JP2013166878A - エポキシ樹脂組成物及び硬化物 - Google Patents
エポキシ樹脂組成物及び硬化物 Download PDFInfo
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- JP2013166878A JP2013166878A JP2012031500A JP2012031500A JP2013166878A JP 2013166878 A JP2013166878 A JP 2013166878A JP 2012031500 A JP2012031500 A JP 2012031500A JP 2012031500 A JP2012031500 A JP 2012031500A JP 2013166878 A JP2013166878 A JP 2013166878A
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- epoxy resin
- optical semiconductor
- resin composition
- semiconductor element
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- 239000003822 epoxy resin Substances 0.000 title claims abstract description 103
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 103
- 239000000203 mixture Substances 0.000 title claims abstract description 44
- 230000003287 optical effect Effects 0.000 claims abstract description 31
- 239000004065 semiconductor Substances 0.000 claims abstract description 30
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 150000002440 hydroxy compounds Chemical class 0.000 claims abstract description 23
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 22
- 229920005989 resin Polymers 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 22
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 11
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 30
- 238000007789 sealing Methods 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 125000001424 substituent group Chemical group 0.000 claims description 4
- 238000002845 discoloration Methods 0.000 abstract description 13
- 150000003440 styrenes Chemical class 0.000 abstract description 10
- 238000005538 encapsulation Methods 0.000 abstract 2
- 239000004215 Carbon black (E152) Substances 0.000 abstract 1
- 230000001747 exhibiting effect Effects 0.000 abstract 1
- 229930195733 hydrocarbon Natural products 0.000 abstract 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 45
- 150000002989 phenols Chemical class 0.000 description 26
- 238000006243 chemical reaction Methods 0.000 description 25
- 229920003986 novolac Polymers 0.000 description 25
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 15
- 238000003786 synthesis reaction Methods 0.000 description 15
- -1 CTBN Polymers 0.000 description 13
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 13
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 12
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 10
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- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
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- 239000004593 Epoxy Substances 0.000 description 7
- 239000003377 acid catalyst Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 6
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- IMHDGJOMLMDPJN-UHFFFAOYSA-N biphenyl-2,2'-diol Chemical compound OC1=CC=CC=C1C1=CC=CC=C1O IMHDGJOMLMDPJN-UHFFFAOYSA-N 0.000 description 6
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 6
- 229910052739 hydrogen Inorganic materials 0.000 description 6
- 239000001257 hydrogen Substances 0.000 description 6
- 239000000155 melt Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 5
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 5
