JP2013512556A5 - - Google Patents
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- Publication number
- JP2013512556A5 JP2013512556A5 JP2012540348A JP2012540348A JP2013512556A5 JP 2013512556 A5 JP2013512556 A5 JP 2013512556A5 JP 2012540348 A JP2012540348 A JP 2012540348A JP 2012540348 A JP2012540348 A JP 2012540348A JP 2013512556 A5 JP2013512556 A5 JP 2013512556A5
- Authority
- JP
- Japan
- Prior art keywords
- plastic material
- coating
- housing
- housing body
- housing according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims 27
- 239000011248 coating agent Substances 0.000 claims 23
- 238000000576 coating method Methods 0.000 claims 23
- 239000004033 plastic Substances 0.000 claims 22
- 229920003023 plastic Polymers 0.000 claims 22
- 230000005693 optoelectronics Effects 0.000 claims 6
- 238000002845 discoloration Methods 0.000 claims 3
- 230000005670 electromagnetic radiation Effects 0.000 claims 3
- 230000003287 optical effect Effects 0.000 claims 3
- 239000012463 white pigment Substances 0.000 claims 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims 2
- 239000004696 Poly ether ether ketone Substances 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 2
- 239000004954 Polyphthalamide Substances 0.000 claims 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 230000006378 damage Effects 0.000 claims 2
- 229920002647 polyamide Polymers 0.000 claims 2
- 229920002530 polyetherether ketone Polymers 0.000 claims 2
- 229920006375 polyphtalamide Polymers 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- 229910052582 BN Inorganic materials 0.000 claims 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 1
- 229920000491 Polyphenylsulfone Polymers 0.000 claims 1
- 239000005083 Zinc sulfide Substances 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 229920002313 fluoropolymer Polymers 0.000 claims 1
- 239000004811 fluoropolymer Substances 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 238000001746 injection moulding Methods 0.000 claims 1
- -1 lithopone Chemical compound 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 229920001643 poly(ether ketone) Polymers 0.000 claims 1
- 229920000728 polyester Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 1
- 229920001296 polysiloxane Polymers 0.000 claims 1
- 238000002310 reflectometry Methods 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 229910052984 zinc sulfide Inorganic materials 0.000 claims 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009055786.5 | 2009-11-25 | ||
| DE102009055786A DE102009055786A1 (de) | 2009-11-25 | 2009-11-25 | Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses |
| PCT/EP2010/066650 WO2011064072A1 (de) | 2009-11-25 | 2010-11-02 | Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013512556A JP2013512556A (ja) | 2013-04-11 |
| JP2013512556A5 true JP2013512556A5 (enExample) | 2013-12-05 |
Family
ID=43383620
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012540348A Pending JP2013512556A (ja) | 2009-11-25 | 2010-11-02 | オプトエレクトロニクス部品のハウジングおよびハウジング製造方法 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US9006773B2 (enExample) |
| EP (1) | EP2504861A1 (enExample) |
| JP (1) | JP2013512556A (enExample) |
| KR (1) | KR20120117792A (enExample) |
| CN (1) | CN102630346A (enExample) |
| DE (1) | DE102009055786A1 (enExample) |
| TW (1) | TWI440227B (enExample) |
| WO (1) | WO2011064072A1 (enExample) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102010013317B4 (de) * | 2010-03-30 | 2021-07-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils |
| CN203260631U (zh) * | 2010-07-01 | 2013-10-30 | 西铁城控股株式会社 | Led光源装置 |
| JP2014011029A (ja) * | 2012-06-29 | 2014-01-20 | Toshiba Lighting & Technology Corp | 照明装置 |
| WO2013025832A1 (en) * | 2011-08-16 | 2013-02-21 | E. I. Du Pont De Nemours And Company | Reflector for light-emitting diode and housing |
| JP2013222499A (ja) * | 2012-04-12 | 2013-10-28 | Sharp Corp | 光源基板ユニット |
| CN102779926B (zh) * | 2012-08-02 | 2015-01-28 | 慧明光电(深圳)有限公司 | 高对比度的防水表贴led灯 |
| DE102014102258B4 (de) | 2014-02-21 | 2021-08-05 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement |
