CN103177795A - Circuit connecting material, connector and method of manufacturing the connector - Google Patents
Circuit connecting material, connector and method of manufacturing the connector Download PDFInfo
- Publication number
- CN103177795A CN103177795A CN2012105642335A CN201210564233A CN103177795A CN 103177795 A CN103177795 A CN 103177795A CN 2012105642335 A CN2012105642335 A CN 2012105642335A CN 201210564233 A CN201210564233 A CN 201210564233A CN 103177795 A CN103177795 A CN 103177795A
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- substrate
- electroconductive particle
- circuit
- connection material
- circuit connection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0212—Resin particles
Abstract
The invention provides a circuit connecting material, a connector and a method of manufacturing the connector. The circuit connecting material contains an insulation adhesive and conductive particles dispersed in the insulation adhesive and is used for electrically connecting and adhering a first circuit component possessing a first substrate and a first connecting terminal arranged on the first substrate with a second circuit component possessing a second substrate and a second connecting terminal arranged on the second substrate. The first substrate and/ or the second substrate is a flexible substrate containing thermoplastic resin; the conductive particles contain plastic particles and metal layers covering the plastic particles; the compression hardness K value in performing diameter 20% compression movement on the conductive particle.
Description
Technical field
The method that the present invention relates to circuit connection material, connector and make connector.
Background technology
In recent years, carry out miniaturization, slimming and the high performance of electronic unit, accompany therewith, the exploitation of economic high-density installation technology is carried out actively.Be connected to tackle being connected of electronic unit and fine circuits electrode with elastomer connector by existing scolder.Therefore, often use the method for attachment of the anisotropic conductive adhesive and the film thereof that utilize the resolution excellence.for example, at the glass with liquid crystal display (Liquid Cristal Display), TAB(belt automatic welding, Tape Automated Bonding) and the FPC(flexible printed circuit board, Flexible Print Circuit) when such circuit block connects, be clipped between the electrode of subtend by the anisotropic conductive adhesive film that will contain electroconductive particle and heat and pressurize, can keep adjacent electrode insulating properties each other on same substrate on one side, electrode with two substrates is electrically connected to each other on one side, and electronic unit and the circuit block that will have micro-electrode are adhesively fixed.
For the lightweight of module and the requirement of slimming, as the substrate of the display modules such as liquid crystal indicator and Electronic Paper, carry out replacing with flexible base, boards such as plastic bases the research of existing glass substrate.
Patent documentation 1: Japanese kokai publication hei 08-148213 communique
Patent documentation 2: Japanese kokai publication hei 08-124613 communique
Patent documentation 3: Japanese kokai publication hei 11-50032 communique
Summary of the invention
Flexible circuit board usually has the flexible base, board that comprises thermoplastic resin and is formed at electrode on flexible base, board.The electrode of flexible circuit board is mainly the film of metal etc.
In order to carry out the connection of fine circuit, in most cases use and contain the anisotropic conductive adhesive of electroconductive particle as circuit connection material.But, if use existing circuit connection material, because heating and pressurization for the circuit connection exist the electrode on flexible base, board easily rupture or easily crack such problem.
Therefore, main purpose of the present invention is, in the situation that connect the circuit block with flexible base, board by the circuit connection material that contains electroconductive particle, fully prevents the electrode damage on flexible base, board.
The present invention relates to a kind of circuit connection material that contains the insulating properties bonding agent and be scattered in the electroconductive particle in this insulating properties bonding agent.Circuit connection material of the present invention is used for the first circuit block will have first substrate and to be arranged at the first splicing ear on this first substrate and is electrically connected to also bonding with the second circuit parts that have second substrate and be arranged at the second splicing ear on this second substrate.First substrate and/or second substrate are the flexible base, boards that comprises thermoplastic resin.Electroconductive particle has the metal level (coating) of plastic pellet and this plastic pellet of coating.Compressive hardness K value when electroconductive particle is carried out the compression displacement of its diameter 20% is for example 0.20 ~ 3.2GPa.
Connecting material in a circuit according to the invention can obtain the connector that circuit block is electrically connected to each other in the electrode damage on preventing flexible base, board.
First substrate can be IC chip or flexible base, board, and second substrate can be the flexible base, board that comprises at least a thermoplastic resin of selecting from the group that is comprised of polyimides, PETG, Merlon and PEN.
Compressive hardness K value when electroconductive particle is carried out the compression displacement of its diameter 40% can be 0.29 ~ 3.4GPa.
The compressive recovery rate of electroconductive particle can be 1 ~ 90%.
Electroconductive particle can further have the insulative resin layer that is arranged at the metal level outside.
After heating 10 seconds below 170 ℃, the storage modulus E ' of the frequency 10Hz of circuit connection material can be 0.5 ~ 2.5GPa in the time of 40 ℃.
On the other hand, the present invention relates to a kind of connector, it possesses: have first substrate and the first circuit block that is arranged at the first splicing ear on this first substrate; With the first circuit block subtend configuration and have second substrate and be arranged at the second circuit parts of the second splicing ear on this second substrate; And be arranged between the first circuit block and second circuit parts, with the first circuit block with the second circuit parts are electrically connected to and bonding adhesive linkage.
and then, on the other hand, the present invention relates to a kind of method that manufacturing is connected with the connector of circuit block, it possesses following operation: circuit connection material is configured in the first circuit block that has first substrate and be arranged at the first splicing ear on this first substrate, and and the first circuit block subtend configures and has second substrate and be arranged between the second circuit parts of the second splicing ear on this second substrate, and under this state, integral body heated and pressurize, thereby be electrically connected to the first circuit block and second circuit parts also bonding by the adhesive linkage that is formed by circuit connection material.
Above-mentioned first substrate and/or second substrate are the flexible base, boards that comprises thermoplastic resin.Above-mentioned adhesive linkage is the layer that is formed by circuit connection material of the present invention.
Description of drawings
Fig. 1 is the cutaway view of coupling part that schematically shows the connector of embodiment and comparative example.
Fig. 2 is the cutaway view of coupling part that schematically shows the connector of reference example.
