JP2013534547A5 - - Google Patents

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Publication number
JP2013534547A5
JP2013534547A5 JP2013513788A JP2013513788A JP2013534547A5 JP 2013534547 A5 JP2013534547 A5 JP 2013534547A5 JP 2013513788 A JP2013513788 A JP 2013513788A JP 2013513788 A JP2013513788 A JP 2013513788A JP 2013534547 A5 JP2013534547 A5 JP 2013534547A5
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JP
Japan
Prior art keywords
silicon substrate
emitter
phosphorus
silicon
substrate
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2013513788A
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English (en)
Japanese (ja)
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JP2013534547A (ja
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Publication date
Application filed filed Critical
Priority claimed from PCT/IB2011/052418 external-priority patent/WO2011154875A1/en
Publication of JP2013534547A publication Critical patent/JP2013534547A/ja
Publication of JP2013534547A5 publication Critical patent/JP2013534547A5/ja
Pending legal-status Critical Current

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JP2013513788A 2010-06-09 2011-06-01 水性アルカリ性エッチング及び洗浄組成物、及びシリコン基材の表面を処理するための方法 Pending JP2013534547A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US35283110P 2010-06-09 2010-06-09
US61/352,831 2010-06-09
PCT/IB2011/052418 WO2011154875A1 (en) 2010-06-09 2011-06-01 Aqueous alkaline etching and cleaning composition and method for treating the surface of silicon substrates

Publications (2)

Publication Number Publication Date
JP2013534547A JP2013534547A (ja) 2013-09-05
JP2013534547A5 true JP2013534547A5 (https=) 2014-07-10

Family

ID=45097599

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013513788A Pending JP2013534547A (ja) 2010-06-09 2011-06-01 水性アルカリ性エッチング及び洗浄組成物、及びシリコン基材の表面を処理するための方法

Country Status (11)

Country Link
US (1) US9076920B2 (https=)
EP (1) EP2580303B1 (https=)
JP (1) JP2013534547A (https=)
KR (1) KR101894603B1 (https=)
CN (1) CN103038311B (https=)
ES (1) ES2699223T3 (https=)
MY (1) MY160091A (https=)
PH (1) PH12012502385A1 (https=)
SG (1) SG186108A1 (https=)
TW (1) TWI498421B (https=)
WO (1) WO2011154875A1 (https=)

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WO2013021296A1 (en) * 2011-08-09 2013-02-14 Basf Se Aqueous alkaline compositions and method for treating the surface of silicon substrates
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WO2014024414A1 (ja) * 2012-08-10 2014-02-13 第一工業製薬株式会社 テクスチャー形成用エッチング液およびそれを用いたテクスチャー形成方法
KR102118964B1 (ko) * 2012-12-05 2020-06-08 엔테그리스, 아이엔씨. Iii-v 반도체 물질을 세척하기 위한 조성물 및 이를 사용하는 방법
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US20160200571A1 (en) * 2013-09-05 2016-07-14 Kit Co, Ltd. Hydrogen production apparatus, hydrogen production method, silicon fine particles for hydrogen production, and production method for silicon fine particles for hydrogen production
JP2015189829A (ja) * 2014-03-27 2015-11-02 株式会社フジミインコーポレーテッド 研磨用組成物
JP6373029B2 (ja) * 2014-03-27 2018-08-15 株式会社フジミインコーポレーテッド 研磨用組成物
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JP6417612B2 (ja) * 2014-12-01 2018-11-07 メック株式会社 エッチング剤およびその補給液、マグネシウム部品の表面粗化方法、ならびにマグネシウム−樹脂複合体の製造方法
KR101765212B1 (ko) 2015-07-17 2017-08-04 주식회사 위즈켐 천연계 태양광 웨이퍼 세정제 조성물
KR102457249B1 (ko) * 2015-09-18 2022-10-21 주식회사 이엔에프테크놀로지 식각 조성물
CN105118898A (zh) * 2015-09-23 2015-12-02 中利腾晖光伏科技有限公司 一种硅片表面钝化方法及基于其的n型双面电池的制作方法
TWI675905B (zh) * 2015-11-14 2019-11-01 日商東京威力科創股份有限公司 使用稀釋的氫氧化四甲基銨處理微電子基板的方法
CN107164109A (zh) * 2017-03-31 2017-09-15 吴江创源新材料科技有限公司 一种蓝宝石晶片退火前清洗液及其制备方法和清洗工艺
KR102756186B1 (ko) 2020-02-05 2025-01-17 삼성전자주식회사 반도체 패키지 및 패키지-온-패키지의 제조 방법
CN112689886B (zh) * 2020-06-16 2022-11-18 福建晶安光电有限公司 一种衬底加工方法及半导体器件制造方法
CN119286525B (zh) * 2024-12-10 2025-06-24 嘉兴市小辰光伏科技有限公司 一种用于解决TOPCon电池LPCVD双插正面绕扩印的添加剂及清洗工艺

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MY158452A (en) 2009-09-21 2016-10-14 Basf Se Aqueous acidic etching solution and method for texturing the surface of single crystal and polycrystal silicon substrates

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