CN102779926B - 高对比度的防水表贴led灯 - Google Patents

高对比度的防水表贴led灯 Download PDF

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CN102779926B
CN102779926B CN201210272821.1A CN201210272821A CN102779926B CN 102779926 B CN102779926 B CN 102779926B CN 201210272821 A CN201210272821 A CN 201210272821A CN 102779926 B CN102779926 B CN 102779926B
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shell
layer
waterproof
led chip
black
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Expired - Fee Related
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CN102779926A (zh
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区永超
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KINDWIN OPTO (SHENZHEN) CO Ltd
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KINDWIN OPTO (SHENZHEN) CO Ltd
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Publication of CN102779926A publication Critical patent/CN102779926A/zh
Priority to US13/742,055 priority patent/US8974090B2/en
Priority to EP13158902.0A priority patent/EP2693854B1/en
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00Reflectors for light sources
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483Containers
    • H01L33/486Containers adapted for surface mounting
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • F21V31/005Sealing arrangements therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/58Optical field-shaping elements
    • H01L33/60Reflective elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10106Light emitting diode [LED]
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/22Secondary treatment of printed circuits
    • H05K3/28Applying non-metallic protective coatings
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S362/00Illumination
    • Y10S362/80Light emitting diode

Abstract

本发明公开了一种高对比度的防水表贴LED灯,其包括:设有反光杯(1)的外壳、设于外壳下表面的PCB板(12)、设于反光杯(10)内的LED芯片(1)和导光封装胶(4)。所述的外壳由下层的浅色层(8)和上层的深色层(9)复合而成;所述PCB板(12)上表面和外壳浅色层(8)的外表面设有黑色防水密封胶(11)。本发明反光杯的内表面下层为浅色层、上层为深色层,可以防止外来光线对LED芯片出光亮度的干扰,以致产品显示的对比度得到加强。另外,设置的黑色防水密封胶使得从外壳的外观来看均是黑色的,从而把LED芯片的出光亮度保持在最好效果。还可以获得有效的防水效果。