Embodiment
Below, the preferred embodiment of the present invention is elaborated.But, the invention is not restricted to following execution mode.Whole formations that this specification is put down in writing can be in the scope that does not break away from purport of the present invention combination in any.For example, optional numerical value in the numerical value of putting down in writing in the higher limit of the number range put down in writing and lower limit and embodiment as higher limit or lower limit, can be stipulated the number range relevant to various characteristics from this specification.
The circuit connection material of present embodiment is the composition that contains insulating properties bonding agent and electroconductive particle.
The insulating properties bonding agent can be the thermoplastic for insulating trip etc., can be also the curable resin that is cured by heat or light.Thermal endurance after connect and the aspect of excellent moisture resistance consider, can be with curable resin as the insulating properties bonding agent.Wherein, but epoxy is bonding agent has that good work is solidified, connected to the short time and the feature such as excellent in adhesion on molecular structure.
Epoxy is that bonding agent for example mainly contains, the epoxy resin such as macromolecule epoxy resin, solid epoxy resin and liquid epoxy resin.Epoxy is that bonding agent can also at random contain the resins such as phenoxy resin, polyurethane, polyester, NBR and rubber, the various modifier such as curing agent and coupling agent, and the additive such as catalyst.
Epoxy resin can be the bisphenol-type epoxy resin derived from epoxychloropropane and bisphenol-A, F, AD etc., epoxy-Novolak resin derived from epoxychloropropane and phenol novolac resin or cresols novolac resin, wrapping naphthalene-ring containing naphthalene is epoxy resin, has the various epoxy compoundss of 2 above glycidyls in 1 molecules such as glycidyl amine, ethylene oxidic ester, biphenyl type epoxy resin and alicyclic epoxy resin.The two or more uses alone or in combination of these epoxy resin.For epoxy resin, in order to prevent electromigration, be preferably foreign ion (Na
+, C1
-Deng) and the concentration of water-disintegrable chlorine etc. be reduced to the following high sterling of 300ppm.
Curing agent for example can be, imidazoles system, hydrazides system, boron trifluoride-amine complex, sulfonium salt, aminimide (aminimide), diaminomaleonitrile, melamine and derivative thereof, and polyamine salt or dicyandiamide can be also their modifiers.The two or more uses alone or in combination of these curing agent.These curing agent are catalytic curing agents of anion or cationically polymerizable, easily obtain rapidly-curable.In addition, in the situation of these curing agent, consider that stoichiometric necessity is little.As curing agent, can also enumerate the polyaddition type curing agent such as polyamines class, polythiol, polyphenol, acid anhydrides in addition.Also may be used polyaddition type curing agent and catalytic curing agent.
The insulating properties bonding agent that contains secondary amine class, imidazoles or their two sides and epoxy resin as the catalytic curing agent of anionic polymerization type, heating under the moderate temperature of 160 ℃ ~ 200 ℃ of left and right through about tens of second ~ a few hours and solidifying, therefore, up duration (term of validity) is long.As the catalytic curing agent of cationic polymerization type, mainly can use by energy line and shine the photonasty salt that makes resin solidification, such as aromatic series diazol and aromatic series sulfonium salt etc.As activate the catalytic curing agent that makes epoxy resin cure by heat, aliphat sulfonium salt etc. is arranged.This curing agent has the such feature of rapidly-curable.
With these curing agent with polymer substances such as polyurethane series, polyester systems, the metallic film of Ni, Cu etc., or the inorganic matter coating such as calcium silicates and the curing agent of the microencapsulation that obtains, up duration can extend.
The insulating properties bonding agent can also contain such as the composition that appends of selecting from curing agent such as filler, softening agent, promoter, age resistor, colouring agent, fire retardant, dielectric material, thixotropic agent, coupling agent, phenolic resins, melmac and isocyanates.
From operability aspect consideration, circuit connection material can be membranaceous.As the filmogen that circuit connection material can contain, can enumerate epoxy resin, acrylic resin, polyurethane and rubber etc.As circuit connection material, in order to obtain high reliability, can use phenoxy resin.It is high molecular expoxy resin more than 10000 that phenoxy resin is equivalent to by the weight average molecular weight that high performance liquid chromatography (HLC) is tried to achieve.For phenoxy resin, same with epoxy resin, the kinds such as bisphenol A-type, AD type and AF type are arranged.Phenoxy resin is due to similar with epoxy resin structural, so intermiscibility is good, and cementability is also good.The molecular weight of filmogen is larger, more easily obtains film forming, and can set the melt viscosity that affects the mobility when connecting in wide region.Consider from melt viscosity and with the aspects such as intermiscibility of other resins, weight average molecular weight can be 10000 ~ 80000 or 20000 ~ 60000., improve with the intermiscibility of epoxy resin by having hydroxyl and carboxyl isopolarity group etc. as the resin of filmogen, the film that can obtain to have uniform outward appearance, characteristic, and then the reaction that also can obtain when solidifying promotes the short time that brings to solidify.The amount of filmogen is considered from the aspect that film forming, curing reaction promote, can be 20 ~ 80 quality % with respect to insulating properties bonding agent integral body.For purposes such as melt viscosity adjustment, also suitably benzene mixed vinylite and acrylic resin etc.
Filmogen for example can be, at least a resin of selecting from the group that is comprised of polystyrene, polyethylene, polyvinyl butyral resin, polyvinyl formal, polyimides, polyamide, polyester, polyvinyl chloride, polyphenylene oxide, carbamide resin, melmac, phenolic resins, xylene resin, epoxy resin, polyisocyanate resin, phenoxy resin, polyimide resin and polyester polyurethane resin.By having the resin of the functional groups such as hydroxyl, can further improve cementability.In addition, these resins (macromolecule) also can carry out modification by free-radical polymerised functional group.
The insulating properties bonding agent can contain curing agent and the free-radical polymerised material that produces free free radical by heating or light.
Produce the curing agent (following also referred to as " free free radical generating agent ") of free free radical by heating or light, decompose and produce the free radical that dissociates by heating.Free free radical generating agent is for example peroxide compound or azo based compound.Free free radical generating agent can connect temperature, connect hours, the term of validity etc. according to target and carry out suitable selected.Consider from the aspect of high response and the term of validity, free free radical generating agent can be that the temperature of 10 hours half-life is more than 40 ℃ and the temperature of 1 minute half-life is organic peroxide below 180 ℃.In this case, producing the use level of the curing agent of free free radical by heating or light, take the quality of insulating properties bonding agent as benchmark, can be 0.05 ~ 10 quality % left and right or 0.1 ~ 5 quality %.
