JP2013146003A - 振動デバイス及び電子機器 - Google Patents
振動デバイス及び電子機器 Download PDFInfo
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- JP2013146003A JP2013146003A JP2012005955A JP2012005955A JP2013146003A JP 2013146003 A JP2013146003 A JP 2013146003A JP 2012005955 A JP2012005955 A JP 2012005955A JP 2012005955 A JP2012005955 A JP 2012005955A JP 2013146003 A JP2013146003 A JP 2013146003A
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- thermistor
- terminal
- wiring
- electrode
- lid
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- 230000010355 oscillation Effects 0.000 claims abstract description 19
- 239000007787 solid Substances 0.000 claims description 37
- 230000008859 change Effects 0.000 claims description 13
- 239000013078 crystal Substances 0.000 abstract description 144
- 238000001514 detection method Methods 0.000 abstract description 14
- 230000004048 modification Effects 0.000 description 49
- 238000012986 modification Methods 0.000 description 49
- 238000010586 diagram Methods 0.000 description 20
- 239000010453 quartz Substances 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 230000000694 effects Effects 0.000 description 8
- 230000005284 excitation Effects 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 230000003068 static effect Effects 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 229910052786 argon Inorganic materials 0.000 description 3
- 238000000605 extraction Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000011261 inert gas Substances 0.000 description 3
- 238000005304 joining Methods 0.000 description 3
- 229910000833 kovar Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 230000003071 parasitic effect Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010935 stainless steel Substances 0.000 description 3
- 229910001220 stainless steel Inorganic materials 0.000 description 3
- 238000005219 brazing Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 230000012447 hatching Effects 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000008961 swelling Effects 0.000 description 2
- WSMQKESQZFQMFW-UHFFFAOYSA-N 5-methyl-pyrazole-3-carboxylic acid Chemical compound CC1=CC(C(O)=O)=NN1 WSMQKESQZFQMFW-UHFFFAOYSA-N 0.000 description 1
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910013641 LiNbO 3 Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000001413 cellular effect Effects 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- PSHMSSXLYVAENJ-UHFFFAOYSA-N dilithium;[oxido(oxoboranyloxy)boranyl]oxy-oxoboranyloxyborinate Chemical compound [Li+].[Li+].O=BOB([O-])OB([O-])OB=O PSHMSSXLYVAENJ-UHFFFAOYSA-N 0.000 description 1
- KZHJGOXRZJKJNY-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Si]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O.O=[Al]O[Al]=O KZHJGOXRZJKJNY-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000002241 glass-ceramic Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- GQYHUHYESMUTHG-UHFFFAOYSA-N lithium niobate Chemical compound [Li+].[O-][Nb](=O)=O GQYHUHYESMUTHG-UHFFFAOYSA-N 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 229910052863 mullite Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Images
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012005955A JP2013146003A (ja) | 2012-01-16 | 2012-01-16 | 振動デバイス及び電子機器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2012005955A JP2013146003A (ja) | 2012-01-16 | 2012-01-16 | 振動デバイス及び電子機器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013146003A true JP2013146003A (ja) | 2013-07-25 |
JP2013146003A5 JP2013146003A5 (enrdf_load_stackoverflow) | 2015-02-19 |
Family
ID=49041583
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2012005955A Withdrawn JP2013146003A (ja) | 2012-01-16 | 2012-01-16 | 振動デバイス及び電子機器 |
Country Status (1)
Country | Link |
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JP (1) | JP2013146003A (enrdf_load_stackoverflow) |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015076771A (ja) * | 2013-10-10 | 2015-04-20 | 京セラクリスタルデバイス株式会社 | 水晶振動子 |
