JP2013514641A5 - - Google Patents
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- JP2013514641A5 JP2013514641A5 JP2012543566A JP2012543566A JP2013514641A5 JP 2013514641 A5 JP2013514641 A5 JP 2013514641A5 JP 2012543566 A JP2012543566 A JP 2012543566A JP 2012543566 A JP2012543566 A JP 2012543566A JP 2013514641 A5 JP2013514641 A5 JP 2013514641A5
- Authority
- JP
- Japan
- Prior art keywords
- reflector
- housing
- plastic material
- inner region
- partially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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- 239000000463 material Substances 0.000 claims 34
- 239000004033 plastic Substances 0.000 claims 18
- 229920003023 plastic Polymers 0.000 claims 18
- 230000005693 optoelectronics Effects 0.000 claims 6
- 230000005670 electromagnetic radiation Effects 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 230000005855 radiation Effects 0.000 claims 3
- 239000004065 semiconductor Substances 0.000 claims 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 claims 2
- 239000004811 fluoropolymer Substances 0.000 claims 2
- 229920002313 fluoropolymer Polymers 0.000 claims 2
- 238000001746 injection moulding Methods 0.000 claims 2
- 239000012463 white pigment Substances 0.000 claims 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000004734 Polyphenylene sulfide Substances 0.000 claims 1
- 229920000491 Polyphenylsulfone Polymers 0.000 claims 1
- 239000005083 Zinc sulfide Substances 0.000 claims 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims 1
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- -1 lithopone Chemical compound 0.000 claims 1
- 238000003754 machining Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 229920000069 polyphenylene sulfide Polymers 0.000 claims 1
- 238000002310 reflectometry Methods 0.000 claims 1
- 239000004408 titanium dioxide Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 claims 1
- 229910052984 zinc sulfide Inorganic materials 0.000 claims 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102009058421A DE102009058421A1 (de) | 2009-12-16 | 2009-12-16 | Verfahren zur Herstellung eines Gehäuses für ein optoelektronisches Halbleiterbauteil, Gehäuse und optoelektronisches Halbleiterbauteil |
| DE102009058421.8 | 2009-12-16 | ||
| PCT/EP2010/067705 WO2011082876A1 (de) | 2009-12-16 | 2010-11-17 | Verfahren zur herstellung eines gehäuses für ein optoelektronisches halbleiterbauteil, gehäuse und optoelektronisches halbleiterbauteil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2013514641A JP2013514641A (ja) | 2013-04-25 |
| JP2013514641A5 true JP2013514641A5 (enExample) | 2013-12-12 |
Family
ID=43608617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2012543566A Withdrawn JP2013514641A (ja) | 2009-12-16 | 2010-11-17 | オプトエレクトロニクス半導体部品のハウジングの製造方法、ハウジング、およびオプトエレクトロニクス半導体部品 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US9331255B2 (enExample) |
| EP (1) | EP2513985A1 (enExample) |
| JP (1) | JP2013514641A (enExample) |
| KR (1) | KR20120106808A (enExample) |
| CN (1) | CN102668144A (enExample) |
| DE (1) | DE102009058421A1 (enExample) |