Producing the curing agent of free free radical by heating or light, can be for example at least a compound of selecting from diacyl peroxide, peroxy dicarbonate, peroxyester, peroxy ketal, dialkyl peroxide and hydrogen peroxide.For the corrosion of the splicing ear that suppresses circuit block, can use the free free radical generating agent of selecting from peroxyester, dialkyl peroxide and hydrogen peroxide.Can also use the peroxyester that can obtain high response.
As diacyl peroxide; for example; can enumerate isobutyl peroxide, 2; 4-dichloro-benzoyl peroxide, 3; 5,5-trimethyl acetyl peroxide, decoyl peroxide, lauroyl peroxide, stearoyl peroxide, succinyl peroxide, benzoyl peroxidating toluene and benzoyl peroxide.
As peroxy dicarbonate, for example, can enumerate diη-propyl peroxy dicarbonate, diisopropyl peroxydicarbonate, two (4-tert-butylcyclohexyl) peroxy dicarbonate, two-2-ethyoxyl methoxy base peroxy dicarbonate, two (peroxidating of 2-ethylhexyl) two carbonic esters, dimethoxy butyl peroxyization two carbonic esters and two (3-methyl-3-methoxyl group butyl peroxy) two carbonic esters.
as peroxyester, for example, can enumerate the cumyl new decanoate ester peroxide, 1,1,3,3-tetramethyl butyl new decanoate ester peroxide, 1-cyclohexyl-1-Methylethyl new decanoate ester peroxide, uncle's hexyl new decanoate ester peroxide, t-butylperoxy pivarate, 1,1,3,3-tetramethyl butyl peroxidating-2 ethyl hexanoic acid ester, 2,5-dimethyl-2,5-two (peroxidating of 2-ethyl hexyl acyl group) hexane, 1-cyclohexyl-1-Methylethyl peroxidating-2 ethyl hexanoic acid ester, uncle's hexyl peroxidating-2 ethyl hexanoic acid ester, tert-butyl hydroperoxide-2 ethyl hexanoic acid ester, the tert-butyl hydroperoxide isobutyrate, 1,1-two (tert-butyl hydroperoxide) cyclohexane, uncle's hexyl peroxidating isopropyl monocarbonate, tert-butyl hydroperoxide-3,5,5-tri-methyl hexanoic acid ester, the tert-butyl hydroperoxide laurate, 2,5-dimethyl-2,5-two (peroxidating of toluoyl base) hexane, tert-butyl hydroperoxide isopropyl monocarbonate, tert-butyl hydroperoxide-2-ethylhexyl monocarbonate, with uncle's hexyl peroxide benzoate, the tert-butyl hydroperoxide acetic acid esters.
As peroxy ketal, for example, can enumerate 1,1-two (peroxidating of uncle's hexyl)-3,5,5-trimethyl-cyclohexane, 1,1-two (peroxidating of uncle's hexyl) cyclohexane, 1,1-two (tert-butyl hydroperoxide)-3,5,5-trimethyl-cyclohexane, 1, the 1-(tert-butyl hydroperoxide) cyclododecane and 2,2-two (tert-butyl hydroperoxide) decane.
As dialkyl peroxide, for example, can enumerate α, α '-two (tert-butyl hydroperoxide) diisopropyl benzene, dicumyl peroxide, 2,5-dimethyl-2,5-two (tert-butyl hydroperoxide) hexane and tert-butyl group cumyl peroxide.
As hydrogen peroxide, for example, can enumerate diisopropyl benzene hydrogen peroxide and cumene hydroperoxide.
These produce the curing agent of free free radical by heating or light, can be used alone or make up two or more uses.Also decomposition accelerating agent, inhibitor etc. can be made up with free free radical generating agent.
Free-radical polymerised material is the material with functional group of polymerization by free radical.Free-radical polymerised material for example can be selected from acrylate, methacrylate and maleimide compound.
as acrylate and methacrylate, for example, can enumerate urethane acrylate, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, glycol diacrylate, diethylene glycol diacrylate, triethylene glycol diacrylate, trimethylolpropane triacrylate, the tetramethylol methane tetraacrylate, 2-hydroxyl-1, 3-two propylene acyloxy propane, 2, 2-two [4-(acryloyl-oxy ylmethoxy) phenyl] propane, 2, 2-two [4-(acryloxy polyethoxy) phenyl ］ propane, the dicyclopentenyl acrylate, three ring decyl acrylate (tricyclodecanyl acrylate), two (acryloxy ethyl) isocyanuric acid ester, 6-caprolactone modification three (acryloxy ethyl) isocyanuric acid ester, with three (acryloxy ethyl) isocyanuric acid ester.
These free-radical polymerised materials can be used alone or make up two or more uses.Viscosity when the insulating properties bonding agent of present embodiment can contain at least a 25 ℃ is the free-radical polymerised material of 100000 ~ 1000000mPas.The insulating properties bonding agent can also contain the free-radical polymerised material of the viscosity (25 ℃) with 100000 ~ 500000mPas.The viscosity of free-radical polymerised material can be measured with commercially available E type viscosimeter.
By use urethane acrylate or urethane methacrylate in free-radical polymerised material, can obtain excellent especially cementability.By be used for improving stable on heating organic peroxide carry out crosslinked after, also can show separately the free-radical polymerised material and urethane acrylate or urethane methacrylate and use of the glass transition temperature (Tg) more than 100 ℃.As so free-radical polymerised material, comprise have dicyclopentenyl, three the ring decyl (tricyclodecanyl), triazine ring or their combinations compound.For obtaining better characteristic, can also use having the free-radical polymerised material of three ring decyls (tricyclodecanyl) or triazine ring.
The insulating properties bonding agent can also contain the polymerization inhibitors such as quinhydrones, methyl ether hydroquinones as required.