- 150000003839 salts Chemical class 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 238000003756 stirring Methods 0.000 description 5
- MYRTYDVEIRVNKP-UHFFFAOYSA-N 1,2-Divinylbenzene Chemical compound C=CC1=CC=CC=C1C=C MYRTYDVEIRVNKP-UHFFFAOYSA-N 0.000 description 4
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 4
- 238000004040 coloring Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 230000006866 deterioration Effects 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 229960001755 resorcinol Drugs 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 3
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 3
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 3
- IXCOKTMGCRJMDR-UHFFFAOYSA-N 9h-fluorene;phenol Chemical compound OC1=CC=CC=C1.OC1=CC=CC=C1.C1=CC=C2CC3=CC=CC=C3C2=C1 IXCOKTMGCRJMDR-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 239000002518 antifoaming agent Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 125000000623 heterocyclic group Chemical group 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical compound C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical class C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 230000000704 physical effect Effects 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
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- METWAQRCMRWDAW-UHFFFAOYSA-N 2,6-diethylphenol Chemical compound CCC1=CC=CC(CC)=C1O METWAQRCMRWDAW-UHFFFAOYSA-N 0.000 description 2
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- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 2
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 2
- RGHHSNMVTDWUBI-UHFFFAOYSA-N 4-hydroxybenzaldehyde Chemical compound OC1=CC=C(C=O)C=C1 RGHHSNMVTDWUBI-UHFFFAOYSA-N 0.000 description 2
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- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 2
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- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 2
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- 150000008044 alkali metal hydroxides Chemical class 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
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- 239000007864 aqueous solution Substances 0.000 description 2
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- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical compound C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 2
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- UKMSUNONTOPOIO-UHFFFAOYSA-N docosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCC(O)=O UKMSUNONTOPOIO-UHFFFAOYSA-N 0.000 description 2
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- DAJPMKAQEUGECW-UHFFFAOYSA-N 1,4-bis(methoxymethyl)benzene Chemical compound COCC1=CC=C(COC)C=C1 DAJPMKAQEUGECW-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- BOKGTLAJQHTOKE-UHFFFAOYSA-N 1,5-dihydroxynaphthalene Chemical compound C1=CC=C2C(O)=CC=CC2=C1O BOKGTLAJQHTOKE-UHFFFAOYSA-N 0.000 description 1
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Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Led Device Packages (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Abstract
