JP2013146003A - Vibration device and electronic apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a vibration device in which an oscillation signal of a vibrating piece is unlikely to be superimposed on a detecting signal of a thermistor, and an electronic apparatus with the vibration device.SOLUTION: A vibration device comprises a crystal vibrating piece 10, a thermistor 20 and a package 30 in which the crystal vibrating piece 10 and the thermistor 20 are packaged. The package 30 includes a package base 31 to which the crystal vibrating piece 10 and the thermistor 20 are mounted, and a lid 32 covering the crystal vibrating piece 10. In the package base 31, internal terminals 34b, 34c to which the crystal vibrating piece 10 is mounted, electrode pads 36b, 36c to which the thermistor 20 is mounted are disposed and, on a second principal surface 35, a plurality of electrode terminals 37a, 37b, 37c, 37d are disposed. First wiring 50a, 50b which connects the electrode terminals 37b, 37d and the internal terminals 34b, 34c is not overlapped to second wiring 51a, 51b which connects the electrode terminals 37a, 37c and the electrode pads 36b, 36c, in a plan view.

Description

  The present invention relates to a vibration device and an electronic apparatus including the vibration device.

Conventionally, as a vibration device, a container body made of a laminated ceramic having a bottom wall layer and a frame wall layer and having a concave shape, and one end both sides are fixed to one end side of the bottom wall layer accommodated in the container body. There is known a surface-mount crystal resonator having a crystal piece and a thermistor housed in a container body together with the crystal piece (see, for example, Patent Document 1).
The crystal resonator detects the operating temperature of the crystal piece based on a change in resistance value accompanying a change in ambient temperature in the thermistor, and a temperature compensation mechanism (hereinafter referred to as a temperature compensation circuit) is accompanied by a change in ambient temperature. It is said that an excellent frequency temperature characteristic can be obtained by correcting a shift in the resonance frequency of a crystal piece (hereinafter referred to as a vibrating piece).

JP 2008-205938 A

However, in the above-described crystal resonator (hereinafter referred to as a vibration device), vibration is provided on the external terminal provided on the outer bottom surface (outer bottom surface) of the container body and on the inner bottom surface (inner bottom surface) of the container body. The wiring (wiring pattern) that connects the crystal terminal that fixes the one lead electrode to the wiring that connects the other external terminal and the circuit terminal that fixes the thermistor electrode to the inner bottom surface of the container body In some cases, patterning (drawing) may be performed while overlapping in a plan view.
As a result, in the vibrating device, there is a possibility that the oscillation signal of the vibrating piece is superimposed on the detection signal of the thermistor.

  From this, the vibration device is substantially the same as the temperature detection accuracy of the thermistor has deteriorated, and is performed based on a change in detection signal (for example, voltage value) accompanying a change in ambient temperature in the thermistor. There is a possibility that a problem occurs in the correction of the resonance frequency of the resonator element by the temperature compensation circuit, and the frequency temperature characteristic is deteriorated.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A vibrating device according to this application example includes a vibrating piece, a thermistor having a pair of electrodes, and a container in which the vibrating piece and the thermistor are housed, A container body on which the resonator element and the thermistor are mounted; and a lid that covers at least the resonator element; the container body includes a resonator element terminal to which the resonator element is attached; and the electrode of the thermistor. A thermistor terminal to which is attached, and a plurality of external terminals on the outer bottom surface, and a first wiring connecting the external terminal and the resonator element terminal connects the other external terminal and the thermistor terminal. The second wiring to be connected is provided so as not to overlap in a plan view.

According to this, the vibrating device includes a vibrating piece terminal (corresponding to a crystal terminal) to which a vibrating piece is attached to the container body, a thermistor terminal (corresponding to a circuit terminal) to which an electrode of the thermistor is attached, and a plurality of devices on the outer bottom surface. Provided so that the first wiring that connects the external terminal and the resonator element terminal does not overlap with the second wiring that connects the other external terminal and the thermistor terminal in plan view. It has been.
Accordingly, in the vibrating device, the oscillation signal of the vibrating piece flowing through the first wiring is difficult to be superimposed on the detection signal of the thermistor flowing through the second wiring.
As a result, in the vibration device, fluctuations in the detection signal of the thermistor and the like are reduced, and the temperature detection accuracy is substantially improved, and an excellent frequency temperature characteristic by the temperature compensation circuit can be obtained.

  Application Example 2 In the vibration device according to the application example described above, it is preferable that at least one of the external terminals is a ground terminal, and the lid body is electrically connected to the ground terminal.

  According to this, since at least one of the external terminals is a ground terminal and the lid is electrically connected to the ground terminal, the vibration device improves, for example, shielding performance against external noise and static electricity. be able to.

  Application Example 3 In the vibration device according to the application example, a solid wiring connected to the ground terminal is provided in an intermediate layer provided between the first wiring and the second wiring, The solid wiring is preferably provided so as to overlap at least the second wiring in a plan view.

According to this, in the vibration device, the solid wiring connected to the ground terminal is provided in the intermediate layer provided between the first wiring and the second wiring of the container body, and the solid wiring is viewed in a plan view. It is provided so as to overlap at least the second wiring.
Thus, in the vibration device, since the second wiring is shielded by the solid wiring, the oscillation signal of the vibrating piece flowing through the first wiring is further difficult to be superimposed on the detection signal of the thermistor flowing through the second wiring.

  Application Example 4 In the vibration device according to the application example, it is preferable that the solid wiring is provided so as not to overlap at least the first wiring in a plan view.

