterned magnetically permeable metal layer are formed simultaneously or in separate steps.