| DE102014106882A1 (de) * | 2014-05-15 | 2015-11-19 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| KR102360957B1 (ko) * | 2015-03-27 | 2022-02-11 | 삼성디스플레이 주식회사 | 발광 다이오드 패키지 |
| EP3306683A4 (en) * | 2015-06-01 | 2018-12-19 | Mitsubishi Electric Corporation | Light emitting device, display unit, and image display device |
| JP6728764B2 (ja) * | 2016-02-26 | 2020-07-22 | 日亜化学工業株式会社 | 発光装置及びそれを用いた照明装置 |
| JP7117170B2 (ja) * | 2018-06-20 | 2022-08-12 | スタンレー電気株式会社 | 発光装置 |
| JP7212241B2 (ja) | 2018-06-21 | 2023-01-25 | 日亜化学工業株式会社 | 発光装置 |
| JP7190889B2 (ja) * | 2018-12-07 | 2022-12-16 | スタンレー電気株式会社 | 発光装置及び発光装置モジュール |
| TWI740149B (zh) * | 2019-05-24 | 2021-09-21 | 華碩電腦股份有限公司 | 殼體的製造方法 |
| CN113410374B (zh) * | 2021-06-17 | 2022-10-04 | 中国科学院半导体研究所 | 一种混色led器件 |
Family Cites Families (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE9319190U1 (de) | 1993-12-14 | 1994-02-10 | Ems-Inventa AG, Zürich | Formteil mit resistenter Oberfläche |
| JP2000037726A (ja) | 1998-07-21 | 2000-02-08 | Toray Ind Inc | 熱可塑性樹脂製品類のリサイクル方法 |
| DE10020465A1 (de) * | 2000-04-26 | 2001-11-08 | Osram Opto Semiconductors Gmbh | Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement |
| JP2002374007A (ja) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 発光装置 |
| DE10153259A1 (de) * | 2001-10-31 | 2003-05-22 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement |
| US20030133300A1 (en) * | 2002-01-11 | 2003-07-17 | Bily Wang | Light absorbing wall for LED package |
| DE10229067B4 (de) | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| JP2004071950A (ja) | 2002-08-08 | 2004-03-04 | Matsushita Electric Ind Co Ltd | 半導体パッケージおよびその製造方法 |
| US7718451B2 (en) * | 2003-02-28 | 2010-05-18 | Osram Opto Semiconductor Gmbh | Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body |
| DE102004031391B4 (de) | 2004-06-29 | 2009-06-04 | Osram Opto Semiconductors Gmbh | Elektronisches Bauteil mit Gehäuse zum ESD-Schutz |
| JP4747726B2 (ja) * | 2004-09-09 | 2011-08-17 | 豊田合成株式会社 | 発光装置 |
| DE102005036520A1 (de) | 2005-04-26 | 2006-11-09 | Osram Opto Semiconductors Gmbh | Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung |
| JP2007042668A (ja) * | 2005-07-29 | 2007-02-15 | Toyoda Gosei Co Ltd | Ｌｅｄ発光装置 |
| US8044412B2 (en) | 2006-01-20 | 2011-10-25 | Taiwan Semiconductor Manufacturing Company, Ltd | Package for a light emitting element |
| JP2007262259A (ja) | 2006-03-29 | 2007-10-11 | Toray Ind Inc | リサイクルポリアミド樹脂組成物 |
| JP2007281260A (ja) * | 2006-04-07 | 2007-10-25 | Sumitomo Metal Electronics Devices Inc | リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ |
| JP2008060344A (ja) * | 2006-08-31 | 2008-03-13 | Toshiba Corp | 半導体発光装置 |
| JP4846498B2 (ja) * | 2006-09-22 | 2011-12-28 | 株式会社東芝 | 光半導体装置及び光半導体装置の製造方法 |
| DE102006046678A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement |
| EP2089914A2 (en) | 2006-11-09 | 2009-08-19 | Quantum Leap Packaging, Inc. | Led reflective package |
| DE102007017855A1 (de) | 2007-04-16 | 2008-10-23 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement |
| US7956469B2 (en) * | 2007-07-27 | 2011-06-07 | Nichia Corporation | Light emitting device and method of manufacturing the same |
| WO2009075530A2 (en) * | 2007-12-13 | 2009-06-18 | Amoleds Co., Ltd. | Semiconductor and manufacturing method thereof |
| DE102008038748B4 (de) | 2008-08-12 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares, optoelektronisches Halbleiterbauteil |
-
2009
- 2009-11-25 DE DE102009055786A patent/DE102009055786A1/de not_active Withdrawn
-
2010
- 2010-11-02 JP JP2012540348A patent/JP2013512556A/ja active Pending
- 2010-11-02 KR KR1020127016558A patent/KR20120117792A/ko not_active Withdrawn
- 2010-11-02 US US13/511,414 patent/US9006773B2/en not_active Expired - Fee Related
- 2010-11-02 WO PCT/EP2010/066650 patent/WO2011064072A1/de not_active Ceased
- 2010-11-02 CN CN201080053529XA patent/CN102630346A/zh active Pending
- 2010-11-02 EP EP10773316A patent/EP2504861A1/de not_active Withdrawn
- 2010-11-22 TW TW099140164A patent/TWI440227B/zh not_active IP Right Cessation
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