JP2013182943A - 固体撮像装置の製造方法 - Google Patents

固体撮像装置の製造方法 Download PDF

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Publication number
JP2013182943A
JP2013182943A JP2012044301A JP2012044301A JP2013182943A JP 2013182943 A JP2013182943 A JP 2013182943A JP 2012044301 A JP2012044301 A JP 2012044301A JP 2012044301 A JP2012044301 A JP 2012044301A JP 2013182943 A JP2013182943 A JP 2013182943A
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JP
Japan
Prior art keywords
region
imaging device
state imaging
resist pattern
solid
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2012044301A
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English (en)
Japanese (ja)
Other versions
JP2013182943A5 (enExample
Inventor
Hideomi Kumano
秀臣 熊野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP2012044301A priority Critical patent/JP2013182943A/ja
Priority to US13/772,631 priority patent/US8980540B2/en
Publication of JP2013182943A publication Critical patent/JP2013182943A/ja
Publication of JP2013182943A5 publication Critical patent/JP2013182943A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2022—Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2012044301A 2012-02-29 2012-02-29 固体撮像装置の製造方法 Pending JP2013182943A (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2012044301A JP2013182943A (ja) 2012-02-29 2012-02-29 固体撮像装置の製造方法
US13/772,631 US8980540B2 (en) 2012-02-29 2013-02-21 Method of manufacturing solid-state image sensor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012044301A JP2013182943A (ja) 2012-02-29 2012-02-29 固体撮像装置の製造方法

Publications (2)

Publication Number Publication Date
JP2013182943A true JP2013182943A (ja) 2013-09-12
JP2013182943A5 JP2013182943A5 (enExample) 2015-04-16

Family

ID=49003241

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012044301A Pending JP2013182943A (ja) 2012-02-29 2012-02-29 固体撮像装置の製造方法

Country Status (2)

Country Link
US (1) US8980540B2 (enExample)
JP (1) JP2013182943A (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216334A (ja) * 2014-04-21 2015-12-03 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器
JP2015230962A (ja) * 2014-06-05 2015-12-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2016187028A (ja) * 2015-03-27 2016-10-27 ルネサスエレクトロニクス株式会社 半導体装置
JP2016192467A (ja) * 2015-03-31 2016-11-10 ルネサスエレクトロニクス株式会社 半導体装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112567507B (zh) * 2018-08-28 2024-07-05 株式会社索思未来 半导体集成电路装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150848A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 固体撮像装置
JP2003145769A (ja) * 2001-11-12 2003-05-21 Canon Inc 回路基板の製造方法、および液体吐出ヘッドの製造方法
JP2004111802A (ja) * 2002-09-20 2004-04-08 Canon Inc 半導体装置及び固体撮像装置の製造方法
JP2008263050A (ja) * 2007-04-12 2008-10-30 Renesas Technology Corp 固体撮像素子の製造方法及び固体撮像素子
JP2011171511A (ja) * 2010-02-18 2011-09-01 Canon Inc 固体撮像装置および固体撮像装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2902506B2 (ja) 1990-08-24 1999-06-07 キヤノン株式会社 半導体装置の製造方法及び半導体装置
US5561317A (en) 1990-08-24 1996-10-01 Canon Kabushiki Kaisha Method of manufacturing semiconductor devices
JP3955986B2 (ja) 1998-01-30 2007-08-08 株式会社ニコン 固体撮像素子及びその製造方法
JP2003249640A (ja) 2002-02-22 2003-09-05 Sony Corp 固体撮像素子の製造方法
JP2004111866A (ja) 2002-09-20 2004-04-08 Canon Inc 半導体装置の製造方法
JP2004153115A (ja) 2002-10-31 2004-05-27 Canon Inc 半導体装置の製造方法
JP2013033870A (ja) * 2011-08-02 2013-02-14 Canon Inc 半導体デバイスおよびその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000150848A (ja) * 1998-11-09 2000-05-30 Toshiba Corp 固体撮像装置
JP2003145769A (ja) * 2001-11-12 2003-05-21 Canon Inc 回路基板の製造方法、および液体吐出ヘッドの製造方法
JP2004111802A (ja) * 2002-09-20 2004-04-08 Canon Inc 半導体装置及び固体撮像装置の製造方法
JP2008263050A (ja) * 2007-04-12 2008-10-30 Renesas Technology Corp 固体撮像素子の製造方法及び固体撮像素子
JP2011171511A (ja) * 2010-02-18 2011-09-01 Canon Inc 固体撮像装置および固体撮像装置の製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015216334A (ja) * 2014-04-21 2015-12-03 ソニー株式会社 固体撮像素子、固体撮像素子の製造方法、並びに、電子機器
US10217785B2 (en) 2014-04-21 2019-02-26 Sony Corporation Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
US12046619B2 (en) 2014-04-21 2024-07-23 Sony Corporation Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus
JP2015230962A (ja) * 2014-06-05 2015-12-21 ルネサスエレクトロニクス株式会社 半導体装置の製造方法および半導体装置
JP2016187028A (ja) * 2015-03-27 2016-10-27 ルネサスエレクトロニクス株式会社 半導体装置
JP2016192467A (ja) * 2015-03-31 2016-11-10 ルネサスエレクトロニクス株式会社 半導体装置

Also Published As

Publication number Publication date
US8980540B2 (en) 2015-03-17
US20130224664A1 (en) 2013-08-29

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