According to this, since the solid wiring is provided so that the solid wiring does not overlap at least the first wiring in a plan view, the solid wiring and the first wiring are transmitted to the oscillation signal of the vibrating piece flowing through the first wiring. It is possible to avoid the addition of stray capacitance (parasitic capacitance, electrostatic capacitance).
As a result, the vibration device can avoid a decrease in sensitivity of the vibration piece (a reduction in the frequency adjustment range).

  Application Example 5 In the vibration device according to the application example described above, the external terminal includes a first ground terminal and a second ground terminal as the ground terminal, and the first ground terminal is electrically connected to the lid. The second ground terminal is electrically connected to the ground-side electrode among the electrodes of the thermistor, and the solid wiring is electrically connected to the first ground terminal. It is preferable.

According to this, in the vibration device, the first ground terminal is electrically connected to the lid, the second ground terminal is electrically connected to the electrode on the ground side of the thermistor, and the solid wiring is connected to the first ground terminal. Electrically connected.
As a result, the vibration device can avoid the noise including the AC component on the lid side from being superimposed on the thermistor side via the common ground terminal by separating (dividing) the ground terminal.

  Application Example 6 An electronic apparatus according to this application example includes the vibration device according to any one of the application examples.

  According to this, since the electronic apparatus having this configuration includes the vibration device according to any one of the application examples, it is possible to provide the electronic apparatus in which the effect according to any of the application examples is reflected.

  Application Example 7 In the electronic device according to the application example described above, it is preferable that the electronic device includes an oscillation circuit that drives the vibration piece and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the vibration piece.

  According to this, since the electronic device of this configuration includes the oscillation circuit that drives the resonator element and the temperature compensation circuit that corrects the frequency variation caused by the temperature change of the resonator element, the resonance frequency at which the oscillation circuit oscillates is reduced. Temperature compensation can be performed, and an electronic device having excellent temperature characteristics can be provided.

It is a schematic diagram which shows schematic structure of the crystal oscillator of 1st Embodiment, (a) is a top view seen from the lid (lid body) side, (b) is sectional drawing in the AA of (a). (C) is the top view seen from the bottom face side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 1, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 2, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal resonator of the modification 3, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 4, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of 2nd Embodiment, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c ) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 1, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 2, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal resonator of the modification 3, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. It is a schematic diagram which shows schematic structure of the crystal oscillator of the modification 4, (a) is a top view seen from the lid side, (b) is sectional drawing in the AA of (a), (c) Is a plan view seen from the bottom side. The model perspective view which shows the mobile telephone of 3rd Embodiment.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings.

(First embodiment)
First, a crystal resonator as an example of a vibrating device will be described.
FIG. 1 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the first embodiment. 1A is a plan view seen from the lid (lid) side, and FIG. 1B is a cross-sectional view taken along line AA in FIG. 1A, and FIG. These are the top views seen from the bottom face side. In FIG. 1A, the lid is omitted. In addition, for easy understanding, the dimensional ratio of each component is different from the actual one.

  As shown in FIG. 1, a crystal resonator 1 includes a crystal resonator element 10 as a resonator element, a thermistor 20 that functions as a temperature sensor (temperature sensing element), and a crystal resonator element 10 and the thermistor 20 mounted (accommodated). And a package 30 as a container.

The quartz crystal resonator element 10 is, for example, an AT cut type cut out from a rough crystal or the like at a predetermined angle, and has a planar shape formed in a substantially rectangular shape. It has the connected base 12 integrally.
The quartz crystal resonator element 10 has a base 12 formed with lead electrodes 15 a and 16 a drawn from substantially rectangular excitation electrodes 15 and 16 formed on one main surface 13 and the other main surface 14 of the vibration portion 11. Yes.

The lead electrode 15 a is drawn from the excitation electrode 15 on one main surface 13 to the base portion 12 along the longitudinal direction (left and right direction on the paper surface) of the crystal vibrating piece 10, and to the other main surface 14 along the side surface of the base portion 12. It wraps around and extends to the vicinity of the excitation electrode 16 on the other main surface 14.
The lead electrode 16 a is drawn from the excitation electrode 16 on the other main surface 14 to the base portion 12 along the longitudinal direction of the quartz crystal vibrating piece 10, wraps around one main surface 13 along the side surface of the base portion 12, and The surface 13 extends to the vicinity of the excitation electrode 15.
The excitation electrodes 15 and 16 and the extraction electrodes 15a and 16a are, for example, metal films having a structure in which Cr (chrome) is used as a base layer and Au (gold) is stacked thereon.

The thermistor 20 is, for example, a chip-type (rectangular shape) temperature sensing element (temperature sensing resistance element), and has a pair of electrodes 21 and 22 at both ends in the longitudinal direction, and has an electric resistance against temperature changes. It is a resistor with great change.
As the thermistor 20, for example, a thermistor called an NTC (Negative Temperature Coefficient) thermistor whose resistance decreases with increasing temperature is used. NTC thermistors are frequently used as temperature sensors because the change in resistance value is proportional to the change in temperature.
The thermistor 20 is housed (mounted) in the package 30, detects the temperature in the vicinity of the crystal vibrating piece 10, and outputs it to a temperature compensation circuit (not shown). It plays a function that contributes to the correction.

The package 30 includes a package base 31 as a container body having a substantially rectangular planar shape, and a lid 32 as a flat lid that is bonded to the package base 31 and covers the crystal vibrating piece 10 and the thermistor 20. It is comprised by the substantially rectangular parallelepiped shape.
The package base 31 includes an aluminum oxide sintered body, a mullite sintered body, an aluminum nitride sintered body, a silicon carbide sintered body, a glass ceramic sintered body, etc., which are formed by stacking and firing ceramic green sheets. Ceramic-based insulating materials (corresponding to laminated ceramics), crystal, glass, silicon (high resistance silicon), and the like are used.
The lid 32 is made of the same material as the package base 31 or a metal such as Kovar, 42 alloy, stainless steel.

