Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
  • H10F77/00—Constructional details of devices covered by this subclass
  • H10F77/50—Encapsulations or containers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/8506—Containers
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/852—Encapsulations
  • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
  • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
  • H01L2224/42—Wire connectors; Manufacturing methods related thereto
  • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
  • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
  • H01L2224/481—Disposition
  • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
  • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
  • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
  • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
  • H01L2924/181—Encapsulation
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/30—Technical effects
  • H01L2924/301—Electrical effects
  • H01L2924/3025—Electromagnetic shielding
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/855—Optical field-shaping means, e.g. lenses
  • H10H20/856—Reflecting means
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
  • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
  • H10H20/80—Constructional details
  • H10H20/85—Packages
  • H10H20/858—Means for heat extraction or cooling
  • H10H20/8581—Means for heat extraction or cooling characterised by their material

Definitions

• An object to be solved is to provide a housing for an optoelectronic component, which is characterized by an increased aging resistance and at the same time improved optical properties.
• a housing for an optoelectronic component is specified.
• the optoelectronic component is, for example, an optoelectronic component
• the optoelectronic semiconductor chip may be radiation-receiving or radiation-emitting.
• the housing may be a housing for at least one light-emitting diode chip, at least one
• Laser diode chip and / or act at least one photodiode chip are used.
• the housing comprises a housing base body having a recess.
• the recess of the housing base body is designed such that it is for receiving at least one
• the recess for example, the recess laterally limiting
• the housing comprises a coating which is connected at least in places in the region of the recess at least in places to the housing base body and in direct contact with the housing Housing body is stationary.
• the coating is thus a part of the housing, for example, directly on an outer surface of the housing body
• the coating is present at least in the region of the recess.
• the coating is present at least in the region of the recess.
• housing body in the region of the recess to be completely covered by the coating Furthermore, it is possible that only side surfaces or parts of side surfaces of the recess of the housing base body are covered by the coating and other regions of the recess, for example their bottom surface, are free of the coating or substantially free of the coating.
• substantially free of the coating may mean that the bottom surface of the recess is at most one
• the coating has a uniform thickness. This means in particular that the thickness of the
• Coating within the manufacturing tolerance does not change throughout the coating.
• the coating is preferably mechanically firmly connected to the housing base body, such that a release of the coating from the housing base body to destroy the
• the housing base body and the coating form a non-destructive dissolvable unit.
• the housing base body is formed with a first plastic material and the coating is provided with a second
• Plastic materials of housing body and coating may have the same components, but differ from each other in at least one component. According to at least one embodiment of the housing
• the first plastic material and the second plastic material differ from one another with regard to at least one of the following material properties:
• the plastic material with the higher temperature resistance is characterized in particular by the fact that it is only from a higher limit temperature than the plastic material with the lower
• the higher temperature resistant plastic material can withstand a longer time of deformation, discoloration, or destruction at a given temperature than the lower temperature resistant material.
• the one plastic material may be a material that resists discoloration for a longer time than the other plastic material, but less resistant to deformation than the other plastic material.
• electromagnetic radiation resistance is understood to mean the material having the higher resistance to electromagnetic radiation deforms or discolors later than the plastic material having the lower resistance
• the electromagnetic radiation is, for example, electromagnetic radiation from the wavelength range of UV radiation or blue light.
• electromagnetic radiation is, for example, electromagnetic radiation from the wavelength range of UV radiation or blue light.
• Discoloration of the plastic material with greater resistance to electromagnetic radiation then occurs delayed as compared to a material with less
• the housing for an optoelectronic component, the housing comprises a
• Housing body which has a recess, a
• Plastic material is formed, the coating is formed with a second plastic material, the first
• Plastic material is different from the second plastic material, and the first plastic material and the second
• Plastic material differ from one another with regard to at least one of the following material properties: temperature resistance with respect to discoloration,
• Temperature resistance with regard to deformation Temperature resistance to destruction, resistance to electromagnetic radiation.
• the plastic material with the higher temperature resistance has the lower resistance to electromagnetic radiation.
• the same plastic materials can be used and the different properties of
• Housing body and coating are adjusted by fillers in the plastic material. Furthermore, it is particularly possible for the body recycled plastics too
• the housing described here is therefore particularly inexpensive to produce and particularly environment-friendly.
• the basic body and the coating of the housing differ in terms of their optical properties
• the plastic materials of the housing base body and the coating are not necessary for the plastic materials of the housing base body and the coating to differ from each other in terms of their optical properties. In this case, the optical