If it is the free-radical polymerised material with phosphate ester structure of 0.1 ~ 10 weight portion that the insulating properties bonding agent contains with respect to total amount 100 weight portions of free-radical polymerised material, the adhesive strength for the inorganic matter such as metal surface can improve.From same viewpoint, this amount can be 0.5 ~ 5 weight portion.Free-radical polymerised material with phosphate ester structure for example can be used as the reactant of phosphoric anhydride and 2-hydroxyl (methyl) acrylate and obtains.Particularly, can enumerate 2-methacryloxyethyl phosphate ester acid and 2-acryloxy ethyl phosphate ester acid.They can be used alone or make up two or more uses.
Maleimide compound for example has the dimaleoyl imino more than 2.maleimide compound for example, can be from 1-methyl-2,4-dimaleimide benzene, N, N '-metaphenylene dimaleimide, N, N '-to the phenylene dimaleimide, N, a N '-tolyl dimaleimide, N, N '-4,4-biphenylene dimaleimide, N, N '-4,4-(3,3 '-dimethyl-biphenylene) dimaleimide, N, N '-4,4-(3,3 '-dimethyl diphenylmethane) dimaleimide, N, N '-4,4-(3,3 '-diethyl diphenyl methane) dimaleimide, N, N '-4,4-diphenyl methane dimaleimide, N, N '-4,4-diphenyl propane dimaleimide, N, N '-4,4-diphenyl ether dimaleimide, N, N '-3,3 '-diphenyl sulfone dimaleimide, 2,2-two [4-(4-maleimide phenoxy group) phenyl] propane, 2,2-two [3-sec-butyl-4,8-(4-maleimide phenoxy group) phenyl] propane, 1,1-two [4-(4-maleimide phenoxy group) phenyl] decane, 4, at least a compound that 4 '-cyclohexylidene-two [1-(4-maleimide phenoxy group)-2-cyclohexyl] benzene and 2,2-two [4-(4-maleimide phenoxy group) phenyl] HFC-236fa is selected.They can be used alone or make up two or more uses.Also can and use allyl compounds such as maleimide compound and chavicol, allyl phenyl ether and benzoic acid allyl esters.
Circuit connection material also can contain packing material, softening agent, promoter, age resistor, colouring agent, fire retardant, thixotropic agent, coupling agent, phenolic resins, melmac, isocyanates etc.
If circuit connection material contains packing material, connection reliability etc. can further improve.The maximum gauge of packing material can be less than the particle diameter of electroconductive particle.The amount of packing material can be 5 ~ 60 volume %.If the amount of packing material surpasses 60 volume %, the possibility that the effect that has reliability to improve reaches capacity.
Coupling agent can be for example to have more than one the compound of group of selecting from the group that is comprised of vinyl, acryloyl group, amino, epoxy radicals and NCO.If utilize the compound with these groups, the cementability of insulating properties bonding agent can further improve.
K value (K20) when the contained electroconductive particle of circuit connection material is carried out the compression displacement of its diameter 20%, K value (K20) when in other words, making electroconductive particle compression to deformation rate be 20% (deformation rate is that displacement is with respect to the ratio of the diameter of electroconductive particle) can be 0.20 ~ 3.2GPa(20 ~ 320kgf/mm
2).K20 can be also 0.29 ~ 2.4GPa(30 ~ 240kgf/mm
2).
K value (K40) when this electroconductive particle is carried out the compression displacement of its diameter 40% can be 0.29 ~ 3.4GPa(30 ~ 350kgf/mm
2) or 0.39 ~ 1.9GPa(40 ~ 190kgf/mm
2).
Compressive hardness K value is the index of the softness of electroconductive particle.The K value of electroconductive particle can followingly be tried to achieve: use the Mini compressed testing machine, setting the testing stand temperature is 200 ℃, with the plane pressure head with the 0.33mN/ speed compression electroconductive particle of second, load-deformation curve in the time of thus, assumed load are F(kgf), displacement is S(mm), the radius (mm) of particle is that R, modulus of elasticity are E(kgf/mm
2), when Poisson's ratio is σ, according to the compression formula (F=(2 of elastic ball
1/2/ 3)) (S
3/2) (ER
1/2)/(1-σ
2)), use formula: K=E/(1-σ
2)=(3/2
1/2) F(S
-3/2) (R
-1/2) try to achieve.And then, if the setting deformation rate is X(%), the diameter of ball is D(μ m), can pass through formula: K=3000F/(D
2X
3/2) * 10
6Try to achieve the K value.Deformation rate X can pass through formula: X=(S/D) * 100 calculate.The plane pressure head of using as the K pH-value determination pH is Yi Bian can use the adamantine pressure head of prism-shaped with the foursquare bottom surface that is 50 μ m.In compression test, maximum load of the test can be set as for example 50mN.
The compressive recovery rate of electroconductive particle can be 1 ~ 90% or 10 ~ 60%.The compressive recovery rate of electroconductive particle can be measured with the Mini compressed testing machine.Compressive recovery rate can be defined as after compression test detects the contact of particle until the displacement of load that applies 5mN with respect to the ratio of the displacement after after this discharging.Testing stand temperature when response rate is measured can be set as 200 ℃.
Electroconductive particle with K value as above and compressive recovery rate for example has the formation of following illustrated execution mode.
The electroconductive particle of present embodiment has the metal level of plastic pellet and this plastic pellet of coating.Metal level there is no need the surface of whole coating plastic pellets, can the coating plastic pellet part on surface.
Metal level comprises the various metals of for example selecting from the group that is made of Ni, Ni/Au, Ni/Pd, Cu and NiB.Metal level can be also the film of making by plating, evaporation, sputter etc.Consider from the viewpoint that insulating properties improves, electroconductive particle can have in the outside of metal level the layer of the insulating properties material such as the silicon dioxide, acrylic resin of covering metal layer.
The diameter of plastic pellet is can be on average 1 ~ 15 μ m.Consider from the viewpoint of high-density installation, the diameter of plastic pellet is can be also on average 1 ~ 5 μ m.When there is the deviation of concave-convex surface in electrode, to consider from the viewpoint of more stably keeping connection status, the diameter of plastic pellet is can also be on average 2 ~ 5 μ m.