The first main surface 33, which is the main surface on one side of the package base 31, is provided with a first recess 34 in which the crystal vibrating piece 10 is mounted, and the other main surface on the opposite side of the first main surface 33. A certain second main surface 35 is provided with a second recess 36 in which the thermistor 20 is mounted.
The first recess 34 and the second recess 36 have a substantially rectangular planar shape, and are provided at substantially central portions of the first main surface 33 and the second main surface 35, respectively. In the crystal unit 1, the package 30 is reduced in size by providing the first recess 34 and the second recess 36 of the package base 31 so as to overlap in a plan view.

On the bottom surface 34 a of the first recess 34 of the package base 31, internal terminals 34 b and 34 c as vibration piece terminals to which the crystal vibration piece 10 is attached are provided at positions facing the lead electrodes 15 a and 16 a of the crystal vibration piece 10. ing.
In the quartz crystal vibrating piece 10, the lead electrodes 15 a and 16 a are bonded to the internal terminals 34 b and 34 c through a conductive adhesive 40 such as an epoxy, silicone, or polyimide that is mixed with a conductive material such as a metal filler. Is installed (attached).

On the bottom surface 36 a of the second recess 36 of the package base 31, electrode pads 36 b and 36 c as thermistor terminals to which the electrodes 21 and 22 of the thermistor 20 are attached at positions facing the electrodes 21 and 22 of the thermistor 20. Is provided.
In the thermistor 20, the electrodes 21 and 22 are joined (attached) to the electrode pads 36b and 36c via a joining member 41 such as solder.
The thermistor 20 is preferably arranged so that the longitudinal direction intersects (orthogonally) the longitudinal direction of the package base 31. Thereby, the crystal unit 1 can suppress a decrease in the fixing strength (bonding strength) of the thermistor 20 due to the warp of the package base 31 (prone to a large warp in the longitudinal direction).

A plurality of electrode terminals 37a, 37b, 37c, and 37d as external terminals are provided at the four corners of the second main surface 35 as the outer bottom surface of the package base 31 opposite to the first main surface 33.
Among the four electrode terminals 37a to 37d, for example, two electrode terminals 37b and 37d located at one diagonal are connected to the lead electrodes 15a and 16a of the quartz crystal vibrating piece 10 by the first wirings 50a and 50b. The terminals 34b and 34c are connected.
Specifically, the electrode terminal 37b is connected to the internal terminal 34b by the first wiring 50a, and the electrode terminal 37d is connected to the internal terminal 34c by the first wiring 50b.

The remaining two electrode terminals 37a and 37c located on the other diagonal are connected to electrode pads 36b and 36c joined to the electrodes 21 and 22 of the thermistor 20 by the second wirings 51a and 51b.
Specifically, the electrode terminal 37a is connected to the electrode pad 36b by the second wiring 51a, and the electrode terminal 37c is connected to the electrode pad 36c by the second wiring 51b.
In the first wirings 50a and 50b and the second wirings 51a and 51b, portions indicated by two-dot chain lines indicate conductive vias (through holes filled with a conductive member such as metal).

Here, the first wirings 50a and 50b are provided so as not to overlap the second wirings 51a and 51b in plan view.
Although it is preferable that the electrode terminal 37a and the internal terminal 34c do not overlap in a plan view, as shown in FIG. 1B, the distance in the thickness direction between the electrode terminals 37a and the internal terminals 34c is the first wiring 50a, 50b and the second wiring 51a. , 51b, a slight overlap is allowed.
The internal terminals 34b and 34c, the electrode pads 36b and 36c, the electrode terminals 37a to 37d, the first wirings 50a and 50b, and the second wirings 51a and 51b are, for example, metallized layers such as W (tungsten) and Mo (molybdenum). And a metal film in which respective films such as Ni (nickel) and Au (gold) are laminated by plating or the like.

In the crystal resonator 1, the thermistor 20 is bonded to the electrode pads 36b and 36c of the package base 31 and the crystal resonator element 10 is bonded to the internal terminals 34b and 34c. 32, and the package base 31 and the lid 32 are joined by a joining member 38 such as a seam ring, low-melting-point glass, or adhesive, whereby the first recess 34 of the package base 31 is hermetically sealed. .
Note that the hermetically sealed first recess 34 of the package base 31 is in a vacuum state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon. Yes.

When the lid 32 of the package 30 is made of metal (conductive material) or a conductive film is formed on the surface of the lid 32 on the package base 31 side, a conductive material is used for the bonding member 38. It is preferable that the electrode terminal 37 c is electrically connected to the lid 32 through the conductive via 36 d and the bonding member 38.
This electrode terminal 37c is connected to the electrode 22 on the ground side (GND side) of the thermistor 20 and serves as a ground terminal (GND terminal, ground terminal).
For the electrical connection between the electrode terminal 37c and the lid 32, a not-shown castellation (concave portion) formed along the thickness direction of the package base 31 is provided at the outer corner of the package base 31. A conductive film may be used.

The quartz crystal resonator 1 is driven by a drive signal applied from the outside via the electrode terminals 37b and 37d, the first wirings 50a and 50b, the internal terminals 34b and 34c, the extraction electrodes 15a and 16a, and the excitation electrodes 15 and 16, respectively. The resonator element 10 resonates (oscillates) at a predetermined frequency, and outputs an oscillation signal through a route reverse to the above.
Further, in the crystal resonator 1, the thermistor 20 detects the ambient temperature of the crystal resonator element 10 in the package base 31 as a temperature sensor, and outputs a detection signal via the second wirings 51a and 51b and the electrode terminals 37a and 37c. .