• the coating may be reflective for electromagnetic radiation from a certain wavelength range
• Radiation absorbing for the same or another wavelength range can be performed. It is, however possible that the plastic materials, that is, the first and the second plastic material, have different optical properties from each other. It may then be possible that neither the first plastic material nor the second plastic material for the formation of
• Housing body and coating is provided with a filler.
• the housing base body may then consist of the first plastic material and the coating may consist of the second plastic material.
• the coating for UV radiation has a reflectivity of greater than 80%. That is, for at least one wavelength in the range of UV radiation, the reflectivity of the coating is greater than 80%.
• the reflectivity of the coating may preferably be greater than 90%, particularly preferably greater than 95%.
• the coating for visible radiation has a reflectivity of greater than 80%. That is, for at least one
• the reflectivity of the coating is greater than 80%.
• the coating may have a reflectivity of greater than 90%, preferably greater than 95% for this wavelength. It is also possible that the coating is for a UV radiation and a visible one
• the coating comprises the second plastic material and a
• the white pigment may, for example, in the form of particles and / or in the form of fibers in the second
• the coating can then in particular consist of the second plastic material and the white pigment.
• the white pigment is, for example, an achromatic inorganic pigment having a high refractive index of preferably greater than 1.45, preferably greater than 1.75.
• the white pigment may comprise at least one of the following materials: titanium dioxide in the anatase configuration and / or in the rutile configuration, lithopone, barium sulfate, zinc oxide, zinc sulfide,
• Zirconia, boron nitride, aluminoxane for example
• the second plastic material has a smaller one
• Temperature resistance for example, in terms of a
• the second plastic material optionally forms the coating of the housing with further fillers. It is possible that the second
• Plastic material from locations where elevated temperatures occur in the housing may be spaced. For example, it is possible that the coating is less strongly heated during assembly of the housing by soldering than the housing base body. For the second plastic material may then be less with respect to discoloration
• temperature-resistant plastic material can be selected.
• the second plastic material can be more temperature-resistant than the first plastic material in terms of deformation.
• Plastic material is the first then softer, so for example, slightly melted, which improves the adhesion between the two plastic materials.
• the first plastic material then has a lower melting point than the second plastic material.
• the first plastic material has a lower resistance
• the housing base body can at least in places by the coating of
• Component of the housing or outside of the housing is generated, be shielded. It may therefore be sufficient for the second plastic material to choose a radiation resistant material and for the first plastic material to use a less radiation resistant material.
• the first plastic material is selected from a group comprising at least one of the following materials: polyamide, polyphenylene sulfide, polyetherimide, polyphenylsulfone,
• Polyphthalamide Polyetheretherketone. These materials are found individually or in mixture with others
• Materials as particularly temperature-resistant, so that they can cope, for example, the stresses in a soldering process.
• the second plastic material is selected from a group comprising at least one of the following materials: polyester, fluoropolymer, polyether ketones, liquid crystal polymer,
• the housing has a further coating which, at least
• Housing body is applied, and the other
• Coating differs in terms of their optical properties of the housing base body and the coating.
• the further coating can with the first
• Plastic material to be formed with the second plastic material or another plastic material is
• the further coating is formed with the same plastic material as the coating,
• the further coating may then contain, for example, radiation-absorbing material, such as soot particles, whereby the further coating may then contain, for example, radiation-absorbing material, such as soot particles, whereby the further coating
• Coating radiation-absorbing is formed.
• the contrast between the coating and the further coating in a plan view of the housing is particularly large.
• the further coating consists of the same plastic material as the housing, but of the latter with regard to the optical properties different. So can the further coating
• a filler such as carbon black
• the housing base body, the coating and, if present, the further coating are each injection-molded.
• Injection molding is in this case of other manufacturing processes by typical for the manufacturing process residues such as a seam or the demolition of a spray nozzle on the finished
• the feature injection-molded is therefore an objective feature that can be distinguished from other production methods.
• the housing is manufactured by means of a multi-component injection molding process, for example a two-component injection molding process or a three-component injection molding process.
• the housing base body, the coating and, if present, the further coating can be mechanically connected to one another as connection-free.
• the components of the housing such as the housing base body and the coating form a solid, non-destructive releasable connection, not by a connecting means - such as a
• Adhesive - is mediated between the components. Such a connection means free connection between the
• Components of the housing is in particular by the
• the second plastic material may then be present as a foil, for example with reflective fillers. This is possible in particular if the second plastic material comprises a material or consists of a material
• Injection molding such as some types of PTFE.
• the film can then either be placed in an empty casting tool and back-injected with the first plastic material or the film is placed on the already finished
• the film may then be between 0.1 and 0.5 mm thick and preferably has a reflectivity of greater than 90% for UV radiation and / or visible light.
• the optoelectronic component comprises a housing, as described in at least one of the embodiments described here or in at least one of those described here
