CN103177795A - 电路连接材料、连接体、以及制造连接体的方法 - Google Patents

电路连接材料、连接体、以及制造连接体的方法 Download PDF

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Publication number
CN103177795A
CN103177795A CN2012105642335A CN201210564233A CN103177795A CN 103177795 A CN103177795 A CN 103177795A CN 2012105642335 A CN2012105642335 A CN 2012105642335A CN 201210564233 A CN201210564233 A CN 201210564233A CN 103177795 A CN103177795 A CN 103177795A
Authority
CN
China
Prior art keywords
substrate
electroconductive particle
circuit
connection material
circuit connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN2012105642335A
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English (en)
Chinese (zh)
Inventor
筱原研吾
小口美佐夫
后藤泰史
藤绳贡
松田和也
立泽贵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co ltd
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201910266817.6A priority Critical patent/CN109949968B/zh
Publication of CN103177795A publication Critical patent/CN103177795A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Combinations Of Printed Boards (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Non-Insulated Conductors (AREA)
CN2012105642335A 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法 Pending CN103177795A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201910266817.6A CN109949968B (zh) 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011279887 2011-12-21
JP2011-279887 2011-12-21

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201910266817.6A Division CN109949968B (zh) 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法

Publications (1)

Publication Number Publication Date
CN103177795A true CN103177795A (zh) 2013-06-26

Family

ID=48637591

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910266817.6A Active CN109949968B (zh) 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法
CN2012105642335A Pending CN103177795A (zh) 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN201910266817.6A Active CN109949968B (zh) 2011-12-21 2012-12-21 电路连接材料、连接体、以及制造连接体的方法

Country Status (4)

Country Link
JP (1) JP5737278B2 (ja)
KR (1) KR102036230B1 (ja)
CN (2) CN109949968B (ja)
TW (1) TWI629691B (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106085169A (zh) * 2015-05-01 2016-11-09 味之素株式会社 固化性组合物
CN107112067A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 各向异性导电性膜
CN112863732A (zh) * 2014-10-29 2021-05-28 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6364191B2 (ja) * 2012-12-06 2018-07-25 積水化学工業株式会社 導電材料、接続構造体及び接続構造体の製造方法
JP2015179732A (ja) * 2014-03-19 2015-10-08 デクセリアルズ株式会社 異方性導電接着剤
CN106104930A (zh) * 2014-03-20 2016-11-09 迪睿合株式会社 各向异性导电膜及其制备方法
WO2015174299A1 (ja) * 2014-05-14 2015-11-19 積水化学工業株式会社 導電ペースト、導電ペーストの製造方法、接続構造体及び接続構造体の製造方法
TWI711222B (zh) 2015-05-27 2020-11-21 日商迪睿合股份有限公司 異向導電性膜、連接構造體及連接構造體之製造方法
JP2017183239A (ja) * 2016-03-31 2017-10-05 デクセリアルズ株式会社 異方性導電接続構造体
JP6735652B2 (ja) * 2016-10-21 2020-08-05 デクセリアルズ株式会社 半導体装置の製造方法
KR102660793B1 (ko) * 2017-11-30 2024-04-26 가부시키가이샤 한도오따이 에네루기 켄큐쇼 표시 패널, 표시 장치, 입출력 장치, 정보 처리 장치
JP2019179647A (ja) * 2018-03-30 2019-10-17 デクセリアルズ株式会社 導電材料、及び接続体の製造方法
JPWO2021193911A1 (ja) * 2020-03-26 2021-09-30

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3367076B2 (ja) 1994-10-24 2003-01-14 日立化成工業株式会社 電気部材の接続構造及び接続方法
JPH08148213A (ja) 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
JPH1150032A (ja) 1997-08-04 1999-02-23 Hitachi Chem Co Ltd 回路用接続部材及び回路板
JPH1173818A (ja) * 1997-08-28 1999-03-16 Ricoh Co Ltd 導電性粒子および異方導電性接着材および液晶表示装置
JP3296306B2 (ja) * 1997-10-28 2002-06-24 ソニーケミカル株式会社 異方導電性接着剤および接着用膜
CN101142239A (zh) * 2005-03-31 2008-03-12 日清纺织株式会社 球形聚合物细颗粒及其制备方法
EP2386035A4 (en) * 2009-01-09 2012-05-02 Int Marketing Inc COMPOSITION FOR THE CORRECTION OF TIRE WHEEL MATERIALS, POWER VARIATIONS AND VIBRATIONS
JP4640531B2 (ja) * 2009-07-02 2011-03-02 日立化成工業株式会社 導電粒子
JP2012174358A (ja) * 2011-02-17 2012-09-10 Sekisui Chem Co Ltd 接続構造体及び接続構造体の製造方法
JP2012209097A (ja) * 2011-03-29 2012-10-25 Sekisui Chem Co Ltd 異方性導電材料及び接続構造体

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20010046021A1 (en) * 1997-08-28 2001-11-29 Takeshi Kozuka A conductive particle to conductively bond conductive members to each other, an anisotropic adhesive containing the conductive particle, a liquid crystal display device using the anisotropic conductive adhesive, a method for manufacturing the liquid crystal display device
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
JP2011105861A (ja) * 2009-11-18 2011-06-02 Hitachi Chem Co Ltd 回路接続材料及び接続構造体

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112863732A (zh) * 2014-10-29 2021-05-28 迪睿合株式会社 连接结构体的制造方法、连接结构体以及导电材料
CN107112067A (zh) * 2015-01-13 2017-08-29 迪睿合株式会社 各向异性导电性膜
CN107112067B (zh) * 2015-01-13 2019-04-16 迪睿合株式会社 各向异性导电性膜
CN110265174A (zh) * 2015-01-13 2019-09-20 迪睿合株式会社 各向异性导电性膜
TWI694128B (zh) * 2015-01-13 2020-05-21 日商迪睿合股份有限公司 異向導電性膜
CN110265174B (zh) * 2015-01-13 2022-06-28 迪睿合株式会社 各向异性导电性膜
TWI787601B (zh) * 2015-01-13 2022-12-21 日商迪睿合股份有限公司 異向導電性膜
US11591499B2 (en) 2015-01-13 2023-02-28 Dexerials Corporation Anisotropic conductive film
CN106085169A (zh) * 2015-05-01 2016-11-09 味之素株式会社 固化性组合物

Also Published As

Publication number Publication date
CN109949968B (zh) 2021-09-21
JP2013149966A (ja) 2013-08-01
KR20130072156A (ko) 2013-07-01
JP5737278B2 (ja) 2015-06-17
KR102036230B1 (ko) 2019-10-24
TW201330008A (zh) 2013-07-16
TWI629691B (zh) 2018-07-11
CN109949968A (zh) 2019-06-28

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Application publication date: 20130626