TWI440227B - 殼體、光電組件及殼體的製造方法 - Google Patents

殼體、光電組件及殼體的製造方法 Download PDF

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Publication number
TWI440227B
TWI440227B TW099140164A TW99140164A TWI440227B TW I440227 B TWI440227 B TW I440227B TW 099140164 A TW099140164 A TW 099140164A TW 99140164 A TW99140164 A TW 99140164A TW I440227 B TWI440227 B TW I440227B
Authority
TW
Taiwan
Prior art keywords
plastic
coating
casing
housing
housing body
Prior art date
Application number
TW099140164A
Other languages
English (en)
Chinese (zh)
Other versions
TW201131826A (en
Inventor
葛托德 克勞特
伯恩 巴克曼
Original Assignee
歐斯朗奧托半導體股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 歐斯朗奧托半導體股份有限公司 filed Critical 歐斯朗奧托半導體股份有限公司
Publication of TW201131826A publication Critical patent/TW201131826A/zh
Application granted granted Critical
Publication of TWI440227B publication Critical patent/TWI440227B/zh

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Led Device Packages (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
TW099140164A 2009-11-25 2010-11-22 殼體、光電組件及殼體的製造方法 TWI440227B (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE102009055786A DE102009055786A1 (de) 2009-11-25 2009-11-25 Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses

Publications (2)

Publication Number Publication Date
TW201131826A TW201131826A (en) 2011-09-16
TWI440227B true TWI440227B (zh) 2014-06-01

Family

ID=43383620

Family Applications (1)

Application Number Title Priority Date Filing Date
TW099140164A TWI440227B (zh) 2009-11-25 2010-11-22 殼體、光電組件及殼體的製造方法

Country Status (8)

Country Link
US (1) US9006773B2 (enExample)
EP (1) EP2504861A1 (enExample)
JP (1) JP2013512556A (enExample)
KR (1) KR20120117792A (enExample)
CN (1) CN102630346A (enExample)
DE (1) DE102009055786A1 (enExample)
TW (1) TWI440227B (enExample)
WO (1) WO2011064072A1 (enExample)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
TWI740149B (zh) * 2019-05-24 2021-09-21 華碩電腦股份有限公司 殼體的製造方法

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DE102010013317B4 (de) * 2010-03-30 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils
CN203260631U (zh) * 2010-07-01 2013-10-30 西铁城控股株式会社 Led光源装置
JP2014011029A (ja) * 2012-06-29 2014-01-20 Toshiba Lighting & Technology Corp 照明装置
WO2013025832A1 (en) * 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
JP2013222499A (ja) * 2012-04-12 2013-10-28 Sharp Corp 光源基板ユニット
CN102779926B (zh) * 2012-08-02 2015-01-28 慧明光电(深圳)有限公司 高对比度的防水表贴led灯
DE102014102258B4 (de) 2014-02-21 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102014106882A1 (de) * 2014-05-15 2015-11-19 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR102360957B1 (ko) * 2015-03-27 2022-02-11 삼성디스플레이 주식회사 발광 다이오드 패키지
EP3306683A4 (en) * 2015-06-01 2018-12-19 Mitsubishi Electric Corporation Light emitting device, display unit, and image display device
JP6728764B2 (ja) * 2016-02-26 2020-07-22 日亜化学工業株式会社 発光装置及びそれを用いた照明装置
JP7117170B2 (ja) * 2018-06-20 2022-08-12 スタンレー電気株式会社 発光装置
JP7212241B2 (ja) 2018-06-21 2023-01-25 日亜化学工業株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
CN113410374B (zh) * 2021-06-17 2022-10-04 中国科学院半导体研究所 一种混色led器件

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JP2000037726A (ja) 1998-07-21 2000-02-08 Toray Ind Inc 熱可塑性樹脂製品類のリサイクル方法
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
US20030133300A1 (en) * 2002-01-11 2003-07-17 Bily Wang Light absorbing wall for LED package
DE10229067B4 (de) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
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US7718451B2 (en) * 2003-02-28 2010-05-18 Osram Opto Semiconductor Gmbh Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI740149B (zh) * 2019-05-24 2021-09-21 華碩電腦股份有限公司 殼體的製造方法

Also Published As

Publication number Publication date
WO2011064072A1 (de) 2011-06-03
DE102009055786A1 (de) 2011-05-26
US9006773B2 (en) 2015-04-14
EP2504861A1 (de) 2012-10-03
KR20120117792A (ko) 2012-10-24
TW201131826A (en) 2011-09-16
JP2013512556A (ja) 2013-04-11
CN102630346A (zh) 2012-08-08
US20120273811A1 (en) 2012-11-01

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