• the optoelectronic component further comprises at least one Radiation-emitting semiconductor chip, such as a light-emitting diode chip or a laser diode chip.
• At least one radiation-emitting semiconductor chip is arranged in the recess of the housing base body.
• At least one radiation-emitting semiconductor chip can be fastened to the bottom surface of the recess and electrically connected.
• the housing can be next to the housing body and the coatings
• connection points which are mechanically fixed, for example, by the multi-component injection molding with at least one other component of the housing.
• Figures 1 to 3 show side views of
• FIG. 1 shows a schematic sectional illustration of a first exemplary embodiment of one described here
• the optoelectronic component comprises a housing 1.
• the housing 1 has a
• the housing base 2 on.
• the housing base 2 is formed with a first plastic material.
• Housing main body 2 may contain at least one of the following plastic materials or consist of one of the following plastic materials: high-temperature polyamides, polyphenylene sulfide (PPS), polyetherimide (PEI) and / or
• PPSU Polyphenylsulfone
• LCP polyether ketone
• Recycled types such as recyclates can also be used.
• the housing base 2 is preferably a
• the first plastic material for the first plastic material for the first plastic material
• Housing main body 2 is thus characterized for example by a particularly high temperature resistance.
• the housing base body 2 also has a recess 4, in which in places no material of the housing base body is present.
• the recess 4 is bounded for example by a tapered side wall 4a and a bottom surface 4b.
• the recess 4 is dimensioned such that it
• Receiving at least one optoelectronic semiconductor chip is suitable.
• the housing base body 2 has, on its upper side facing away from the bottom surface 4b of the recess 4, an outer surface 2a, which surrounds the recess 4.
• the housing 1 further comprises a coating 3.
• Coating 3 is formed with a second plastic material made of the first plastic material of the
• Housing body 2 is different.
• one of the following second is suitable for the coating 3
• Plastic materials high temperature polyamides such as Amodel, Grivory, Genestar, Zytel HTN, Stanyl, PA4T, which are used to
• Improvement in aging stability may include other mineral fillers such as glass fibers or other fillers, and / or polyesters such as PBT (Pocan), PET (Impet), PEN, PCT optionally with mineral fillers such as glass fibers or other fillers and / or sprayable fluoropolymers such as PFA,
• FEP optionally with mineral fillers such as glass fibers or other fillers and / or PEEK
• LCP optionally with mineral fillers such as glass fibers or other fillers and / or silicone in liquid silicone injection molding.
• the outer surface 3a of the coating 3 serves for example for the reflection of electromagnetic radiation and is filled with a white pigment for this purpose.
• the coating 3 is made
• the white pigment for example, from the second plastic material and the white pigment, which may be in the form of particles.
• a titanium dioxide is used as white pigment.
• the white pigment is present at between 10% and 35% concentration.
• Housing body 2 applied. Housing body 2 and
• Coating 3 are connected to each other by means of a two-component injection molding.
• the housing 1 further has connection points 9, which in the region of the recess 4 connecting areas 8a, 8b for
• the coating 3 can by means of
• the optoelectronic component also has a
• optoelectronic component for example a
• Optoelectronic semiconductor chip 7 which is preferably a radiation-emitting
• optoelectronic semiconductor chip such as a light-emitting diode chip or a laser diode chip is.
• the optoelectronic semiconductor chip 7 is electrically conductive with the first connection region 8a and the second
• the optoelectronic semiconductor chip 7 by means of a contact wire 6 with the second
• Connection area 8a be electrically conductively connected.
• the recess 4 is presently filled with a potting material 5, which is designed to be radiation-permeable.
• potting material 5 can radiation scattering and / or
• the potting material 5 is, for example, in direct contact with the outer surface 3a of the coating 3.
• the first plastic material has a slightly lower melting point than the second plastic material when the first plastic material is first injected.
• the melting point of the first plastic material is
• Plastic material may be used, for example, in one of the following materials: PA4T, PA8T, PA10T / PA66, PBT, PET.
• one of the following materials may be used for the second plastic material: PA6T / 61, PA6T / 66, PEEK, LCP.
• Coating 3 may be a silicone filled with a white pigment, such as titanium dioxide particles.
• a white pigment such as titanium dioxide particles.
• the potting material 5 also contains a silicone or consists of a silicone.
• the adhesion between the housing 1 and the potting material 5 is particularly high, so that the likelihood of delamination of the potting material 5 during operation of the
• the coating 3 covers the housing base 2 not only in the region of the recess 4, but also the outer surface 2a of the base body 2 is at least in places of the
• the coating 3 can in this case
• the coating 3 is formed black, so that the contrast between that of the optoelectronic
• the housing base body 2 may be formed in this case in a different color, for example white.
• Coating 3 and housing body 2 are also in
• Coating 3 is arranged no connecting means, so that the connection between the two housing components
• a further coating 30 which differs in their optical properties of the optical properties of the housing body 2 and the coating 3.
• the further coating 30 is designed to absorb radiation
• the housing body 2 can then be made less absorbent than the further coating 30 and less reflective than the coating 3.
• the coating 30 can by means of a further injection molding on Housing base 2 and the coating 3 to be attached.
• the housing 1 is generated in the embodiment of Figure 3 by a three-component injection molding.
• the further coating 30 can be made from the first
• Plastic material of the coating 3 or another plastic material may be formed. Overall, a housing described here and an optoelectronic component described here proves to be
• the main body 2 of the housing 1 is made of a low-priced, for example, a recycled plastic, which is characterized for example by a high solder resistance, that is, in particular by a high temperature resistance.