As described above, in the crystal resonator 1 according to the present embodiment, the internal terminals 34 b and 34 c to which the crystal resonator element 10 is attached (joined) to the package base 31 and the pair of electrodes 21 and 22 of the thermistor 20 are attached. Electrode pads 36b and 36c, and a plurality of electrode terminals 37a to 37d on the second main surface 35. In the crystal unit 1, the first wirings 50a and 50b that connect the electrode terminals 37b and 37d and the internal terminals 34b and 34c are the second wirings 51a that connect the electrode terminals 37a and 37c and the electrode pads 36b and 36c. , 51b so as not to overlap with each other in plan view.
As a result, in the crystal resonator 1, the oscillation signal of the crystal vibrating piece 10 flowing through the first wires 50a and 50b is not easily superimposed on the detection signal of the thermistor 20 flowing through the second wires 51a and 51b.
As a result, the quartz resonator 1 has reduced the fluctuation of the detection signal of the thermistor 20 and substantially improved the temperature detection accuracy, and can obtain excellent frequency temperature characteristics by the temperature compensation circuit.

In addition, since the crystal resonator 1 is electrically connected to the electrode terminal 37c in which the electrode terminal 37c is a ground terminal and the lid 32 is a ground terminal, for example, it has a shielding property against external noise and static electricity. Can be improved.
In the crystal resonator 1, the lid 32 may not be electrically connected to the electrode terminal 37c, which is a ground terminal, as long as the shielding performance against external noise and static electricity is not hindered.

Next, a modification of the first embodiment will be described.
(Modification 1)
FIG. 2 is a schematic diagram showing a schematic configuration of the crystal resonator of the first modification. 2A is a plan view viewed from the lid side, FIG. 2B is a cross-sectional view taken along the line AA in FIG. 2A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 2, the crystal resonator 2 of Modification 1 is different in the configuration on the first main surface 33 side of the package base 131 of the package 130 compared to the first embodiment.
In the crystal resonator 2, the first main surface 33 of the package base 131 is a flat surface having no recess (see the first recess 34, see FIG. 1), and the quartz resonator element 10 is mounted on the first main surface 33. Terminals 34b and 34c are provided.

In the crystal resonator 2, the first main surface 33 side of the package base 131 is hermetically sealed by a lid 132 as a lid that covers the crystal resonator element 10. The lid 132 is made of a metal such as Kovar, 42 alloy, stainless steel or the like, and is formed in a cap shape having a collar portion 132a provided on the entire circumference.
In the crystal resonator 2, an internal space in which the crystal resonator element 10 can vibrate is secured by the swelling of the cap portion of the lid 132.
The lid 132 is joined to the first main surface 33 of the package base 131 via a joining member 38 using a conductive material such as a seam ring, a brazing material, and a conductive adhesive.
In the crystal resonator 2, the internal space is in a reduced vacuum state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon, as in the first embodiment. .

As described above, in the crystal resonator 2, the first main surface 33 of the package base 131 is a flat surface without a recess, and the internal terminals 34 b and 34 c on which the crystal resonator element 10 is mounted are formed on the first main surface 33. Is provided. Thereby, since the crystal unit 2 can reduce the number of layers on which the package base 131 is stacked, the number of parts and the number of manufacturing steps of the package base 131 can be reduced as compared with the first embodiment. .
Note that. The configuration using the cap-shaped lid can be applied to the following modifications.

(Modification 2)
FIG. 3 is a schematic diagram showing a schematic configuration of the crystal resonator of the second modification. 3A is a plan view seen from the lid side, FIG. 3B is a cross-sectional view taken along line AA in FIG. 3A, and FIG. It is the top view seen from. In FIG. 3A, some wirings are omitted in order to avoid complexity.
Also, common parts with the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and description will be made centering on parts different from the first embodiment.

As shown in FIG. 3, the crystal resonator 3 of Modification 2 is different from the first embodiment in the layer configuration and wiring configuration of the package base 231 of the package 230.
The package base 231 has a rectangular frame-shaped first layer 231a, a flat plate-like second layer 231b, a flat plate-like third layer 231c, and a rectangular through hole formed in a substantially central portion in this order from the lid 32 side. The four layers 231d are stacked.
The first wiring 50a, 50b is provided on the bottom surface 34a facing the lid 32 side of the second layer 231b, which is the first main surface 33 side of the package base 231, and is opposite to the first main surface 33 side. Second wirings 51a and 51b are provided on the bottom surface 36a of the third layer 231c on the second main surface 35 side.

3C between the second layer 231b provided with the first wirings 50a and 50b of the package base 231 and the third layer 231c provided with the second wirings 51a and 51b (intermediate layer). As shown, the solid wiring 52 (indicated by broken line hatching, also referred to as shield wiring) that is electrically connected to the electrode terminal 37c, which is a ground terminal, via the conductive via 36d is at least the second wiring 51a in plan view. , 51b so as to overlap.
The solid wiring 52 is provided so as not to overlap at least the first wirings 50a and 50b in plan view. Further, the solid wiring 52 is preferably provided so as not to overlap the internal terminals 34b and 34c and the electrode terminals 37b and 37d in addition to the first wirings 50a and 50b in a plan view.