Description

高对比度的防水表贴LED灯
技术领域
本发明涉及表贴LED灯,尤其涉及一种高对比度的防水表贴LED灯。
背景技术
随着LED灯的快速普及,直接导致了市场销量的上升和成本的不断降低,这为推广更高对比度、更高分辨率的显示屏带来良好前景。现有LED灯一般包括:设有反光杯的塑胶外壳,设于塑胶外壳背面的封装PCB ,反光杯内设有与PCB电连接的LED芯片以及导光封装胶。
为了提高显示的对比度,传统表贴LED灯一般有如下几种做法:
1、白壳丝印黑面 — 在白色塑胶外壳2的顶部表面丝印黑色涂层3,则白色的反光杯5表面和顶部表面的黑色涂层3形成色度的反差,以增加产品显示的对比度,反光杯5内还设有LED芯片1和导光封装胶4,如图1所示。
缺点:由于LED芯片1的四周及反光杯5内表面都是白色的,这些白色塑胶的表面会反射外来的光线,而使产品显示的对比度降低。
2、全黑壳 — 使用黑色塑胶代替原来的白色塑胶来注塑外壳,使整个外壳6以及反光杯5的表面均为黑色,以增强产品显示的对比度,如图2所示。
缺点:由于LED芯片1内的反光杯5表面也是黑色,LED芯片发出的光线不能较好的从黑色的反光杯表面反射出去, 则大大降低了LED的出光亮度。有些厂家为了解决亮度低的问题,用提高LED电流的方法来提高LED的亮度,但这违反了使用LED省电的初衷, 这也增加了产品的热量排放,影响产品的寿命。
3、外黑内白壳 — 使用黑色塑胶注塑外壳6,配上白色料注塑的反光杯衬里7,这使得反光杯衬里的外围及顶部均为黑色,而反光杯衬里7的表面是白色的,这能有效提高对比度,又不会降低LED芯片的出光亮度,如图3所示。
缺点:外来的光线会从反光杯表面反射出来而使得对比度降低。另外由于
是三层合成结构,较难达到理想的防水效果。一般厂家只会使用在防水性要求不高的产品上,适用性较低。
 如何设计出对比度高、耗能低和适用性高的防水表贴LED灯,是业界亟待解决的技术问题。
发明内容
本发明为了解决上述技术问题,提出一种对比度高、耗能低和适用性高的高对比度的防水表贴LED灯。
本发明提出的高对比度的防水表贴LED灯,其包括:设有反光杯的外壳、设于外壳下表面的PCB板、设于反光杯内的LED芯片和导光封装胶。所述的外壳由下层的浅色层和上层的深色层复合而成;所述PCB板上表面和外壳浅色层的外表面设有黑色防水密封胶。
其中,所述的浅色层可以为白色层、淡黄色层或浅灰色层的一种。
所述的深色层可以为黑色层、深蓝色层、深灰色层或深咖啡色层的一种。
本发明带有反光杯的外壳由下层的浅色层和上层的深色层叠加复合而成,那么由该外壳上表面向下沉陷的反光杯的内表面,其下层为浅色层、上层为深色层。当LED芯片发光时,反光杯的底部表面及下层浅色表面会将光反射出去。外来光一般只能照射到反光杯上层的深色表面(但不会反射光线)、而不易照射到下层的浅色表面,这样外来光线就不会干扰LED芯片的出光亮度,以致产品显示的对比度得到加强。另外,PCB板上表面和外壳浅色层的外表面设有黑色防水密封胶。而这些密封胶将外壳浅色层的外表面全部覆盖,使得从外壳的上表面及四周来观看均是黑色的,但却巧妙地保留LED四周及反光杯下部白色的反光部份,从而把LED芯片的出光亮度保持在最好效果。由于外壳的上、下层结合部、LED芯片外露的夹层线及底层部份均被防水密封胶完全覆盖,防水效能得到保证。
附图说明
图1为“白壳丝印黑面” LED灯的的剖视图;
图2为“全黑壳” LED灯的的剖视图;
图3为“外黑内白壳” LED灯的的剖视图;
图4为本发明优选实施例LED灯的剖视图。
具体实施方式
如图4所示,本发明提出的一种高对比度的防水表贴LED灯的实施例,其包括:设有反光杯1的塑胶外壳、设于外壳下表面的PCB板12、设于反光杯10内的LED芯片1,该LED芯片与PCB板电联接。反光杯10内还灌装有导光封装胶4。本发明的外壳由下层的浅色层8和上层的深色层9叠加复合而成。PCB板12上表面和外壳浅色层8的外表面设有黑色防水密封胶11。本实施例中,浅色层8为白色层,根据需要还可以选择其他浅色层,如、淡黄色层或浅灰色层的等等。深色层9 为黑色层,根据需要还可以选择其他深色层,如、深蓝色层、深灰色层或深咖啡色层等等。
本发明反光杯的内表面下层为浅色层、上层为深色层。当LED芯片发光时,反光杯的底部表面及下层浅色表面会将光反射出去。外来光一般只能照射到反光杯上层的深色表面(但不会反射光线)、而不易照射到下层的浅色表面,这样外来光线就不会干扰LED芯片的出光亮度,以致产品显示的对比度得到加强。另外,设置的黑色防水密封胶使得从外壳的外观来看均是黑色的,从而把LED芯片的出光亮度保持在最好效果。由于外壳的上、下层结合部、LED芯片外露的夹层线及底层部份均被防水密封胶完全覆盖,防水效能得到保证。
以上具体实施例仅用以举例说明本发明的结构,本领域的普通技术人员在本发明的构思下可以做出多种变形和变化,这些变形和变化均包括在本发明的保护范围之内。

Claims (3)

1.一种高对比度的防水表贴LED灯,包括设有反光杯(10)的外壳、设于外壳下表面的PCB板(12)、设于反光杯(10)内的LED芯片(1)和导光封装胶(4),其特征在于,所述的外壳由下层的浅色层(8)和上层的深色层(9)复合而成;当所述的LED芯片(1)发光时,反光杯(10)的底部表面及下层的浅色层(8)表面会将光反射出去,外来光只能照射到反光杯上层的深色层(9)表面、而不能照射到下层的浅色层(8)表面;所述PCB板(12)上表面和外壳浅色层(8)的外表面设有黑色防水密封胶(11),该黑色防水密封胶将外壳浅色层(8)和深色层(9)的结合部、LED芯片外露的夹层线及底层部份完全覆盖。
2.如权利要求1所述的高对比度的防水表贴LED灯,其特征在于,所述的浅色层(8)为白色层、淡黄色层或浅灰色层的一种。
3.如权利要求1所述的高对比度的防水表贴LED灯,其特征在于,所述的深色层(9)为黑色层、深蓝色层、深灰色层或深咖啡色层的一种。
CN201210272821.1A 2012-08-02 2012-08-02 高对比度的防水表贴led灯 Expired - Fee Related CN102779926B (zh)