Plastic pellet for example comprises from polymethyl methacrylate and the such acrylic resin of polymethyl acrylate, the vistanex that polyethylene, polypropylene, polyisobutene and polybutadiene are such, and the resin selected of polystyrene resin.
The viewpoint of calm compressive hardness K value easy to control and compressive recovery rate is considered, can use by the plastic pellet that a kind of resin that has the polymerizable monomer polymerization of ethene unsaturated group and obtain is consisted of, perhaps, the plastic pellet that the resin that obtains by making the polymerizable monomer copolymerization with ethene unsaturated group more than 2 kinds consists of.Make the polymerizable monomer copolymerization with ethene unsaturated group more than 2 kinds and when obtaining plastic pellet, by non-crosslinked monomer and cross-linkable monomer are also used, and suitably adjust their copolymerization ratio, kind, can easily control compressive hardness K value and the compressive recovery rate of plastic pellet.As above-mentioned non-crosslinked monomer and above-mentioned cross-linkable monomer, for example, can use the monomer of putting down in writing in TOHKEMY 2004-165019 communique.
The density of the electroconductive particle that comprises in circuit connection material can be determined according to the fineness of the electrode that connects etc.The density of electroconductive particle is 1 ~ 50 volume % with respect to insulating properties bonding agent 100 volume % usually.Consider from the viewpoint of insulating properties and manufacturing cost, the density of electroconductive particle can be also 1 ~ 30 volume %.
Membranaceous circuit connection material (anisotropic conductive adhesive film) for example can obtain by the method with following operation: above-mentioned insulating properties bonding agent and conductive adhesive are dissolved in solvent or are scattered in decentralized medium to prepare the operation of coating fluid; And this coating fluid be coated on the fissility base materials such as processing release paper or be immersed in the base materials such as nonwoven fabrics, and below the active temperature of curing agent drying coated liquid, thereby the operation of desolventizing or dispersion liquid.By use the aromatic series hydrocarbon system with the mixed solvent that contains oxygen system as solvent, can improve the dissolubility of material.The SP value that contains the oxygen series solvent is 8.1 ~ 10.7, can especially effectively protect the potentiality curing agent thus.This contains the oxygen series solvent and for example is acetic acid esters.The boiling point of solvent can be below 150 ℃.If boiling point surpasses 150 ℃, need high temperature to be used for drying.Due to the active temperature of baking temperature near the potentiality curing agent, therefore cause the tendency that potentiality reduces, the workability when having drying when low temperature reduces.Therefore, the boiling point of solvent can be 60 ~ 150 ℃ or 70 ~ 130 ℃.
Membranaceous circuit connection material can have multi-layer bonded dose of layer.For example, can be with following anisotropic conductive adhesive film as circuit connection material: by comprising be used to the adhesive film of the electroconductive particle of giving anisotropic conductive (conductive pattern layer) and not containing the anisotropic conductive adhesive film of the two-layer structure that the insulating properties layer of conductive material consists of, perhaps by the adhesive film that comprises electroconductive particle (conductive pattern) and the anisotropic conductive adhesive film of three-decker that is arranged on the insulating properties layer formation that does not contain conductive material of its both sides.Electroconductive particle (conductive pattern) may reside in a plurality of layers.
Because the anisotropic conductive adhesive film of these sandwich constructions can be configured in electroconductive particle (conductive pattern) on the electrode that will connect efficiently, therefore be conducive to connect with the electrode of narrow and small spacing configuration.Consider the cementability with circuit block, also the adhesive film excellent in adhesion to each circuit block that will connect can be carried out lamination so that the circuit connection material multiple stratification.
The circuit connection material of present embodiment for example can pass through in 10 seconds of heating below 170 ℃ and lowering viscousity, and is used for via electroconductive particle, electrode being electrically connected to.The storage modulus E ' of the solidfied material (adhesive linkage) that the circuit connection material of present embodiment was formed in 10 seconds of heating below 170 ℃ more than 120 ℃ frequency 10Hz during at 40 ℃ can be 0.5 ~ 2.5GPa.
the circuit connection material of present embodiment can be used for the method for connecting circuit parts, the method possesses following operation: this circuit connection material is configured in the first circuit block that has first substrate and be arranged at the first splicing ear on this first substrate, with with the first circuit block subtend configuration, and have second substrate and be arranged between the second circuit parts of the second splicing ear on this second substrate, and under this state, integral body heated and pressurize, thereby be electrically connected to the first circuit block and second circuit parts also bonding by the adhesive linkage that is formed by circuit connection material.
Above-mentioned first substrate, second substrate or their two sides are the flexible base, boards that comprise thermoplastic resin.The modulus of elasticity in static bending of flexible base, board is for example below 10GPa.
Flexible base, board for example has the organic substrate that comprises the thermoplastic resin of being selected by the higher polyimides of thermal endurance (PI) and lower PETG (PET), Merlon (PC) and the PEN (PEN) of thermal endurance.
Flexible base, board can further have the one kind or two or more layer of being selected by the modification film such as hard conating and diaphragm etc. of the characteristic that forms, be used for to improve optics and machinery on the surface of organic substrate.Make the operation of substrate and conveyance be easy to supporting material as being used for, can utilize by fit or the configuration such as coating, glass baseplate and composite material with SUS etc. be as flexible base, board.
From keeping as the individual layer film strength and guarantee that the aspect of flexible considers, flexible base, board thick can be 10 ~ 200 μ m left and right or 10 ~ 125 μ m left and right.
Be arranged at the electrode material of the splicing ear on flexible base, board as formation, can enumerate the metals such as Ni, Al, Au, Cu, Ti and Mo, and the transparent conductors such as ITO and IZO.
When second substrate was flexible base, board, first substrate can be both the IC chip, can be also flexible base, board.First substrate is IC chip and second substrate when being flexible base, board, and circuit connection material is used for the COP(chip attachment at plastic base, Chip on Plastic substrate) connect.When first substrate and second substrate were flexible base, board, circuit connection material was used for the FOP(film and is mounted on plastic base, Film on Plastic substrate) connect.