JP2015228555A (ja) * | 2014-05-30 | 2015-12-17 | 京セラクリスタルデバイス株式会社 | 恒温槽付圧電デバイス |
CN107221396A (zh) * | 2016-03-22 | 2017-09-29 | 三星电机株式会社 | 压电元件用热敏电阻以及包括此的压电元件封装件 |
JP2018113716A (ja) * | 2018-03-12 | 2018-07-19 | セイコーエプソン株式会社 | 電子デバイス、電子デバイス用回路基板、電子機器、移動体 |
JP2019186647A (ja) * | 2018-04-04 | 2019-10-24 | 京セラ株式会社 | 水晶デバイス及びその水晶デバイスを用いた電子機器 |
CN111224635A (zh) * | 2018-11-27 | 2020-06-02 | 京瓷株式会社 | 压电器件以及电子设备 |
JP2020088635A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
JP2020088634A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
JP2020088633A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
US10718672B2 (en) | 2017-01-20 | 2020-07-21 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric device package |
JP2020184654A (ja) * | 2019-04-26 | 2020-11-12 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
JP7736138B2 (ja) | 2024-09-12 | 2025-09-09 | 株式会社大真空 | 恒温槽型圧電発振器 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000353919A (ja) * | 1999-06-10 | 2000-12-19 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶発振器 |
JP2006191517A (ja) * | 2004-12-07 | 2006-07-20 | Seiko Epson Corp | 温度補償型圧電発振器 |
JP2008205938A (ja) * | 2007-02-21 | 2008-09-04 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶振動子 |
JP2010118979A (ja) * | 2008-11-14 | 2010-05-27 | Nippon Dempa Kogyo Co Ltd | 温度検出型の表面実装用水晶振動子及びセット基板に対する実装方法 |
US7990025B1 (en) * | 2004-09-01 | 2011-08-02 | Pablo Ferreiro | Silicon package with embedded oscillator |
US20110234047A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Kinseki Corporation | Piezoelectric device |
-
2012
- 2012-01-16 JP JP2012005955A patent/JP2013146003A/ja not_active Withdrawn
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000353919A (ja) * | 1999-06-10 | 2000-12-19 | Nippon Dempa Kogyo Co Ltd | 表面実装水晶発振器 |
US7990025B1 (en) * | 2004-09-01 | 2011-08-02 | Pablo Ferreiro | Silicon package with embedded oscillator |
JP2006191517A (ja) * | 2004-12-07 | 2006-07-20 | Seiko Epson Corp | 温度補償型圧電発振器 |
JP2008205938A (ja) * | 2007-02-21 | 2008-09-04 | Nippon Dempa Kogyo Co Ltd | 表面実装用の水晶振動子 |
JP2010118979A (ja) * | 2008-11-14 | 2010-05-27 | Nippon Dempa Kogyo Co Ltd | 温度検出型の表面実装用水晶振動子及びセット基板に対する実装方法 |
US20110234047A1 (en) * | 2010-03-29 | 2011-09-29 | Kyocera Kinseki Corporation | Piezoelectric device |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015076771A (ja) * | 2013-10-10 | 2015-04-20 | 京セラクリスタルデバイス株式会社 | 水晶振動子 |
JP2015228555A (ja) * | 2014-05-30 | 2015-12-17 | 京セラクリスタルデバイス株式会社 | 恒温槽付圧電デバイス |
CN107221396A (zh) * | 2016-03-22 | 2017-09-29 | 三星电机株式会社 | 压电元件用热敏电阻以及包括此的压电元件封装件 |
CN107221396B (zh) * | 2016-03-22 | 2020-09-04 | 三星电机株式会社 | 压电元件用热敏电阻以及包括此的压电元件封装件 |
US10718672B2 (en) | 2017-01-20 | 2020-07-21 | Samsung Electro-Mechanics Co., Ltd. | Piezoelectric device package |
JP2018113716A (ja) * | 2018-03-12 | 2018-07-19 | セイコーエプソン株式会社 | 電子デバイス、電子デバイス用回路基板、電子機器、移動体 |
US11251770B2 (en) | 2018-04-04 | 2022-02-15 | Kyocera Corporation | Crystal device and electronic apparatus using this crystal device |
JP2019186647A (ja) * | 2018-04-04 | 2019-10-24 | 京セラ株式会社 | 水晶デバイス及びその水晶デバイスを用いた電子機器 |
JP2020088634A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
JP2020088633A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
JP2020088635A (ja) * | 2018-11-27 | 2020-06-04 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
CN111224635A (zh) * | 2018-11-27 | 2020-06-02 | 京瓷株式会社 | 压电器件以及电子设备 |
US11251771B2 (en) | 2018-11-27 | 2022-02-15 | Kyocera Corporation | Piezoelectric device and electronic apparatus |
JP7083303B2 (ja) | 2018-11-27 | 2022-06-10 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
JP7093293B2 (ja) | 2018-11-27 | 2022-06-29 | 京セラ株式会社 | 圧電デバイス及び電子機器 |
CN111224635B (zh) * | 2018-11-27 | 2024-01-19 | 京瓷株式会社 | 压电器件以及电子设备 |
JP2020184654A (ja) * | 2019-04-26 | 2020-11-12 | セイコーエプソン株式会社 | 振動デバイス、電子機器および移動体 |
JP7375331B2 (ja) | 2019-04-26 | 2023-11-08 | セイコーエプソン株式会社 | 振動デバイスおよび電子機器 |
JP7736138B2 (ja) | 2024-09-12 | 2025-09-09 | 株式会社大真空 | 恒温槽型圧電発振器 |
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