CN102630346A - 用于光电子构件的壳体和用于制造壳体的方法 - Google Patents

用于光电子构件的壳体和用于制造壳体的方法 Download PDF

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Publication number
CN102630346A
CN102630346A CN201080053529XA CN201080053529A CN102630346A CN 102630346 A CN102630346 A CN 102630346A CN 201080053529X A CN201080053529X A CN 201080053529XA CN 201080053529 A CN201080053529 A CN 201080053529A CN 102630346 A CN102630346 A CN 102630346A
Authority
CN
China
Prior art keywords
housing
plastic material
coating
base body
housing base
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201080053529XA
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English (en)
Chinese (zh)
Inventor
格特鲁德·克劳特
贝恩德·巴克曼
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of CN102630346A publication Critical patent/CN102630346A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/858—Means for heat extraction or cooling
    • H10H20/8581—Means for heat extraction or cooling characterised by their material

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Casings For Electric Apparatus (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Led Device Packages (AREA)
CN201080053529XA 2009-11-25 2010-11-02 用于光电子构件的壳体和用于制造壳体的方法 Pending CN102630346A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102009055786.5 2009-11-25
DE102009055786A DE102009055786A1 (de) 2009-11-25 2009-11-25 Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
PCT/EP2010/066650 WO2011064072A1 (de) 2009-11-25 2010-11-02 Gehäuse für ein optoelektronisches bauteil und verfahren zur herstellung eines gehäuses

Publications (1)

Publication Number Publication Date
CN102630346A true CN102630346A (zh) 2012-08-08

Family

ID=43383620

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201080053529XA Pending CN102630346A (zh) 2009-11-25 2010-11-02 用于光电子构件的壳体和用于制造壳体的方法

Country Status (8)

Country Link
US (1) US9006773B2 (enExample)
EP (1) EP2504861A1 (enExample)
JP (1) JP2013512556A (enExample)
KR (1) KR20120117792A (enExample)
CN (1) CN102630346A (enExample)
DE (1) DE102009055786A1 (enExample)
TW (1) TWI440227B (enExample)
WO (1) WO2011064072A1 (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102010013317B4 (de) * 2010-03-30 2021-07-22 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauteil, Gehäuse hierfür und Verfahren zur Herstellung des optoelektronischen Bauteils
CN203260631U (zh) * 2010-07-01 2013-10-30 西铁城控股株式会社 Led光源装置
JP2014011029A (ja) * 2012-06-29 2014-01-20 Toshiba Lighting & Technology Corp 照明装置
WO2013025832A1 (en) * 2011-08-16 2013-02-21 E. I. Du Pont De Nemours And Company Reflector for light-emitting diode and housing
JP2013222499A (ja) * 2012-04-12 2013-10-28 Sharp Corp 光源基板ユニット
CN102779926B (zh) * 2012-08-02 2015-01-28 慧明光电(深圳)有限公司 高对比度的防水表贴led灯
DE102014102258B4 (de) 2014-02-21 2021-08-05 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches Bauelement
DE102014106882A1 (de) * 2014-05-15 2015-11-19 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
KR102360957B1 (ko) * 2015-03-27 2022-02-11 삼성디스플레이 주식회사 발광 다이오드 패키지
EP3306683A4 (en) * 2015-06-01 2018-12-19 Mitsubishi Electric Corporation Light emitting device, display unit, and image display device
JP6728764B2 (ja) * 2016-02-26 2020-07-22 日亜化学工業株式会社 発光装置及びそれを用いた照明装置
JP7117170B2 (ja) * 2018-06-20 2022-08-12 スタンレー電気株式会社 発光装置
JP7212241B2 (ja) 2018-06-21 2023-01-25 日亜化学工業株式会社 発光装置
JP7190889B2 (ja) * 2018-12-07 2022-12-16 スタンレー電気株式会社 発光装置及び発光装置モジュール
TWI740149B (zh) * 2019-05-24 2021-09-21 華碩電腦股份有限公司 殼體的製造方法
CN113410374B (zh) * 2021-06-17 2022-10-04 中国科学院半导体研究所 一种混色led器件