As described above, the crystal unit 3 is provided between the second layer 231b provided with the first wirings 50a and 50b of the package base 231 and the third layer 231c provided with the second wirings 51a and 51b (intermediate). In the layer), a solid wiring 52 electrically connected to the electrode terminal 37c is provided so as to overlap at least the second wirings 51a and 51b in a plan view.
Thereby, since the second wirings 51a and 51b are shielded by the solid wiring 52, the oscillation signal of the crystal vibrating piece 10 flowing through the first wirings 50a and 50b is transmitted to the crystal resonator 3 by the second wirings 51a and 51b. It is further difficult to be superimposed on the detection signal of the thermistor 20 flowing through 51b.

The crystal unit 3 is provided so that the solid wiring 52 does not overlap at least the first wirings 50a and 50b in plan view, and in addition, does not overlap the internal terminals 34b and 34c and the electrode terminals 37b and 37d. It has been. From this, the crystal resonator 3 receives the solid wiring 52, the first wirings 50a and 50b, the internal terminals 34b and 34c, and the electrode terminals 37b and 37d from the oscillation signal of the crystal vibrating piece 10 flowing through the first wirings 50a and 50b. It is possible to avoid the addition of stray capacitance (parasitic capacitance, electrostatic capacitance).
As a result, the crystal resonator 3 can avoid a decrease in sensitivity of the crystal resonator element 10 (a reduction in the frequency adjustment range).
In addition, the structure which provides a solid wiring (shield wiring) between these layers is applicable also to another modification.

(Modification 3)
FIG. 4 is a schematic diagram showing a schematic configuration of the crystal resonator of the third modification. 4A is a plan view seen from the lid side, FIG. 4B is a cross-sectional view taken along line AA in FIG. 4A, and FIG. It is the top view seen from.
Also, common parts with the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and description will be made centering on parts different from the first embodiment.

As shown in FIG. 4, the crystal resonator 4 of Modification 3 is different from the first embodiment in the configuration of the electrode terminals.
In the crystal unit 4, in addition to the electrode terminals 37a to 37d provided on the package base 331 of the package 330, an electrode terminal 37e is provided between the electrode terminal 37b and the electrode terminal 37c. The electrode terminal 37c is electrically connected to the lid 32 as a first ground terminal, and the electrode terminal 37e is electrically connected to the ground-side electrode 22 among the electrodes 21 and 22 of the thermistor 20 as a second ground terminal. Has been.

According to this, since the crystal resonator 4 has the electrode terminal 37c electrically connected to the lid 32 and the electrode terminal 37e electrically connected to the ground-side electrode 22 of the thermistor 20, the ground terminal By separating (dividing), for example, it is possible to avoid the AC component noise on the lid 32 side from being superimposed on the thermistor 20 side via the common ground terminal as in the first embodiment.
In the crystal resonator 4, the electrode terminal 37c may be electrically connected to the ground-side electrode 22 of the thermistor 20, and the electrode terminal 37e may be electrically connected to the lid 32 through the conductive via 36d. (The connection destination of the electrode terminal 37c and the electrode terminal 37e may be reversed).

(Modification 4)
FIG. 5 is a schematic diagram illustrating a schematic configuration of a crystal resonator according to a fourth modification. 5A is a plan view seen from the lid side, FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A, and FIG. It is the top view seen from. In FIG. 5A, some wirings are omitted in order to avoid complexity.
Also, common parts with the first embodiment are denoted by the same reference numerals, detailed description thereof will be omitted, and description will be made centering on parts different from the first embodiment.

As shown in FIG. 5, the crystal resonator 5 of Modification 4 has a configuration in which Modification 2 and Modification 3 are combined.
Specifically, the crystal resonator 5 includes a solid wiring 52 electrically connected to the electrode terminal 37c between the second layer 231b and the third layer 231c of the package base 431 of the package 430 in a plan view. At least the second wirings 51a and 51b are provided so as to overlap. In addition, the crystal resonator 5 is provided with an electrode terminal 37 e between the electrode terminal 37 b and the electrode terminal 37 c on the second main surface 35 of the fourth layer 231 d of the package base 431.
Here, the electrode terminal 37c is electrically connected to the lid 32 as a first ground terminal, and the electrode terminal 37e is electrically connected to the ground-side electrode 22 of the electrodes 21 and 22 of the thermistor 20 as a second ground terminal. The solid wiring 52 is electrically connected to the electrode terminal 37c through the conductive via 36d.

As described above, in the crystal unit 5, the second wirings 51 a and 51 b are shielded by the solid wiring 52, and the electrode terminal 37 e is electrically connected to the ground-side electrode 22 of the thermistor 20.
Therefore, in the crystal resonator 5, the oscillation signal of the crystal vibrating piece 10 that flows through the first wirings 50a and 50b by the solid wiring 52 is more difficult to be superimposed on the detection signal of the thermistor 20 that flows through the second wirings 51a and 51b. In addition to the effect of the second modification example, the third modification example allows the AC component noise on the lid 32 side to be prevented from being superimposed on the thermistor 20 side through the common ground terminal by separating the ground terminal. It is possible to achieve the effects of the above.

In the crystal resonator 5, the electrode terminal 37c may be electrically connected to the ground-side electrode 22 of the thermistor 20, and the electrode terminal 37e may be electrically connected to the lid 32 through the conduction via 36d. (The connection destination of the electrode terminal 37c and the electrode terminal 37e may be reversed).
As described above, the above modifications can be combined with each other.

(Second Embodiment)
Next, a crystal resonator according to a second embodiment will be described.
FIG. 6 is a schematic diagram illustrating a schematic configuration of the crystal resonator according to the second embodiment. 6A is a plan view seen from the lid side, FIG. 6B is a cross-sectional view taken along line AA in FIG. 6A, and FIG. 6C is a bottom side. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 1st Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 1st Embodiment.