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CN201210272821.1A CN102779926B (zh) 2012-08-02 2012-08-02 高对比度的防水表贴led灯
US13/742,055 US8974090B2 (en) 2012-08-02 2013-01-15 High contrast water-proof LED lamp
EP13158902.0A EP2693854B1 (en) 2012-08-02 2013-03-13 High-contrast waterproof surface-mounted led lamp

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102013113185A1 (de) * 2013-11-28 2015-05-28 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils sowie optoelektronisches Halbleiterbauteil und optoelektronische Anordnung
CN103730563B (zh) * 2013-12-31 2017-04-05 深圳雷曼光电科技股份有限公司 Led支架及采用该led支架的电子装置
WO2016066476A1 (en) 2014-10-27 2016-05-06 Koninklijke Philips N.V. Directional light emitting arrangement and a method of producing the same
DE102016108776A1 (de) * 2016-05-12 2017-11-16 Osram Opto Semiconductors Gmbh Optische Anordnung und Anzeigegerät
US10290783B2 (en) * 2016-09-21 2019-05-14 Foshan Nationstar Optoelectronics Co., Ltd. LED bracket, LED device and LED display screen
TWI676851B (zh) 2018-08-22 2019-11-11 隆達電子股份有限公司 畫素陣列封裝結構及顯示面板
CN111284155A (zh) * 2018-12-07 2020-06-16 上海航空电器有限公司 一种具备隐身性能的编队灯表面涂装处理方法
CN111900242A (zh) * 2020-06-24 2020-11-06 深圳市聚飞光电股份有限公司 Led发光件及其制作方法、显示装置
FR3138183A1 (fr) * 2022-07-20 2024-01-26 Valeo Vision Dispositif lumineux pour véhicule automobile.

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101523621A (zh) * 2006-09-29 2009-09-02 奥斯兰姆奥普托半导体有限责任公司 光电子器件的壳体、光电子器件以及用于制造光电子器件的壳体的方法
CN102110764A (zh) * 2010-12-17 2011-06-29 深圳雷曼光电科技股份有限公司 一种led及led支架
CN201975420U (zh) * 2011-01-13 2011-09-14 苏州泰嘉电子有限公司 一种smd发光二极管支架结构
CN202712259U (zh) * 2012-08-02 2013-01-30 慧明光电(深圳)有限公司 高对比度的防水表贴led灯

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2877611B2 (ja) * 1991-06-07 1999-03-31 株式会社東芝 光半導体装置
US6184544B1 (en) * 1998-01-29 2001-02-06 Rohm Co., Ltd. Semiconductor light emitting device with light reflective current diffusion layer
JP3748054B2 (ja) * 2001-06-28 2006-02-22 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
KR100519592B1 (ko) * 2003-07-07 2005-10-10 서울반도체 주식회사 발광 다이오드 표시 장치
DE102009055786A1 (de) * 2009-11-25 2011-05-26 Osram Opto Semiconductors Gmbh Gehäuse, optoelektronisches Bauteil und Verfahren zur Herstellung eines Gehäuses
US9831393B2 (en) * 2010-07-30 2017-11-28 Cree Hong Kong Limited Water resistant surface mount device package
CN201788643U (zh) * 2010-09-26 2011-04-06 深圳市联建光电股份有限公司 一种应用于高湿环境下的半户外贴片式led显示模组

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101523621A (zh) * 2006-09-29 2009-09-02 奥斯兰姆奥普托半导体有限责任公司 光电子器件的壳体、光电子器件以及用于制造光电子器件的壳体的方法
CN102110764A (zh) * 2010-12-17 2011-06-29 深圳雷曼光电科技股份有限公司 一种led及led支架
CN201975420U (zh) * 2011-01-13 2011-09-14 苏州泰嘉电子有限公司 一种smd发光二极管支架结构
CN202712259U (zh) * 2012-08-02 2013-01-30 慧明光电(深圳)有限公司 高对比度的防水表贴led灯

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CN102779926A (zh) 2012-11-14
US8974090B2 (en) 2015-03-10
US20140036508A1 (en) 2014-02-06
EP2693854B1 (en) 2015-03-04
EP2693854A3 (en) 2014-02-26

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