As first circuit block that can be connected with the second circuit parts with flexible base, board, can enumerate the electronic units such as passive component such as the active elements such as semiconductor chip, transistor, diode, thyristor, capacitor, resistor, coil, printed base plate, circuit are formed with the glass substrate of ITO etc.Can be on the electronic pads of semiconductor chip, substrate, the projection that forms by plating or the gold thread projection of following formation are set, be used as splicing ear.Above-mentioned gold thread projection is to form gold goal by the front end with gold thread with meltings such as welding guns, then this ball is crimped on electronic pads, then cuts off gold thread and obtains.
The splicing ear of circuit block can be single, but usually arranges a plurality of.With the configuration of at least a portion subtend in the splicing ear of set of circuits parts, these circuit blocks at least, make circuit connection material between between the splicing ear of subtend configuration.By heating under this state and pressurization, the splicing ear that subtend is configured is electrically connected to each other, and obtains connector.The splicing ear of subtend configuration is electrically connected to via electroconductive particle each other.
Embodiment
Below, enumerate embodiment the present invention is carried out more specific description.But, the invention is not restricted to these embodiment.
will be as the urethane acrylate (trade name: UA-5500T of free-radical polymerised material, Xin Zhong village chemical industrial company system) 20 weight portions, two (acryloxy ethyl) isocyanuric acid ester (trade name: M-215, East Asia Synesis Company system) 15 weight portions, dihydroxymethyl tristane diacrylate (trade name: DCP-A, chemical company of common prosperity society system) 5 weight portions and 2-methacryloxyethyl phosphate ester acid (trade name: P-2M, chemical company of common prosperity society system) 1 weight portion, benzoyl peroxide (trade name: NYPER BMT-K, Japan's grease system) 8 weight portions, and with polyester polyurethane resin (trade name: UR4800, Japan's textile company system) polyester polyurethane resin solution 60 weight portions that are dissolved in the 40 quality % that obtain in the mixed solvent of toluene/methylethylketone=50/50 mix, stir, obtain the solution of adhesive resin (insulating properties bonding agent).In the solution of this adhesive resin, take with respect to the ratio of insulating properties bonding agent as 10 volume %, disperse to have as the polystyrene particle of core and cover the polystyrene particle surface and the electroconductive particle of the average grain diameter 3 μ m of the gold layer of the nickel dam of the thickness 0.2 μ m that sets gradually from the inboard and thickness 0.04 μ m.K value (K20) during 20% compression of electroconductive particle is 0.74GPa(75kgf/mm
2), the K value (K40) during 40% compression is 0.66GPa(67kgf/mm
2), compressive recovery rate is 30%.And then, granular of polyorganosiloxane (trade name: KMP-605 with average grain diameter 2 μ m, chemical company of SHIN-ETSU HANTOTAI system), disperseing as the ratio of 20 weight portions with respect to adhesive resin 100 weight portions, obtain comprising the coating fluid of the circuit connection material of adhesive resin, electroconductive particle and granular of polyorganosiloxane.With apparatus for coating, this coating fluid is coated on one side has been carried out on surface-treated PETG (PET) film (thickness 50 μ m), and film by the heated-air drying of 70 ℃, form the anisotropic conductive adhesive film (thickness 20 μ m) as circuit connection material.The K value of electroconductive particle has the foursquare bottom surface of 50 μ m on one side by use prism-shaped Buddha's warrior attendant plane made of stones pressure head carries out compression test with maximum load of the test 50mN, compression speed 0.33mN/ second, measures.
Preparation has the polyimide film (modulus of elasticity 25 ℃ time the: 5800MPa), be formed at the SiO on polyimide film
2Film (thickness
) and be arranged at SiO
2The thickness as electrode on film
The flexible parent metal of ITO film.The anisotropic conductive adhesive film is clipped in this flexible parent metal and has between the IC chip of projection of 12 μ m * 100 μ m.Under this state, on one side heating to make the arrival temperature of anisotropic conductive adhesive film be 160 ℃, on one side with the pressure of the total connection area 100MPa of unit to 5 seconds of entire pressurisation, obtain being connected with the connector of flexible parent metal and IC chip.
Observe the section of resulting connector, measure the deflection of the splicing ear (ITO film) of the part that contacts with electroconductive particle, result is below 0.5 μ m.(a) of Fig. 1 is the cutaway view of coupling part that schematically shows the connector of embodiment 1.Confirm as shown in Figure 1, on the splicing ear on flexible base, board (polyimide film) 10 (ITO film) 1, be formed with impression by contacting with electroconductive particle 5, thereby guaranteed the conducting between the projection 3 of splicing ear 1 and ITO chip.With the degree of depth of the recess by contacting the ITO film that forms with the electroconductive particle deflection as electrode.This deflection is the degree of depth of displacement the best part of the electrode surface of the part that never contacts with electroconductive particle in recess (part beyond recess).
Embodiment 2
Bisphenol F type phenoxy resin 100g is dissolved in the mixed solvent of the toluene of mass ratio 50:50 and ethyl acetate, obtains the Bisphenol F type phenoxy resin solution of concentration 60 quality %.In addition, bisphenol AF copoly type phenoxy resin 50g is dissolved in the mixed solvent of the toluene of mass ratio 50:50 and ethyl acetate, obtains the bisphenol AF copoly type phenoxy resin solution of concentration 45 quality %.
Resulting 2 kinds of phenoxy resin solution are mixed, obtain mixed solution.Add liquid epoxy resin in this mixed solution.The amount of adjusting liquid epoxy resin makes Bisphenol F type phenoxy resin: bisphenol AF copoly type phenoxy resin: liquid epoxy resin is 30:30:40 by quality ratio.
With similarly to Example 1 electroconductive particle to be scattered in resulting solution 100g with respect to the ratio of insulating properties bonding agent as 10 volume %.Further add wherein the aromatic series sulfonium salt 2.4g as the potentiality curing agent, obtain coating fluid.With apparatus for coating, this coating fluid is coated on one side has been carried out on surface-treated PETG (PET) film (thickness 50 μ m), and 70 ℃ of heated-air dryings 5 minutes, form thus the anisotropic conductive adhesive film (thickness 20 μ m) as circuit connection material.
Use the anisotropic conductive adhesive film of made, similarly to Example 1, make the connector that is connected with flexible parent metal and IC chip.Observe the section of resulting connector, measure the deflection of the splicing ear (ITO film) of the part that contacts with electroconductive particle, result is below 0.5 μ m.Do not observe the fracture of circuit and crackle etc.Observe, by contacting with electroconductive particle, impression is formed on splicing ear (ITO film).