As shown in FIG. 6, the crystal resonator 101 of the second embodiment differs in the mounting location of the thermistor 20 compared to the first embodiment.
In the crystal resonator 101, the thermistor 20 is mounted in the first recess 34 of the package base 531 of the package 530 together with the crystal resonator element 10. More specifically, in the thermistor 20, the direction (longitudinal direction) connecting the electrode 21 and the electrode 22 to the space near the tip of the crystal vibrating piece 10 in the first recess 34 is the longitudinal direction of the package base 531 (left-right direction on the paper surface). ) And crossing (orthogonal).
With this configuration, the crystal unit 101 has the second recess 36 (see FIG. 1) removed from the package base 531.

  Since the crystal resonator element 10 and the thermistor 20 are both mounted on the bottom surface 34a of the first recess 34, the crystal resonator 101 includes both the first wirings 50a and 50b and the second wirings 51a and 51b. 1 is provided on the main surface 33 side (bottom surface 34a). The crystal unit 101 is inevitably provided so that the first wirings 50a and 50b do not overlap the second wirings 51a and 51b in plan view.

  According to this, the crystal resonator 101 does not require the second recess 36 in the package base 531, and can further reduce the thickness of the package base 531, so that the same effects as those of the first embodiment can be achieved while the first embodiment is effective. In comparison, the total thickness of the package 530 can be reduced.

Next, a modification of the second embodiment will be described.
(Modification 1)
FIG. 7 is a schematic diagram illustrating a schematic configuration of the crystal resonator of the first modification. 7A is a plan view seen from the lid side, FIG. 7B is a cross-sectional view taken along line AA in FIG. 7A, and FIG. It is the top view seen from.
In addition, the same code | symbol is attached | subjected to a common part with 2nd Embodiment, detailed description is abbreviate | omitted, and it demonstrates centering on a different part from 2nd Embodiment.

As shown in FIG. 7, the crystal resonator 102 of the first modification is different from the second embodiment in the configuration on the first main surface 33 side of the package base 631 of the package 630.
In the crystal resonator 102, the first main surface 33 of the package base 631 is a flat surface having no recess (see the first recess 34, see FIG. 6), and the quartz resonator element 10 is mounted on the first main surface 33. Electrode pads 36b and 36c for mounting the terminals 34b and 34c and the thermistor 20 are provided.

In the crystal resonator 102, the first main surface 33 side of the package base 631 is hermetically sealed by a lid 632 as a lid that covers the crystal resonator element 10. The lid 632 is made of a metal such as Kovar, 42 alloy, stainless steel or the like, and is formed in a cap shape having a collar portion 632a provided on the entire circumference.
In the crystal resonator 102, an internal space in which the crystal vibrating piece 10 can vibrate is secured by the swelling of the cap portion of the lid 632.
The lid 632 has a collar portion 632a bonded to the first main surface 33 of the package base 631 via a bonding member 38 using a conductive material such as a seam ring, a brazing material, and a conductive adhesive.
In the crystal unit 102, the internal space is in a reduced vacuum state (high vacuum state) or in a state filled with an inert gas such as nitrogen, helium, or argon, as in the second embodiment. .

As described above, in the crystal resonator 102, the first main surface 33 of the package base 631 is a flat surface without a recess, and the internal terminals 34b and 34c for mounting the crystal resonator element 10 on the first main surface 33 and Electrode pads 36b and 36c for mounting the thermistor 20 are provided.
Thereby, the crystal unit 102 can increase the number of layers on which the package base 631 is stacked, for example, so that the number of parts and the number of manufacturing steps of the package base 631 can be reduced as compared with the second embodiment. Can be reduced.
In addition, the structure using this cap-shaped lid is applicable also to the following modifications.

(Modification 2)
FIG. 8 is a schematic diagram showing a schematic configuration of the crystal resonator of the second modification. 8A is a plan view seen from the lid side, FIG. 8B is a cross-sectional view taken along line AA in FIG. 8A, and FIG. 8C is a bottom side. It is the top view seen from. In FIG. 8A, some wiring is omitted in order to avoid complexity.
Also, common parts with the second embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and description will be made centering on parts different from the second embodiment.

As shown in FIG. 8, the crystal resonator 103 of Modification 2 is different in the layer configuration and wiring configuration of the package base 731 of the package 730 from the second embodiment.
The package base 731 has a structure in which three layers of a rectangular frame-shaped first layer 731a, a flat plate-like second layer 731b, and a flat plate-like third layer 731c are stacked in this order from the lid 32 side.
The first wirings 50a and 50b and the second wirings 51a and 51b are provided on the bottom surface 34a facing the lid 32 side of the second layer 731b, which is the first main surface 33 side of the package base 731. In addition, electrode terminals 37 a to 37 d are provided on the outer bottom surface (second main surface 35) of the third layer 731 c on the second main surface 35 side of the package base 731.

Between the second layer 731b and the third layer 731c of the package base 731, as shown in FIG. 8C, the electrode terminal 37c, which is a ground terminal, and the conductive via 36d are electrically connected. The solid wiring 52 (indicated by broken line hatching) is provided so as to overlap at least the second wirings 51a and 51b in plan view.
The solid wiring 52 is provided so as not to overlap at least the first wirings 50a and 50b in plan view. Further, the solid wiring 52 is preferably provided so as not to overlap the internal terminals 34b and 34c and the electrode terminals 37b and 37d in addition to the first wirings 50a and 50b in a plan view.