| WO (1) | WO2011082876A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| USRE47444E1 (en) | 2011-11-17 | 2019-06-18 | Lumens Co., Ltd. | Light emitting device package and backlight unit comprising the same |
| EP2783400B1 (en) * | 2011-11-24 | 2020-01-08 | Cree Huizhou Solid State Lighting Company Limited | Water resistant led devices and led display including the same |
| TW201432949A (zh) * | 2013-02-05 | 2014-08-16 | 隆達電子股份有限公司 | 發光模組及其製造方法 |
| KR20140141227A (ko) * | 2013-05-31 | 2014-12-10 | 제일모직주식회사 | 반사율 및 내변색성이 우수한 폴리아미드계 수지 조성물 |
| US9293670B2 (en) * | 2014-04-07 | 2016-03-22 | Crystal Is, Inc. | Ultraviolet light-emitting devices and methods |
| DE102014105839A1 (de) * | 2014-04-25 | 2015-10-29 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| JP6671117B2 (ja) * | 2014-07-08 | 2020-03-25 | エルジー イノテック カンパニー リミテッド | 発光素子パッケージ |
| KR102252156B1 (ko) * | 2014-07-08 | 2021-05-17 | 엘지이노텍 주식회사 | 발광 소자 패키지 |
| EP3306683A4 (en) | 2015-06-01 | 2018-12-19 | Mitsubishi Electric Corporation | Light emitting device, display unit, and image display device |
| KR102509312B1 (ko) * | 2016-02-24 | 2023-03-17 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
| CN108633317B (zh) * | 2016-02-12 | 2021-07-09 | Lg 伊诺特有限公司 | 发光器件封装和包括该发光器件封装的照明设备 |
| KR102562091B1 (ko) * | 2016-02-12 | 2023-08-02 | 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 | 발광 소자 패키지 |
| DE102016103059A1 (de) * | 2016-02-22 | 2017-08-24 | Osram Opto Semiconductors Gmbh | Halbleiterbauelement und Verfahren zur Herstellung eines Halbleiterbauelements |
| DE102016105243A1 (de) | 2016-03-21 | 2017-09-21 | Infineon Technologies Ag | Räumlich Selektives Aufrauen von Verkapselungsmasse, um eine Haftung mit einer Funktionsstruktur zu Fördern |
| JP7450466B2 (ja) * | 2020-06-22 | 2024-03-15 | スタンレー電気株式会社 | 発光装置及び発光装置の製造方法 |
| CN112816071B (zh) * | 2021-01-06 | 2021-12-28 | 国家卫星气象中心(国家空间天气监测预警中心) | 一种基于云顶高度算法的红外通道辐射稳定性监测方法 |
| WO2024235649A1 (en) * | 2023-05-17 | 2024-11-21 | Ams-Osram International Gmbh | Optoelectronic semiconductor device and method for producing an optoelectronic semiconductor device |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19829197C2 (de) | 1998-06-30 | 2002-06-20 | Siemens Ag | Strahlungsaussendendes und/oder -empfangendes Bauelement |
| DE19945133C2 (de) | 1999-09-21 | 2002-06-27 | Osram Opto Semiconductors Gmbh | Oberflächenmontierbares Gehäuse für Detektorbauelemente mit Seitenlichtempfindlichkeit |
| US6578989B2 (en) * | 2000-09-29 | 2003-06-17 | Omron Corporation | Optical device for an optical element and apparatus employing the device |
| JP2002374007A (ja) * | 2001-06-15 | 2002-12-26 | Toyoda Gosei Co Ltd | 発光装置 |
| JP4211359B2 (ja) * | 2002-03-06 | 2009-01-21 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| JP3912607B2 (ja) | 2002-06-19 | 2007-05-09 | サンケン電気株式会社 | 半導体発光装置の製法 |
| TWI292961B (en) * | 2002-09-05 | 2008-01-21 | Nichia Corp | Semiconductor device and an optical device using the semiconductor device |
| JP4603368B2 (ja) | 2003-02-28 | 2010-12-22 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツング | 構造化された金属被覆を施されたパッケージボディを有するオプトエレクトロニクス素子、この種の素子を製作する方法、およびプラスチックを含むボディに、構造化された金属被覆を施す方法 |
| JP4182783B2 (ja) * | 2003-03-14 | 2008-11-19 | 豊田合成株式会社 | Ｌｅｄパッケージ |