Comparative example 1
Preparation has as the polystyrene particle of core and covers the polystyrene particle surface and the electroconductive particle of the average grain diameter 3 μ m of the gold layer of the nickel dam of the thickness 0.2 μ m that sets gradually from the inboard and thickness 0.04 μ m.K value during 20% compression of this electroconductive particle is 3.43GPa(350kgf/mm
2), the K value during 40% compression is 4.02GPa(410kgf/mm
2), compressive recovery rate is 40%.Except using this electroconductive particle, similarly to Example 1, make the anisotropic conductive adhesive film, and make the connector of flexible parent metal and IC chip with it.
Observe the section of resulting connector.(b) of Fig. 1 is the cutaway view of coupling part that schematically shows the connector of comparative example 1.Measure the deflection of the splicing ear (ITO film) 1 of the part that contacts with electroconductive particle 5, result is more than 1.0 μ m, and observes the fracture of circuit.
Comparative example 2
Preparation has as the polystyrene particle of core and covers the polystyrene particle surface and the electroconductive particle of the average grain diameter 3 μ m of the gold layer of the nickel dam of the thickness 0.2 μ m that sets gradually from the inboard and thickness 0.04 μ m.K value when 20% of this electroconductive particle is out of shape is 350kgf/mm
2, 40% when distortion the K value be 410kgf/mm
2, response rate is 40%.Except using this electroconductive particle, similarly to Example 2, make the anisotropic conductive adhesive film, and make the connector of flexible parent metal and IC chip with it.
Observe the section of resulting connector, measure the deflection of the splicing ear (ITO film) of the part that contacts with electroconductive particle, result is more than 1.0 μ m, and observes the fracture of circuit.
Reference example 1
The anisotropic conductive adhesive film that embodiment 1 is made is clipped in has glass plate (thickness 0.5mm, OA-10) and be formed at sputtered aluminum membrane electrode (thickness on glass plate
) glass baseplate, and have between the IC chip of projection of 12 μ m * 100 μ m, it is 160 ℃ that heating on one side makes the arrival temperature of anisotropic conductive adhesive film, on one side with to the pressure of the total connection area 100MPa of unit to 5 seconds of entire pressurisation, obtain being connected with the connector of glass baseplate and IC chip.
Observe the section of resulting connector.(a) of Fig. 2 is the cutaway view of coupling part that schematically shows the connector of reference example 1.Measure the deflection of the splicing ear (ITO film) 1 of the part contact with electroconductive particle 5, result is below 0.1 μ m, does not observe the fracture of circuit and crackle etc.In addition, could not observe for the connection status of the judging glass baseplate impression of qualified, the electrode that forms by electroconductive particle whether.
Reference example 2
The anisotropic conductive adhesive film of making in using embodiment 2, same with reference example 1, make the connector of glass baseplate and IC chip, and observe its section.The deflection of the electrode of the part that contacts with electroconductive particle is below 0.1 μ m, does not observe the fracture of circuit.Could not observe the impression of the electrode that forms by electroconductive particle.
Reference example 3
The anisotropic conductive adhesive film of making in usage comparison example 1, same with reference example 1, make the connector of glass baseplate and IC chip, and observe its section.(b) of Fig. 2 is the cutaway view of coupling part that schematically shows the connector of reference example 3.The deflection of the splicing ear (electrode) 1 of the part that contacts with electroconductive particle 5 is below 0.1 μ m, does not observe the fracture of circuit.Observe the impression of the electrode that forms by electroconductive particle 5.
Reference example 4
The anisotropic conductive adhesive film of making in usage comparison example 2, same with reference example 1, make the connector of glass baseplate and IC chip, and observe its section.The deflection of the electrode of the part that contacts with electroconductive particle is below 0.1 μ m, does not observe the fracture of circuit.Observe the impression of the electrode that forms by electroconductive particle.
Formation and the evaluation result of each connector of made are shown in table 1.It is as shown in the table, according to embodiment, can in the situation that the circuit that the fracture that does not produce circuit forms impression with crackle and carries out flexible parent metal connect.
Table 1
According to the present invention, when the circuit block that will have flexible base, board connects by the circuit connection material that contains electroconductive particle, can fully prevent the electrode damage on flexible base, board.For example, according to the present invention, the fracture of the electrode in the time of reducing the circuit connection on flexible base, board and the generation of crackle.In addition, by size and the density optimization that makes electroconductive particle, can guarantee good connection status be connected with connection reliability carry out high de-agglomeration can circuit connect.
Claims (20)
1. circuit connection material, it is to contain insulating properties bonding agent and the electroconductive particle that is scattered in this insulating properties bonding agent, and be used for the first circuit block to have first substrate and to be arranged at the first splicing ear on this first substrate and be electrically connected to also bonding circuit connection material with the second circuit parts that have second substrate and be arranged at the second splicing ear on this second substrate
Described first substrate and/or described second substrate are the flexible base, boards that comprises thermoplastic resin,
Described electroconductive particle has the metal level of plastic pellet and this plastic pellet of coating, and the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 20% is 0.20 ~ 3.2GPa.
2. circuit connection material according to claim 1, wherein, described first substrate is IC chip or described flexible base, board, and described second substrate is the described flexible base, board that comprises at least a thermoplastic resin of selecting from the group that is comprised of polyimides, PETG, Merlon and PEN.
3. circuit connection material according to claim 1 and 2, wherein, the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 40% is 0.29 ~ 3.4GPa.
4. the described circuit connection material of any one according to claim 1 ~ 3, wherein, the compressive recovery rate of described electroconductive particle is 1 ~ 90%.
5. the described circuit connection material of any one according to claim 1 ~ 4, wherein, described electroconductive particle further has the insulative resin layer that is arranged at the described metal level outside.
6. the described circuit connection material of any one according to claim 1 ~ 5, wherein, below 170 ℃, heating is after 10 seconds, the storage modulus E ' of frequency 10Hz is 0.5 ~ 2.5GPa in the time of 40 ℃.