As described above, the crystal unit 103 is provided with the first wirings 50a and 50b and the second wirings 51a and 51b on the first main surface 33 side of the package base 731, and the second layer 731b and the third layer 731c. A solid wiring 52 electrically connected to the electrode terminal 37c is provided so as to overlap at least the second wirings 51a and 51b in plan view.
Thereby, since the 2nd wiring 51a, 51b is shielded by the lid 32 and the solid wiring 52, the crystal resonator 103 can further improve the shielding performance with respect to external noise or static electricity, for example. .

The crystal resonator 103 is provided so that the solid wiring 52 does not overlap at least the first wirings 50a and 50b in plan view, and in addition, does not overlap the internal terminals 34b and 34c and the electrode terminals 37b and 37d. It has been. From this, the quartz crystal vibrator 103 receives the solid wiring 52, the first wirings 50a, 50b, the internal terminals 34b, 34c, and the electrode terminals 37b, 37d from the oscillation signal of the crystal vibrating piece 10 flowing through the first wirings 50a, 50b. It is possible to avoid the addition of stray capacitance (parasitic capacitance, electrostatic capacitance).
As a result, the crystal resonator 103 can avoid a decrease in sensitivity of the crystal resonator element 10 (a reduction in the frequency adjustment range).
In addition, the structure which provides a solid wiring between this layer is applicable also to another modification.

(Modification 3)
FIG. 9 is a schematic diagram showing a schematic configuration of the crystal resonator of the third modification. 9A is a plan view seen from the lid side, FIG. 9B is a cross-sectional view taken along line AA of FIG. 9A, and FIG. 9C is a bottom side. It is the top view seen from.
Also, common parts with the second embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and description will be made centering on parts different from the second embodiment.

As shown in FIG. 9, the crystal resonator 104 of Modification 3 is different from the second embodiment in the configuration of the electrode terminals.
In the crystal resonator 104, in addition to the electrode terminals 37a to 37d provided on the package base 831 of the package 830, an electrode terminal 37e is provided between the electrode terminal 37b and the electrode terminal 37c. The electrode terminal 37c is electrically connected to the lid 32 as a first ground terminal, and the electrode terminal 37e is electrically connected to the ground-side electrode 22 among the electrodes 21 and 22 of the thermistor 20 as a second ground terminal. Has been.

According to this, since the crystal resonator 104 has the electrode terminal 37c electrically connected to the lid 32 and the electrode terminal 37e electrically connected to the ground-side electrode 22 of the thermistor 20, the ground terminal For example, the separation of the AC component noise on the lid 32 side through the shared ground terminal as in the second embodiment can be avoided from being superimposed on the thermistor 20 side.
In the crystal resonator 104, the electrode terminal 37c may be electrically connected to the ground-side electrode 22 of the thermistor 20, and the electrode terminal 37e may be electrically connected to the lid 32 through the conduction via 36d. (The connection destination of the electrode terminal 37c and the electrode terminal 37e may be reversed).

(Modification 4)
FIG. 10 is a schematic diagram illustrating a schematic configuration of a crystal resonator according to the fourth modification. 10A is a plan view seen from the lid side, FIG. 10B is a cross-sectional view taken along line AA in FIG. 10A, and FIG. It is the top view seen from. In FIG. 10A, some wirings are omitted to avoid complexity.
Also, common parts with the second embodiment are denoted by the same reference numerals, detailed description thereof is omitted, and description will be made centering on parts different from the second embodiment.

As shown in FIG. 10, the crystal resonator 105 of Modification 4 has a configuration in which Modification 2 and Modification 3 are combined.
Specifically, the crystal unit 105 is electrically connected between the second layer 731b and the third layer 731c of the package base 931 of the package 930 through the electrode terminal 37c and the conductive via 36d. The wiring 52 is provided so as to overlap at least the second wirings 51a and 51b in plan view. In addition, in the crystal resonator 105, an electrode terminal 37e is provided between the electrode terminal 37b and the electrode terminal 37c on the second main surface 35 side of the third layer 731c of the package base 931.
Here, the electrode terminal 37c is electrically connected to the lid 32 as a first ground terminal, and the electrode terminal 37e is electrically connected to the ground-side electrode 22 of the electrodes 21 and 22 of the thermistor 20 as a second ground terminal. Connected.

As described above, in the crystal resonator 105, the second wirings 51a and 51b are shielded by the solid wiring 52, and the electrode terminal 37e is electrically connected to the ground-side electrode 22 of the thermistor 20.
From this, the quartz crystal resonator 105 can be further improved by the solid wiring 52, for example, the effect of the modified example 2 in which the shielding property against external noise and static electricity can be further improved. The effect of the modification 3 that it can avoid that the noise of the alternating current component by the side of the lid 32 is superimposed on the thermistor 20 side via the common grounding terminal can also be produced.

In the crystal resonator 105, the electrode terminal 37c may be electrically connected to the ground-side electrode 22 of the thermistor 20, and the electrode terminal 37e may be electrically connected to the lid 32 through the conductive via 36d. (The connection destination of the electrode terminal 37c and the electrode terminal 37e may be reversed).
As described above, the above modifications can be combined with each other.

(Third embodiment)
Next, a mobile phone will be described as an example of an electronic apparatus including a crystal resonator as an example of the above-described vibration device.
FIG. 11 is a schematic perspective view showing a mobile phone according to the third embodiment.
A mobile phone 1000 is a mobile phone including the crystal resonators of the above embodiments and modifications. A cellular phone 1000 illustrated in FIG. 11 uses the above-described crystal resonator (1, 101, etc.) as a timing device such as a reference clock oscillation source, and further includes a liquid crystal display device 1001, a plurality of operation buttons 1002, and an earpiece 1003. , And a mouthpiece 1004. The form of the mobile phone 1000 is not limited to the illustrated type, and may be a so-called smartphone type.

