JP2013149966A - 回路接続材料、接続体、及び接続体を製造する方法 - Google Patents
回路接続材料、接続体、及び接続体を製造する方法 Download PDFInfo
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- JP2013149966A JP2013149966A JP2012277028A JP2012277028A JP2013149966A JP 2013149966 A JP2013149966 A JP 2013149966A JP 2012277028 A JP2012277028 A JP 2012277028A JP 2012277028 A JP2012277028 A JP 2012277028A JP 2013149966 A JP2013149966 A JP 2013149966A
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- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
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- H—ELECTRICITY
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- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
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Abstract
【解決手段】絶縁性接着剤と、該絶縁性接着剤中に分散した導電性粒子5と、を含有し、第一の基板及び該第一の基板上に設けられた第一の接続端子3を有する第一の回路部材と、第二の基板10及び該第二の基板上に設けられた第二の接続端子1を有する第二の回路部材とを、電気的に接続するとともに接着するために用いられる回路接続材料。第一の基板及び/又は第二の基板が、熱可塑性樹脂を含むフレキシブル基板であり、導電性粒子が、プラスチック粒子及び該プラスチック粒子を被覆する金属層を有し、導電性粒子をその直径の20%圧縮変位したときのK値が0.20〜3.2GPaである。
【選択図】図1
Description
ラジカル重合性物質であるウレタンアクリレート(製品名:UA−5500T、新中村化学工業社製)20質量部、ビス(アクリロキシエチル)イソシアヌレート(製品名:M−215、東亞合成社製)15質量部、ジメチロールトリシクロデカンジアクリレート(製品名:DCP−A、共栄社化学社製)5質量部及び2−メタクリロイロキシエチルアッシドフォスヘート(製品名:P−2M、共栄社化学社製)1質量部と、ベンゾイルパーオキサイド(製品名:ナイパーBMT−K、日本油脂製)8質量部と、ポリエステルウレタン樹脂(製品名:UR4800、東洋紡績社製)をトルエン/メチルエチルケトン=50/50の混合溶剤に溶解して得た40質量%のポリエステルウレタン樹脂溶液60質量部とを混合し、攪拌して、バインダ樹脂(絶縁性接着剤)の溶液を得た。このバインダ樹脂の溶液に、核としてのポリスチレン粒子と、ポリスチレン粒子の表面を覆って内側から順に設けられた厚み0.2μmのニッケル層及び厚み0.04μmの金層とを有する平均粒径3μmの導電性粒子を、絶縁性接着剤に対して10体積%の割合で分散させた。導電性粒子の20%圧縮変形時のK値(K20)は0.74GPa(75kgf/mm2)、40%圧縮変形時のK値(K40)は0.66GPa(67kgf/mm2)、圧縮回復率は30%であった。更に、平均粒径2μmのシリコーン微粒子(製品名:KMP-605、信越化学社製)を、バインダ樹脂100質量部に対して20質量部の割合で分散させて、バインダ樹脂、導電性粒子及びシリコーン微粒子を含む回路接続材料の塗工液を得た。この塗工液を、片面を表面処理したポリエチレンテレフタラート(PET)フィルム(厚み50μm)に、塗工装置を用いて塗布し、塗膜を70℃の熱風により乾燥して、回路接続材料としての異方導電性接着剤フィルム(厚み20μm)を形成させた。導電性粒子のK値は、一辺50μmの正方形の底面を有する角柱状のダイアモンド製平面圧子を用い、最大試験荷重50mN、圧縮速度0.33mN/秒で圧縮試験を行うことにより、測定した。
ビスフェノールF型フェノキシ樹脂100gを、質量比50:50のトルエンと酢酸エチルとの混合溶剤に溶解させて、濃度60質量%のビスフェノールF型フェノキシ樹脂溶液を得た。また、ビスフェノールA・F共重合型フェノキシ樹脂50gを、質量比50:50のトルエンと酢酸エチルとの混合溶剤に溶解させて、濃度45質量%のビスフェノールA・F共重合型フェノキシ樹脂溶液を得た。
核としてのポリスチレン粒子と、ポリスチレン粒子の表面を覆って内側から順に設けられた厚み0.2μmのニッケル層及び厚み0.04μmの金層とを有する平均粒径3μmの導電性粒子を準備した。この導電性粒子の20%圧縮変形時のK値は3.43GPa(350kgf/mm2)、40%圧縮変形時のK値は4.02GPa(410kgf/mm2)、圧縮回復率は40%であった。この導電性粒子を用いたこと以外は実施例1と同様にして、異方導電性接着剤フィルムを作製し、これを用いてフレキシブル基材とICチップとの接続体を作製した。