| DE10323857A1 (de) * | 2003-05-26 | 2005-01-27 | Osram Opto Semiconductors Gmbh | Gehäuse für ein Laserdiodenbauelement, Laserdiodenbauelement und Verfahren zum Herstellen eines Laserdiodenbauelements |
| DE10360943A1 (de) * | 2003-12-23 | 2005-07-21 | Engel, Hartmut S. | Beleuchtungseinrichtung |
| JP2005243973A (ja) * | 2004-02-26 | 2005-09-08 | Kyocera Corp | 発光装置および照明装置 |
| DE102004053116A1 (de) * | 2004-11-03 | 2006-05-04 | Tridonic Optoelectronics Gmbh | Leuchtdioden-Anordnung mit Farbkonversions-Material |
| JP2006186297A (ja) * | 2004-12-03 | 2006-07-13 | Toshiba Corp | 半導体発光装置及びその製造方法 |
| KR100580753B1 (ko) * | 2004-12-17 | 2006-05-15 | 엘지이노텍 주식회사 | 발광소자 패키지 |
| DE112006000694B4 (de) * | 2005-03-24 | 2013-10-17 | Kyocera Corp. | Gehäuse für Lichtemissionsvorrichtung, lichtemittierende Vorrichtung und Beleuchtungsvorrichtung |
| KR100631992B1 (ko) * | 2005-07-19 | 2006-10-09 | 삼성전기주식회사 | 측면 방출형 이중 렌즈 구조 ｌｅｄ 패키지 |
| CN101846247B (zh) * | 2005-12-22 | 2013-04-17 | 松下电器产业株式会社 | 具有led的照明器具 |
| JP2007305785A (ja) * | 2006-05-11 | 2007-11-22 | Nichia Chem Ind Ltd | 発光装置 |
| US7637628B2 (en) * | 2006-06-13 | 2009-12-29 | Light-Pod, Inc. | LED light pod with modular optics and heat dissipation structure |
| US8367945B2 (en) * | 2006-08-16 | 2013-02-05 | Cree Huizhou Opto Limited | Apparatus, system and method for use in mounting electronic elements |
| JP4846498B2 (ja) * | 2006-09-22 | 2011-12-28 | 株式会社東芝 | 光半導体装置及び光半導体装置の製造方法 |
| DE102006046678A1 (de) * | 2006-09-29 | 2008-04-03 | Osram Opto Semiconductors Gmbh | Gehäuse für ein optoelektronisches Bauelement, optoelektronisches Bauelement und Verfahren zum Herstellen eines Gehäuses für ein optoelektronisches Bauelement |
| KR100801621B1 (ko) * | 2007-06-05 | 2008-02-11 | 서울반도체 주식회사 | Ｌｅｄ 패키지 |
| JP2008305940A (ja) * | 2007-06-07 | 2008-12-18 | Showa Denko Kk | 表示装置、キャップ、発光装置、およびこれらの製造方法 |
| WO2009114783A1 (en) * | 2008-03-13 | 2009-09-17 | Fraen Corporation | Reflective variable spot size lighting devices and systems |
| US20100032702A1 (en) * | 2008-08-11 | 2010-02-11 | E. I. Du Pont De Nemours And Company | Light-Emitting Diode Housing Comprising Fluoropolymer |
| DE102008038748B4 (de) | 2008-08-12 | 2022-08-04 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Oberflächenmontierbares, optoelektronisches Halbleiterbauteil |
| DE102009033287A1 (de) * | 2009-07-15 | 2011-01-20 | Osram Opto Semiconductors Gmbh | Leuchtdiode und Verfahren zur Herstellung einer Leuchtdiode |
| US8585253B2 (en) * | 2009-08-20 | 2013-11-19 | Illumitex, Inc. | System and method for color mixing lens array |
-
2009
- 2009-12-16 DE DE102009058421A patent/DE102009058421A1/de not_active Withdrawn
-
2010
- 2010-11-17 KR KR1020127018624A patent/KR20120106808A/ko not_active Withdrawn
- 2010-11-17 JP JP2012543566A patent/JP2013514641A/ja not_active Withdrawn
- 2010-11-17 CN CN2010800577362A patent/CN102668144A/zh active Pending
- 2010-11-17 US US13/513,784 patent/US9331255B2/en not_active Expired - Fee Related
- 2010-11-17 WO PCT/EP2010/067705 patent/WO2011082876A1/de not_active Ceased
- 2010-11-17 EP EP10788034A patent/EP2513985A1/de not_active Withdrawn
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