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US20030133300A1 (en) * 2002-01-11 2003-07-17 Bily Wang Light absorbing wall for LED package
US20060060867A1 (en) * 2004-09-09 2006-03-23 Toyoda Gosei Co., Ltd. Light emitting device
CN101136447A (zh) * 2006-08-31 2008-03-05 株式会社东芝 半导体发光器件
CN101523621A (zh) * 2006-09-29 2009-09-02 奥斯兰姆奥普托半导体有限责任公司 光电子器件的壳体、光电子器件以及用于制造光电子器件的壳体的方法

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DE9319190U1 (de) 1993-12-14 1994-02-10 Ems-Inventa AG, Zürich Formteil mit resistenter Oberfläche
JP2000037726A (ja) 1998-07-21 2000-02-08 Toray Ind Inc 熱可塑性樹脂製品類のリサイクル方法
DE10020465A1 (de) * 2000-04-26 2001-11-08 Osram Opto Semiconductors Gmbh Strahlungsemittierendes Halbleiterbauelement mit Lumineszenzkonversionselement
JP2002374007A (ja) * 2001-06-15 2002-12-26 Toyoda Gosei Co Ltd 発光装置
DE10153259A1 (de) * 2001-10-31 2003-05-22 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement
DE10229067B4 (de) 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP2004071950A (ja) 2002-08-08 2004-03-04 Matsushita Electric Ind Co Ltd 半導体パッケージおよびその製造方法
US7718451B2 (en) * 2003-02-28 2010-05-18 Osram Opto Semiconductor Gmbh Method for producing an optoelectronic device with patterned-metallized package body and method for the patterned metalization of a plastic-containing body
DE102004031391B4 (de) 2004-06-29 2009-06-04 Osram Opto Semiconductors Gmbh Elektronisches Bauteil mit Gehäuse zum ESD-Schutz
DE102005036520A1 (de) 2005-04-26 2006-11-09 Osram Opto Semiconductors Gmbh Optisches Bauteil, optoelektronisches Bauelement mit dem Bauteil und dessen Herstellung
JP2007042668A (ja) * 2005-07-29 2007-02-15 Toyoda Gosei Co Ltd Ｌｅｄ発光装置
US8044412B2 (en) 2006-01-20 2011-10-25 Taiwan Semiconductor Manufacturing Company, Ltd Package for a light emitting element
JP2007262259A (ja) 2006-03-29 2007-10-11 Toray Ind Inc リサイクルポリアミド樹脂組成物
JP2007281260A (ja) * 2006-04-07 2007-10-25 Sumitomo Metal Electronics Devices Inc リフレクターとそれを用いた発光素子収納用パッケージ及びリフレクターに用いるレンズ
JP4846498B2 (ja) * 2006-09-22 2011-12-28 株式会社東芝 光半導体装置及び光半導体装置の製造方法
EP2089914A2 (en) 2006-11-09 2009-08-19 Quantum Leap Packaging, Inc. Led reflective package
DE102007017855A1 (de) 2007-04-16 2008-10-23 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Bauelementes und optoelektronisches Bauelement
US7956469B2 (en) * 2007-07-27 2011-06-07 Nichia Corporation Light emitting device and method of manufacturing the same
WO2009075530A2 (en) * 2007-12-13 2009-06-18 Amoleds Co., Ltd. Semiconductor and manufacturing method thereof
DE102008038748B4 (de) 2008-08-12 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Oberflächenmontierbares, optoelektronisches Halbleiterbauteil

Patent Citations (4)

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Publication number Priority date Publication date Assignee Title
US20030133300A1 (en) * 2002-01-11 2003-07-17 Bily Wang Light absorbing wall for LED package
US20060060867A1 (en) * 2004-09-09 2006-03-23 Toyoda Gosei Co., Ltd. Light emitting device
CN101136447A (zh) * 2006-08-31 2008-03-05 株式会社东芝 半导体发光器件
CN101523621A (zh) * 2006-09-29 2009-09-02 奥斯兰姆奥普托半导体有限责任公司 光电子器件的壳体、光电子器件以及用于制造光电子器件的壳体的方法

Also Published As

Publication number Publication date
WO2011064072A1 (de) 2011-06-03
DE102009055786A1 (de) 2011-05-26
US9006773B2 (en) 2015-04-14
EP2504861A1 (de) 2012-10-03
KR20120117792A (ko) 2012-10-24
TW201131826A (en) 2011-09-16
TWI440227B (zh) 2014-06-01
JP2013512556A (ja) 2013-04-11
US20120273811A1 (en) 2012-11-01

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