核としてのポリスチレン粒子と、ポリスチレン粒子の表面を覆って内側から順に設けられた厚み0.2μmのニッケル層及び厚み0.04μmの金層とを有する平均粒径3μmの導電性粒子を準備した。この導電性粒子の20%変形時のK値は350kgf/mm2、40%変形時のK値は410kgf/mm2、回復率は40%であった。この導電性粒子を用いたこと以外は実施例2と同様にして、異方導電性接着剤フィルムを作製し、これを用いてフレキシブル基材とICチップとの接続体を作製した。
実施例1で作製した異方導電性接着剤フィルムを、ガラス板(厚さ0.5mm、OA−10)及びガラス板上に形成されたアルミニウムのスパッタ膜電極(厚さ2500Å)を有するガラス基材と、12μm×100μmのバンプを有するICチップとの間に挟み、異方導電性接着剤フィルムの到達温度が160℃となるように加熱しながら、総接続面積当たり100MPaの圧力で5秒間全体を加圧して、ガラス基材とICチップとを接続した接続体を得た。
実施例2で作製した異方導電性接着剤フィルムを用いたことの他は参考例1と同様にして、ガラス基材とICチップとの接続体を作製し、その断面を観察した。導電性粒子と接触している部分の電極の変形量は0.1μm以下であり、回路の破断は観察されなかった。導電性粒子により形成される電極の圧痕は観察できなかった。
比較例1で作製した異方導電性接着剤フィルムを用いたことの他は参考例1と同様にして、ガラス基材とICチップとの接続体を作製し、その断面を観察した図2の(b)は、参考例3の接続体の接続部分を模式的に示す断面図である。導電性粒子5と接触している部分の接続端子(電極)1の変形量は0.1μm以下であり、回路の破断は観察されなかった。導電性粒子5により形成される電極の圧痕が観察された。
比較例2で作製した異方導電性接着剤フィルムを用いたことの他は参考例1と同様にして、ガラス基材とICチップとの接続体を作製し、その断面を観察した。導電性粒子と接触している部分の電極の変形量は0.1μm以下であり、回路の破断は観察されなかった。導電性粒子により形成される電極の圧痕が観察された。
Claims (8)
- 絶縁性接着剤と、該絶縁性接着剤中に分散した導電性粒子と、を含有し、第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材とを、電気的に接続するとともに接着するために用いられる回路接続材料であって、
前記第一の基板及び/又は前記第二の基板が、熱可塑性樹脂を含むフレキシブル基板であり、
前記導電性粒子が、プラスチック粒子及び該プラスチック粒子を被覆する金属層を有し、前記導電性粒子をその直径の20%圧縮変位したときの圧縮硬さK値が0.20〜3.2GPaである、
回路接続材料。 - 前記第一の基板がICチップ又は前記フレキシブル基板であり、
前記第二の基板が、ポリイミド、ポリエチレンテレフタレート、ポリカーボネート及びポリエチレンナフタレートからなる群より選ばれる少なくとも1種の熱可塑性樹脂を含む前記フレキシブル基板である、
請求項1に記載の回路接続材料。 - 前記導電性粒子をその直径の40%圧縮変位したときの圧縮硬さK値が0.29〜3.4GPaである、請求項1又は2に記載の回路接続材料。
- 前記導電性粒子の圧縮回復率が1〜90%である、請求項1〜3のいずれか一項に記載の回路接続材料。
- 前記導電性粒子が、前記金属層の外側に設けられた絶縁性樹脂層を更に有する、請求項1〜4のいずれか一項に記載の回路接続材料。
- 170℃以下で10秒間加熱された後の40℃における周波数10Hzの貯蔵弾性率E’が0.5〜2.5GPaである、請求項1〜5のいずれか一項に記載の回路接続材料。
- 第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、
前記第一の回路部材と対向して配置され、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材と、
前記第一の回路部材と前記第二の回路部材との間に設けられ、前記第一の回路部材と前記第二の回路部材とを電気的に接続するとともに接着する接着層と、
を備え、
前記第一の基板及び/又は前記第二の基板が、熱可塑性樹脂を含むフレキシブル基板であり、
前記接着層が、請求項1〜6のいずれか一項に記載の回路接続材料から形成された層である、接続体。 - 第一の基板及び該第一の基板上に設けられた第一の接続端子を有する第一の回路部材と、前記第一の回路部材と対向して配置され、第二の基板及び該第二の基板上に設けられた第二の接続端子を有する第二の回路部材との間に回路接続材料を配置し、その状態で全体を加熱及び加圧して、前記回路接続材料から形成された接着層により前記第一の回路部材と前記第二の回路部材とを電気的に接続するとともに接着する工程を備え、
前記第一の基板及び/又は前記第二の基板が、熱可塑性樹脂を含むフレキシブル基板であり、
前記回路接続材料が、請求項1〜6のいずれか一項に記載の回路接続材料である、回路部材が接続された接続体を製造する方法。
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