【解決手段】エポキシ樹脂、酸無水物系硬化剤を含有する光半導体素子封止用エポキシ樹脂組成物において、エポキシ樹脂成分が、下記一般式(1)で表される多価ヒドロキシ化合物のヒドロキシ基1モルに対し、スチレン類0.5〜1.5モルを反応させて、得られるスチレン変性多価ヒドロキシ樹脂とエピクロルヒドリンとを反応させて得られるエポキシ樹脂であり、ガードナー色数が1以下であるエポキシ樹脂を含有する。式中、R1は水素原子又は炭素数1〜6の炭化水素基を示し、nは1〜20の数を示す。
【選択図】なし
Description
(StPNの合成)
合成例1
1Lの4口フラスコに、多価ヒドロキシ化合物成分としてフェノールノボラック(昭和電工製;BRG−555、水酸基当量105g/eq.、軟化点67℃、150℃での溶融粘度0.08Pa・s)を105g、酸触媒としてp−トルエンスルホン酸0.055g(300ppm)を仕込み120℃に昇温した。次に、120℃にて攪拌しながら、スチレン73g(0.7モル)を3時間かけて滴下し反応させた。さらに、120℃にて1時間反応後、スチレン変性多価ヒドロキシ樹脂170gを得た。その水酸基当量は178g/eq.、軟化点は78℃、150℃での溶融粘度は0.13Pa・sであった。
1Lの4口フラスコに、多価ヒドロキシ化合物成分としてフェノールノボラック(昭和電工製;BRG−555)を105g、酸触媒としてp−トルエンスルホン酸0.041g(300ppm)を仕込み120℃に昇温した。次に、120℃にて攪拌しながら、スチレン31.2g(0.3モル)を3時間かけて滴下し反応させた。さらに、120℃にて1時間反応後、スチレン変性多価ヒドロキシ樹脂129gを得た。その水酸基当量は136g/eq.、軟化点は72℃、150℃での溶融粘度は0.10Pa・sであった。
1Lの4口フラスコに、多価ヒドロキシ化合物成分としてフェノールノボラック(昭和電工製;BRG−555)を105g、酸触媒としてp−トルエンスルホン酸0.085g(300ppm)を仕込み120℃に昇温した。次に、120℃にて攪拌しながら、スチレン176.8g(1.7モル)を3時間かけて滴下し反応させた。さらに、150℃にて1時間反応後、スチレン変性多価ヒドロキシ樹脂282gを得た。その水酸基当量は268g/eq.、軟化点は78℃、150℃での溶融粘度は0.23Pa・sであった。
合成例4
四つ口セパラブルフラスコに合成例1で得たStPN150g、エピクロルヒドリン468g、ジエチレングリコールジメチルエーテル70gを入れ撹拌溶解させた。均一に溶解後、130mmHgの減圧下65℃に保ち、48%水酸化ナトリウム水溶液70.3gを4時間かけて滴下し、この滴下中に還流留出した水とエピクロルヒドリンを分離槽で分離しエピクロルヒドリンは反応容器に戻し、水は系外に除いて反応した。反応終了後、濾過により生成した塩を除き、更に水洗したのちエピクロルヒドリンを留去し、エポキシ樹脂185gを得た(StPNE−A)。得られた樹脂のエポキシ当量は246g/eq.、軟化点は56℃、150℃における溶融粘度は0.10Pa・s、ガードナー色数は0.3であった。
四つ口セパラブルフラスコに合成例2で得たStPN150g、エピクロルヒドリン612g、ジエチレングリコールジメチルエーテル92gを入れ撹拌溶解させた。均一に溶解後、130mmHgの減圧下65℃に保ち、48%水酸化ナトリウム水溶液91.9gを4時間かけて滴下し、この滴下中に還流留出した水とエピクロルヒドリンを分離槽で分離しエピクロルヒドリンは反応容器に戻し、水は系外に除いて反応した。反応終了後、濾過により生成した塩を除き、更に水洗したのちエピクロルヒドリンを留去し、エポキシ樹脂180gを得た(StPNE−B)。得られた樹脂のエポキシ当量は204g/eq.、150℃における溶融粘度は0.08Pa・s、ガードナー色数は0.5であった。
四つ口セパラブルフラスコに合成例3で得たStPN150g、エピクロルヒドリン295g、ジエチレングリコールジメチルエーテル44gを入れ撹拌溶解させた。均一に溶解後、130mmHgの減圧下65℃に保ち、48%水酸化ナトリウム水溶液44.3gを4時間かけて滴下し、この滴下中に還流留出した水とエピクロルヒドリンを分離槽で分離しエピクロルヒドリンは反応容器に戻し、水は系外に除いて反応した。反応終了後、濾過により生成した塩を除き、更に水洗したのちエピクロルヒドリンを留去し、エポキシ樹脂153gを得た(StPNE−C)。得られた樹脂のエポキシ当量は350g/eq.、軟化点は63℃、150℃における溶融粘度は0.25Pa・s、ガードナー色数は0.8であった。
上記の合成例4で得られたエポキシ樹脂(StPNE−A)、合成例5で得られたエポキシ樹脂(StPNE−B)、合成例6で得られたエポキシ樹脂(StPNE−C)、下記に示すエポキシ樹脂、硬化剤、及び硬化促進剤を表1に示す配合割合で混練してエポキシ樹脂組成物を調製した。表中の数値は配合における重量部を示す。
また、比較のエポキシ樹脂として、エポキシ樹脂A:フェノールノボラック型エポキシ樹脂(YDPN‐638、新日鐵化学製、エポキシ当量178g/eq.、ガードナー色数0.5)を用いた。エポキシ樹脂B:o-クレゾールノボラック型エポキシ樹脂(YDPN−700−3、新日鐵化学製、エポキシ当量200g/eq.、ガードナー色数0.7)を用いた。
硬化剤成分として、メチルヘキサヒドロ無水フタル酸とヘキサヒドロ無水フタル酸の混合物(MH−700;新日本理化製)を用いた。
硬化促進剤成分として、テトラブチルホスホニウムジエチルホスホジチオネート(ヒシコーリンPX−4ET,日本化学工業株式会社製)を用いた。
電位差滴定装置を用い、溶媒としてメチルエチルケトンを使用し、臭素化テトラエチルアンモニウム酢酸溶液を加え、電位差滴定装置にて0.1mol/L過塩素酸−酢酸溶液を用いて測定した。
自動軟化点装置(明峰社製作所(株)製、ASP−M4SP)を用い、JIS−K−2207に従い環球法にて測定した。
BROOKFIELD製、CAP2000H型回転粘度計を用いて、150℃にて測定した。
エポキシ樹脂固形分40%のブチルカルビトール溶液の色相をJIS K 6901に準じたガードナー色数標準溶液と比較して色相を測定した。
日立製作所製自記分光光度計U−3410を用いて、厚さ1mm硬化物の400nmの透過度を測定した。
1mm厚の硬化物を150℃の環境下に曝し、72時間後の400nmの透過度を初期透過度と同様に測定した。
熱機械分析装置(エスアイアイ・ナノテクノロジー株式会社製 EXSTAR6000 TMA/SS120U)により、昇温速度10℃/分の条件で、Tgを求めた。
動的粘弾性測定装置(エスアイアイ・ナノテクノロジー株式会社製 EXSTAR6000 DMS/6100)により、昇温速度10℃/分の条件で、貯蔵弾性率を求めた。すなわち、この貯蔵弾性率はtanδにより求められるガラス転移温度より50℃高い温度での測定値となる。
Claims (3)
- 請求項1に記載の光半導体素子封止用エポキシ樹脂組成物を硬化してなるエポキシ樹脂硬化物。
- 請求項1に記載の光半導体素子封止用エポキシ樹脂組成物を用いて光半導体素子を樹脂封止してなる光半導体装置。
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