Landscapes

• Injection Moulding Of Plastics Or The Like (AREA)
• Casings For Electric Apparatus (AREA)
• Led Device Packages (AREA)
• Engineering & Computer Science (AREA)
• Microelectronics & Electronic Packaging (AREA)

Applications Claiming Priority (2)

Publications (1)

Family

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Family Applications (1)

Country Status (8)

Families Citing this family (16)

Family Cites Families (24)

• 2009
  • 2009-11-25 DE DE102009055786A patent/DE102009055786A1/de not_active Withdrawn
• 2010
  • 2010-11-02 JP JP2012540348A patent/JP2013512556A/ja active Pending
  • 2010-11-02 KR KR1020127016558A patent/KR20120117792A/ko not_active Withdrawn
  • 2010-11-02 US US13/511,414 patent/US9006773B2/en not_active Expired - Fee Related
  • 2010-11-02 WO PCT/EP2010/066650 patent/WO2011064072A1/de not_active Ceased
  • 2010-11-02 CN CN201080053529XA patent/CN102630346A/zh active Pending
  • 2010-11-02 EP EP10773316A patent/EP2504861A1/de not_active Withdrawn
  • 2010-11-22 TW TW099140164A patent/TWI440227B/zh not_active IP Right Cessation

Non-Patent Citations (1)

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