7. connector, it possesses: have first substrate and be arranged at the first circuit block of the first splicing ear on this first substrate; With described the first circuit block subtend configuration and have second substrate and be arranged at the second circuit parts of the second splicing ear on this second substrate; And be arranged between described the first circuit block and described second circuit parts, with described the first circuit block with described second circuit parts are electrically connected to and bonding adhesive linkage,
Described first substrate and/or described second substrate are the flexible base, boards that comprises thermoplastic resin,
Described adhesive linkage is the layer that is formed by the described circuit connection material of any one in claim 1 ~ 6.
8. a manufacturing is connected with the method for the connector of circuit block, it possesses following operation: circuit connection material is configured in the first circuit block that has first substrate and be arranged at the first splicing ear on this first substrate, and and described the first circuit block subtend configures and has second substrate and be arranged between the second circuit parts of the second splicing ear on this second substrate, and under this state, integral body heated and pressurize, thereby be electrically connected to described the first circuit block and described second circuit parts also bonding by the adhesive linkage that is formed by described circuit connection material,
Described first substrate and/or described second substrate are the flexible base, boards that comprises thermoplastic resin,
Described circuit connection material is the described circuit connection material of any one in claim 1 ~ 6.
9. contain the insulating properties bonding agent and be scattered in the composition of the electroconductive particle in this insulating properties bonding agent as the application of circuit connection material, described circuit connection material is used for the first circuit block will have first substrate and to be arranged at the first splicing ear on this first substrate and is electrically connected to also bonding with the second circuit parts that have second substrate and be arranged at the second splicing ear on this second substrate
Described first substrate and/or described second substrate are the flexible base, boards that comprises thermoplastic resin,
Described electroconductive particle has the metal level of plastic pellet and this plastic pellet of coating, and the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 20% is 0.20 ~ 3.2GPa.
10. application according to claim 9, wherein, described first substrate is IC chip or described flexible base, board, and described second substrate is the described flexible base, board that comprises at least a thermoplastic resin of selecting from the group that is comprised of polyimides, PETG, Merlon and PEN.
11. according to claim 9 or 10 described application, wherein, the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 40% is 0.29 ~ 3.4GPa.
12. the described application of any one according to claim 9 ~ 11, wherein, the compressive recovery rate of described electroconductive particle is 1 ~ 90%.
13. the described application of any one according to claim 9 ~ 12, wherein, described electroconductive particle further has the insulative resin layer that is arranged at the described metal level outside.
14. the described application of any one according to claim 9 ~ 13, wherein, after heating 10 seconds below 170 ℃, the storage modulus E ' of frequency 10Hz is 0.5 ~ 2.5GPa in the time of 40 ℃.
15. contain the insulating properties bonding agent and be scattered in the composition of the electroconductive particle in this insulating properties bonding agent for the manufacture of the application of circuit connection material, described circuit connection material is used for the first circuit block will have first substrate and to be arranged at the first splicing ear on this first substrate and is electrically connected to also bonding with the second circuit parts that have second substrate and be arranged at the second splicing ear on this second substrate
Described first substrate and/or described second substrate are the flexible base, boards that comprises thermoplastic resin,
Described electroconductive particle has the metal level of plastic pellet and this plastic pellet of coating, and the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 20% is 0.20 ~ 3.2GPa.
16. application according to claim 15, wherein, described first substrate is IC chip or described flexible base, board, and described second substrate is the described flexible base, board that comprises at least a thermoplastic resin of selecting from the group that is comprised of polyimides, PETG, Merlon and PEN.
17. according to claim 15 or 16 described application, wherein, the compressive hardness K value when described electroconductive particle is carried out the compression displacement of its diameter 40% is 0.29 ~ 3.4GPa.
18. the described application of any one according to claim 15 ~ 17, wherein, the compressive recovery rate of described electroconductive particle is 1 ~ 90%.
19. the described application of any one according to claim 15 ~ 18, wherein, described electroconductive particle further has the insulative resin layer that is arranged at the described metal level outside.
20. the described application of any one according to claim 15 ~ 19, wherein, after heating 10 seconds below 170 ℃, the storage modulus E ' of frequency 10Hz is 0.5 ~ 2.5GPa in the time of 40 ℃.
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| JP2015179732A (en) * | 2014-03-19 | 2015-10-08 | デクセリアルズ株式会社 | anisotropic conductive adhesive |
| CN106104930A (en) * | 2014-03-20 | 2016-11-09 | 迪睿合株式会社 | Anisotropic conductive film and preparation method thereof |
| WO2015174299A1 (en) * | 2014-05-14 | 2015-11-19 | 積水化学工業株式会社 | Conductive paste, production method for conductive paste, connection structure, and production method for connection structure |
| KR102449287B1 (en) | 2015-05-27 | 2022-09-29 | 데쿠세리아루즈 가부시키가이샤 | Anisotropic conductive film and connection structure |
| JP2017183239A (en) * | 2016-03-31 | 2017-10-05 | デクセリアルズ株式会社 | Anisotropic conductive connection structure |
| JP6735652B2 (en) * | 2016-10-21 | 2020-08-05 | デクセリアルズ株式会社 | Method of manufacturing semiconductor device |
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| JP2019179647A (en) * | 2018-03-30 | 2019-10-17 | デクセリアルズ株式会社 | Conductive material, and manufacturing method of connection body |
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| TWI787601B (en) * | 2015-01-13 | 2022-12-21 | 日商迪睿合股份有限公司 | Anisotropic Conductive Film |
| US11591499B2 (en) | 2015-01-13 | 2023-02-28 | Dexerials Corporation | Anisotropic conductive film |
| CN106085169A (en) * | 2015-05-01 | 2016-11-09 | 味之素株式会社 | Solidification compound |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI629691B (en) | 2018-07-11 |
| CN109949968B (en) | 2021-09-21 |
| KR20130072156A (en) | 2013-07-01 |
| KR102036230B1 (en) | 2019-10-24 |
| JP2013149966A (en) | 2013-08-01 |
| JP5737278B2 (en) | 2015-06-17 |
| TW201330008A (en) | 2013-07-16 |
| CN109949968A (en) | 2019-06-28 |
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Application publication date: 20130626 |