  The above-described vibration devices such as the crystal resonator are not limited to the above-described mobile phones, but are also electronic books, personal computers, televisions, digital still cameras, video cameras, video recorders, navigation devices, pagers, electronic notebooks, calculators, word processors. , A workstation, a videophone, a POS terminal, an electronic device that can be suitably used as a timing device such as a device equipped with a touch panel, and in any case, an electronic device that reflects the effects described in the above embodiments and modifications Can be provided.

Note that, as described above, an electronic device typified by the mobile phone 1000 has an oscillation circuit that drives the crystal resonator element 10 of the crystal resonator (1, 101, etc.) and a frequency associated with a temperature change of the crystal resonator element 10. It is preferable to include a temperature compensation circuit that corrects fluctuations.
According to this, an electronic device typified by a mobile phone 1000 or the like includes an oscillation circuit that drives the crystal vibrating piece 10 and a temperature compensation circuit that corrects a frequency variation caused by a temperature change of the crystal vibrating piece 10. Therefore, the temperature of the resonance frequency oscillated by the oscillation circuit can be compensated for, and an electronic device having excellent temperature characteristics can be provided.

The shape of the resonator element is not limited to the flat plate type shown in the figure, but the central part is thick and the peripheral part is thin (convex type, bevel type, mesa type). Conversely, the central part is thin and the peripheral part is thin. A thick type (reverse mesa type) may be used.
The material of the resonator element is not limited to quartz, but lithium tantalate (LiTaO ₃ ), lithium tetraborate (Li ₂ B ₄ O ₇ ), lithium niobate (LiNbO ₃ ), zirconate titanate A piezoelectric material such as lead acid (PZT), zinc oxide (ZnO), and aluminum nitride (AlN), or a semiconductor such as silicon (Si) may be used.
Further, the driving method of the thickness shear vibration may be electrostatic driving by Coulomb force in addition to the piezoelectric effect of the piezoelectric body.

  DESCRIPTION OF SYMBOLS 1, 2, 3, 4, 5 ... Crystal resonator as a vibration device, 10 ... Quartz vibrating piece as a vibrating piece, 11 ... Vibrating part, 12 ... Base part, 13 ... One main surface, 14 ... Other main surface 15, 16 ... excitation electrodes, 15a, 16a ... extraction electrodes, 20 ... thermistors, 21,22 ... electrodes, 30 ... packages as containers, 31 ... package bases as container bodies, 32 ... lids as lids, 33 ... 1st main surface, 34 ... 1st recessed part, 34a ... Bottom surface, 34b, 34c ... Internal terminal as a vibration piece terminal, 35 ... 2nd main surface as an outer bottom surface, 36 ... 2nd recessed part, 36a ... Bottom surface, 36b, 36c ... electrode pads as thermistor terminals, 36d ... conductive vias, 37a, 37b, 37d ... electrode terminals as external terminals, 37c ... electrode terminals as external terminals (first ground terminals), 37e ... external ends Electrode terminal as (second ground terminal), 38 ... bonding member, 40 ... conductive adhesive, 41 ... bonding member, 50a, 50b ... first wiring, 51a, 51b ... second wiring, 101, 102, 103, 104, 105 ... quartz crystal, 130 ... package, 131 ... package base, 132 ... lid, 132a ... collar, 230 ... package, 231 ... package base, 231a ... first layer, 231b ... second layer, 231c ... first 3rd layer, 231d ... 4th layer, 330 ... Package, 331 ... Package base, 430 ... Package, 431 ... Package base, 530 ... Package, 531 ... Package base, 630 ... Package, 631 ... Package base, 632 ... Lid, 632a ... collar part, 730 ... package, 731 ... package base, 731a ... Layer, 731b ... second layer, 731c ... third layer, 830 ... package, 831 ... package base, 930 ... package, 931 ... package base, 1000 ... mobile phone, 1001 ... liquid crystal display device, 1002 ... operation buttons, 1003 ... Earpiece, 1004 ... Mouthpiece.

Claims (7)

A vibrating piece,
A thermistor having a pair of electrodes;
A container containing the vibrating piece and the thermistor;
With
The container is
A container body on which the vibrating piece and the thermistor are mounted;
A lid covering at least the vibrating piece;
With
The container body is
A vibrating piece terminal to which the vibrating piece is attached;
A thermistor terminal to which the electrode of the thermistor is attached;
Multiple external terminals on the outer bottom,
Is placed,
A first wiring connecting the external terminal and the resonator element terminal,
A vibration device, wherein the second wiring that connects the other external terminal and the thermistor terminal is provided so as not to overlap in a plan view. At least one of the external terminals is a ground terminal;
The vibrating device according to claim 1, wherein the lid is electrically connected to the ground terminal.   A solid wiring connected to the ground terminal is provided in an intermediate layer provided between the first wiring and the second wiring, and the solid wiring overlaps at least the second wiring in a plan view. The vibration device according to claim 2, wherein the vibration device is provided on the vibration device. The solid wiring is
The vibration device according to claim 3, wherein the vibration device is provided so as not to overlap at least the first wiring in a plan view. The external terminal includes a first ground terminal and a second ground terminal as the ground terminal,
The first ground terminal is electrically connected to the lid;
The second ground terminal is electrically connected to the ground-side electrode among the electrodes of the thermistor,
5. The vibration device according to claim 2, wherein the solid wiring is electrically connected to the first ground terminal. 6.   An electronic apparatus comprising the vibration device according to any one of claims 1 to 5. An oscillation circuit for driving the resonator element;
A temperature compensation circuit that corrects a frequency variation associated with a temperature change of the resonator element;
The electronic apparatus according to claim 6, further comprising:

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