TWI629691B - 電路連接材料、連接體以及製造連接體的方法 - Google Patents

電路連接材料、連接體以及製造連接體的方法 Download PDF

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Publication number
TWI629691B
TWI629691B TW101149145A TW101149145A TWI629691B TW I629691 B TWI629691 B TW I629691B TW 101149145 A TW101149145 A TW 101149145A TW 101149145 A TW101149145 A TW 101149145A TW I629691 B TWI629691 B TW I629691B
Authority
TW
Taiwan
Prior art keywords
substrate
circuit
circuit member
conductive particles
connecting material
Prior art date
Application number
TW101149145A
Other languages
English (en)
Chinese (zh)
Other versions
TW201330008A (zh
Inventor
篠原研吾
小口美佐夫
後藤泰史
藤縄貢
松田和也
立澤貴
Original Assignee
日商日立化成股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商日立化成股份有限公司 filed Critical 日商日立化成股份有限公司
Publication of TW201330008A publication Critical patent/TW201330008A/zh
Application granted granted Critical
Publication of TWI629691B publication Critical patent/TWI629691B/zh

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
TW101149145A 2011-12-21 2012-12-21 電路連接材料、連接體以及製造連接體的方法 TWI629691B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011279887 2011-12-21
JP2011-279887 2011-12-21

Publications (2)

Publication Number Publication Date
TW201330008A TW201330008A (zh) 2013-07-16
TWI629691B true TWI629691B (zh) 2018-07-11

Family

ID=48637591

Family Applications (1)

Application Number Title Priority Date Filing Date
TW101149145A TWI629691B (zh) 2011-12-21 2012-12-21 電路連接材料、連接體以及製造連接體的方法

Country Status (4)

Country Link
JP (1) JP5737278B2 (ja)
KR (1) KR102036230B1 (ja)
CN (2) CN103177795A (ja)
TW (1) TWI629691B (ja)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014088095A1 (ja) * 2012-12-06 2014-06-12 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2015179732A (ja) * 2014-03-19 2015-10-08 デクセリアルズ株式会社 異方性導電接着剤
WO2015141830A1 (ja) * 2014-03-20 2015-09-24 デクセリアルズ株式会社 異方性導電フィルム及びその製造方法
KR102410173B1 (ko) * 2014-05-14 2022-06-20 세키스이가가쿠 고교가부시키가이샤 도전 페이스트, 도전 페이스트의 제조 방법, 접속 구조체 및 접속 구조체의 제조 방법
KR102545861B1 (ko) * 2014-10-29 2023-06-21 데쿠세리아루즈 가부시키가이샤 도전 재료
KR101929951B1 (ko) * 2015-01-13 2018-12-18 데쿠세리아루즈 가부시키가이샤 이방 도전성 필름
JP6579309B2 (ja) * 2015-05-01 2019-09-25 味の素株式会社 硬化性組成物
CN107534231B (zh) 2015-05-27 2020-04-14 迪睿合株式会社 各向异性导电性膜及连接构造体
JP2017183239A (ja) * 2016-03-31 2017-10-05 デクセリアルズ株式会社 異方性導電接続構造体
JP6735652B2 (ja) * 2016-10-21 2020-08-05 デクセリアルズ株式会社 半導体装置の製造方法
JP7198220B2 (ja) * 2017-11-30 2022-12-28 株式会社半導体エネルギー研究所 表示パネル
JP2019179647A (ja) * 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
CN115298231A (zh) * 2020-03-26 2022-11-04 积水化学工业株式会社 树脂粒子、导电性粒子、导电材料和连接结构体

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体

Family Cites Families (10)

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Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
WO2006109556A1 (ja) * 2005-03-31 2006-10-19 Nisshinbo Industries, Inc. 球状ポリマー微粒子およびその製造方法
EP2386035A4 (en) * 2009-01-09 2012-05-02 Int Marketing Inc COMPOSITION FOR THE CORRECTION OF TIRE WHEEL MATERIALS, POWER VARIATIONS AND VIBRATIONS
JP4640531B2 (ja) * 2009-07-02 2011-03-02 日立化成工業株式会社 導電粒子
JP2012174358A (ja) * 2011-02-17 2012-09-10 Sekisui Chem Co Ltd 接続構造体及び接続構造体の製造方法
JP2012209097A (ja) * 2011-03-29 2012-10-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体

Also Published As

Publication number Publication date
KR20130072156A (ko) 2013-07-01
CN103177795A (zh) 2013-06-26
JP5737278B2 (ja) 2015-06-17
KR102036230B1 (ko) 2019-10-24
CN109949968A (zh) 2019-06-28
CN109949968B (zh) 2021-09-21
TW201330008A (zh) 2013-07-16
JP2013149966A (ja) 2013-08-01

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